MASK BLANK SUBSTRATE, SUBSTRATE WITH MULTILAYER REFLECTIVE FILM, REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20230132780A1

    公开(公告)日:2023-05-04

    申请号:US17972887

    申请日:2022-10-25

    Abstract: [Problem to be Solved by the Disclosure]
    Provided is a mask blank substrate.
    [Means for Solving the Problem]
    The mask blank substrate includes two opposing main surfaces, consists of a glass material containing SiO2 and TiO2, has a first region in one main surface side, the first region is a region within a 132 mm×104 mm square including a center portion in the one main surface and which is a region extending from the one main surface toward the other main surface up to a position of 500 μm in depth, an inner region of the substrate excluding the first region has a locally non-uniform portion, a ratio of Ti content rate to Si content rate (Ti/Si) of the non-uniform portion differs from Ti/Si of the inner region excluding the non-uniform portion by 0.25% or more, and the variation of Ti content rate in the inner region of the substrate excluding the first region and the non-uniform portion is 0.06 mass % or less.

    MASK BLANK SUBSTRATE, MASK BLANK, TRANSFER MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20170248841A1

    公开(公告)日:2017-08-31

    申请号:US15593564

    申请日:2017-05-12

    Inventor: Masaru TANABE

    Abstract: Provided are a mask blank substrate which has effectively and extremely high principal surface flatness while a reduction in the manufacturing throughput of the mask blank substrate is suppressed, a mask blank, and a transfer mask. Also provided are manufacturing methods therefor. virtual reference surface that becomes an optically effective flat reference surface defined by a Zernike polynomial which is composed of only terms in which the order of a variable related to a radius is the second or lower order, and includes one or more terms in which the order of the variable related to the radius is the second order is set, and a mask blank substrate satisfying the condition that data (PV value) relating to the difference between the maximum value and the minimum value of the difference data between the reference surface and the measured shape of the mask blank substrate is one-eighth or less of an exposure wavelength (λ) is selected.

    MASK BLANK SUBSTRATE, MASK BLANK, TRANSFER MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    3.
    发明申请
    MASK BLANK SUBSTRATE, MASK BLANK, TRANSFER MASK, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    掩模空白基板,掩模布,转印掩模和制造半导体器件的方法

    公开(公告)号:US20160109797A1

    公开(公告)日:2016-04-21

    申请号:US14774267

    申请日:2014-06-19

    Inventor: Masaru TANABE

    Abstract: Provided are a mask blank substrate which has effectively and extremely high principal surface flatness while a reduction in the manufacturing throughput of the mask blank substrate is suppressed, a mask blank, and a transfer mask. Also provided are manufacturing methods therefor.A virtual reference surface that becomes an optically effective flat reference surface defined by a Zernike polynomial which is composed of only terms in which the order of a variable related to a radius is the second or lower order, and includes one or more terms in which the order of the variable related to the radius is the second order is set, and a mask blank substrate satisfying the condition that data (PV value) relating to the difference between the maximum value and the minimum value of the difference data between the reference surface and the measured shape of the mask blank substrate is one-eighth or less of an exposure wavelength (A) is selected.

    Abstract translation: 本发明提供了掩模坯料基板,其具有有效且极高的主表面平坦度,同时抑制掩模坯料基板的制造生产量的降低,掩模坯料和转印掩模。 还提供了其制造方法。 成为由泽尔尼克多项式定义的光学有效的平坦参考表面的虚拟参考表面,该Zernike多项式仅由与半径相关的变量的顺序为第二或更低阶的项组成,并且包括一个或多个项,其中 与半径相关的变量的次序设定为二次,掩模空白基板满足与基准面和基准面之间的差分数据的最大值与最小值的差有关的数据(PV值) 掩模空白基板的测量形状是选择曝光波长(A)的八分之一或更小。

    THIN FILM EVALUATION METHOD, MASK BLANK, AND TRANSFER MASK
    5.
    发明申请
    THIN FILM EVALUATION METHOD, MASK BLANK, AND TRANSFER MASK 有权
    薄膜评估方法,遮罩和转印面膜

    公开(公告)号:US20130236819A1

    公开(公告)日:2013-09-12

    申请号:US13871582

    申请日:2013-04-26

    CPC classification number: G03F1/50 G03F1/82

    Abstract: Provided is a thin film evaluation method for a transfer mask which is adapted to be applied with ArF excimer laser exposure light and comprises a thin film formed with a pattern on a transparent substrate. The method includes intermittently irradiating pulsed laser light onto the thin film to thereby evaluate the irradiation durability of the thin film.

