公开(公告)号：US20160208725A1

公开(公告)日：2016-07-21

申请号：US15023560

申请日：2014-06-13

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Takao FUKUDA ,  Hideyuki SAKAMOTO ,  Masahiro TOYOHARA ,  Yoshihisa FUJII ,  Osamu MUKAIHARA ,  Mitsuhiko WATANABE ,  Takeshi KONNO

IPC: F02D41/20

CPC classification number: F02D41/20 ,  F02D2041/2013 ,  F02D2041/2048 ,  F02D2041/2051 ,  F02D2041/2058

Abstract: An internal-combustion-engine fuel injection control device which can accurately control a boosted voltage applied to a fuel injection valve during fuel injection and can control a variation in a fuel injection amount without increasing a size or a cost of the fuel injection control device even when a width of a fuel injection driving pulse to drive the fuel injection valve is small is provided. A fuel injection control device includes a boosting operation control unit configured to start a boosting operation at predetermined timing regardless of an amount of a detected voltage when the detected voltage is higher than a threshold voltage for starting boosting and is lower than a threshold voltage for stopping boosting.

Abstract translation: 一种能够精确地控制在燃料喷射期间施加到燃料喷射阀的升压电压的内燃机燃料喷射控制装置，并且能够在不增加燃料喷射控制装置的尺寸或成本的同时控制燃料喷射量的变化，甚至 当提供驱动燃料喷射阀的燃料喷射驱动脉冲的宽度小时。 一种燃料喷射控制装置，包括：升压运转控制单元，被配置为，当检测电压高于用于启动升压的阈值电压时，与预定电压的量无关地在预定定时开始升压运行，并且低于用于停止的阈值电压 提升。

公开(公告)号：US20210359579A1

公开(公告)日：2021-11-18

申请号：US17273603

申请日：2019-07-29

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Tomohiro FUKUDA ,  Shin ONOSE ,  Takeshi KONNO ,  Yasuhiro SHIMADA ,  Kenichi NAKAYAMA ,  Hisaya SHIMIZU ,  Mitsue HASHIMOTO

IPC: H02K15/00 ,  H02K15/02 ,  H02K3/38 ,  H02K3/50 ,  H02K1/16 ,  H02K3/28 ,  H02K15/10 ,  H02K3/12 ,  H02K3/48 ,  H02K3/02

Abstract: An object of the present invention is to provide a stator of a rotary electric machine of which miniaturization, high output, and cost reduction are balanced at a higher level than the related art, and a rotary electric machine including the stator. Provided is a stator of a rotary electric machine in which a stator coil is wound around a stator core. The stator coil includes a welding portion of segment conductors formed in a region of an end portion of the stator coil; each of the segment conductors includes an exposed conductor wire portion in which an insulating coating formed on an outer periphery of a conductor wire is removed in a vicinity of the welding portion; the exposed conductor wire portion on at least one side of a pair of the segment conductors forming the each welding portion includes, in a longitudinal direction of the conductor wire, a root portion adjacent to the insulating coating, a transition portion for offsetting a center axis of the conductor wire in a radial direction by a predetermined amount of displacement; a bonding portion offset in a radial direction with respect to the root portion by a predetermined amount of displacement and a boundary portion between the root portion and the transition portion and a boundary portion between the transition portion and the bonding portion have pressing marks; and the predetermined amount of displacement is “1±0.4” times or “2±0.4” times a thickness of the insulating coating.

公开(公告)号：US20200258823A1

公开(公告)日：2020-08-13

申请号：US16643065

申请日：2018-07-09

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Takashi KUBOKI ,  Keiji KAWAHARA ,  Takeshi KONNO

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: An object of the invention is to improve productivity while suppressing a reduction in a heat radiating performance of a power semiconductor device.According to the invention, there is provided a manufacturing method of a power semiconductor device which includes a conductive member having a first surface and a second surface provided on a side opposite to the first surface and a power semiconductor element which is connected to the conductive member through a bonding material. The method includes a first procedure in which part of the first surface is pressed to form a concave portion leaving a portion flush with the first surface, and the conductive member is pressed to form a convex portion in the second surface, a second procedure in which the power semiconductor device is disposed in a top of the convex portion to face the concave portion of the first surface and a portion where the concave portion not formed, and the convex portion and the power semiconductor element are connected through the bonding material, and a third procedure in which at least the concave portion is filled with a sealing material.

公开(公告)号：US20180274999A1

公开(公告)日：2018-09-27

申请号：US15764631

申请日：2016-08-03

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Takeshi KONNO ,  Hiroshi KIKUCHI ,  Kentarou MIYAJIMA ,  Munenori DEGAWA

IPC: G01L9/00

Abstract: To provide a high-performance semiconductor sensor device and a method for manufacturing the semiconductor sensor device. This semiconductor sensor device has a sensor chip, and a first thin film formed on the sensor chip, said sensor chip being mechanically connected, via the first thin film, to a second thin film formed on a base formed of a polycrystalline material.

公开(公告)号：US20190294134A1

公开(公告)日：2019-09-26

申请号：US16464675

申请日：2017-10-24

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Katsuya OYAMA ,  Mitsuhiko WATANABE ,  Takeshi KONNO ,  Yasushi SUGIYAMA ,  Chihiro SATO

IPC: G05B19/042 ,  H03K17/08 ,  H03K17/687 ,  B60R16/023

Abstract: The present disclosure provides a control device having versatility and extensibility of a load driving circuit. A control device includes a processor and an IC, in which the IC includes: a communication circuit that transmits a control signal from the processor; a first drive circuit that drives a first load; a second drive circuit that drives a second load and is provided outside the IC separately from the first drive circuit; and a third drive circuit that controls the second drive circuit, the processor transmits channel information corresponding to the number of switches of the second drive circuit to the IC, and the communication circuit changes the number of channels of the third drive circuit on the basis of the channel information.