ION MILLING DEVICE
    1.
    发明申请
    ION MILLING DEVICE 审中-公开

    公开(公告)号:US20180301318A1

    公开(公告)日:2018-10-18

    申请号:US16012423

    申请日:2018-06-19

    Abstract: An ion milling device of the present invention is provided with a tilt stage (8) which is disposed in a vacuum chamber (15) and has a tilt axis parallel to a first axis orthogonal to an ion beam, a drive mechanism (9, 51) which has a rotation axis and a tilt axis parallel to a second axis orthogonal to the first axis and rotates or tilts a sample (3), and a switching unit which enables switching between a state in which the ion beam is applied while the sample is rotated or swung while the tilt stage is tilted, and a state in which the ion beams is applied while the tilt stage is brought into an untilted state and the sample is swung. Consequently, the ion milling device capable of performing cross-section processing and flat processing of the sample in the same vacuum chamber is implemented.

    Ion Milling Device and Processing Method Using the Ion Milling Device
    2.
    发明申请
    Ion Milling Device and Processing Method Using the Ion Milling Device 审中-公开
    离子铣削装置及使用离子铣削装置的加工方法

    公开(公告)号:US20160155602A1

    公开(公告)日:2016-06-02

    申请号:US14901506

    申请日:2014-07-11

    Abstract: This ion milling device is provided with a vacuum chamber (105), an exhaust device (101) for evacuating the interior of the vacuum chamber, a sample stage (103) for supporting a sample (102) to be irradiated inside the vacuum chamber, a heater (107) for heating the interior of the vacuum chamber, a gas source (106) for introducing into the vacuum chamber a gas serving as a heating medium, and a controller (110) for controlling the gas source, the controller controlling the gas source so that the vacuum chamber internal pressure is in a predetermined state during heating by the heater. This enables the control in a short time of the temperature for suppressing condensation, or the like, occurring at atmospheric release after cooling and ion milling a sample.

    Abstract translation: 该离子研磨装置设置有真空室(105),用于抽空真空室内部的排气装置(101),用于支撑在真空室内照射的样品(102)的样品台(103) 用于加热真空室内部的加热器(107),用于将作为加热介质的气体引入真空室的气源(106),以及用于控制气源的控制器(110),控制器 气体源,使得真空室内部压力在加热器加热期间处于预定状态。 这使得能够在短时间内控制在冷却和离子研磨样品之后在大气释放下发生的冷凝等的抑制。

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