    Abstract translation: 本发明提供一种转印掩模的薄膜评价方法,其适用于应用ArF准分子激光曝光光,并且包括在透明基板上形成有图案的薄膜。 该方法包括将脉冲激光间歇地照射到薄膜上,从而评价薄膜的照射耐久性。

    SUBSTRATE INSPECTION METHOD, SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE INSPECTION DEVICE
    8.
    发明申请
    SUBSTRATE INSPECTION METHOD, SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE INSPECTION DEVICE 审中-公开
    基板检查方法,基板制造方法和基板检查装置

    公开(公告)号:US20150030230A1

    公开(公告)日:2015-01-29

    申请号:US14306952

    申请日:2014-06-17

    Inventor: Masaru TANABE

    Abstract: A method for inspecting a substrate having a plurality of holes formed on a plate-shaped material so as to extend over front and rear surfaces thereof. The method comprises picking-up an image of a plurality of holes formed on the substrate by imaging from one surface side of the substrate and obtaining a hole image of each hole (S103). Then, specifying a reference hole image of the plurality of holes from an imaging result obtained by the image acquisition step (S105). Thereafter, a similarity between each hole image, being the imaging result obtained by the image acquisition step is quantified and the reference hole image, is obtained by pattern matching processing using a specific correlative function (S105 to S107). Finally, a proper/improper hole shape of each of the plurality of holes is judged using a quantification result of each hole image obtained by the quantification step as an index (S108).

    Abstract translation: 一种用于检查具有形成在板状材料上的多个孔以在其前表面和后表面上延伸的基板的方法。 该方法包括通过从基板的一个表面侧成像并获得每个孔的孔图像来拾取形成在基板上的多个孔的图像(S103)。 然后,根据通过图像获取步骤获得的成像结果来指定多个孔的参考孔图像(S105)。 此后,通过图像获取步骤获得的成像结果的每个孔图像之间的相似度被量化,并且通过使用特定相关函数的图案匹配处理来获得参考孔图像(S105至S107)。 最后,使用通过量化步骤获得的每个孔图像的定量结果作为索引来判断多个孔中的每一个孔的适当/不正确的孔形状(S108)。

    SUBSTRATE INSPECTION METHOD, SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE INSPECTION DEVICE
    9.
    发明申请
    SUBSTRATE INSPECTION METHOD, SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE INSPECTION DEVICE 审中-公开
    基板检查方法,基板制造方法和基板检查装置

    公开(公告)号:US20150029324A1

    公开(公告)日:2015-01-29

    申请号:US14337520

    申请日:2014-07-22

    Inventor: Masaru TANABE

    Abstract: There is provided a substrate inspection method for inspecting a substrate having a plurality of holes formed on a plate-shaped material, including: an image acquisition step (S103) of picking-up an image of the holes formed on the substrate via an optical system including a microscope having an objective lens of a specific magnification, from one surface side of the substrate; a super resolution image processing step (S104) of obtaining a super resolution image corresponding to a picked-up image via an optical system including a microscope having an objective lens of higher magnification than the specific magnification, by applying super resolution image processing to the image obtained in the image acquisition step (S103); and an inspection step (S108) of inspecting a proper or improper hole formed on the substrate using the super resolution image obtained in the super resolution image processing step (S104).

    Abstract translation: 提供了一种用于检查形成在板状材料上的具有多个孔的基板的基板检查方法,包括:图像获取步骤(S103),其通过光学系统拍摄形成在基板上的孔的图像 包括具有特定放大倍数的物镜的显微镜,从所述基板的一个表面侧; 超分辨率图像处理步骤(S104),通过对包含具有比特定倍率高的倍率的物镜的显微镜的光学系统获得与拾取图像相对应的超分辨率图像,通过对图像应用超分辨率图像处理 在图像获取步骤(S103)中获得; 以及使用超分辨率图像处理步骤(S104)中获得的超分辨率图像来检查形成在基板上的适当或不正确的孔的检查步骤(S108)。

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