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公开(公告)号：US11315237B2
公开(公告)日：2022-04-26
申请号：US14952067
申请日：2015-11-25
Applicant: Hermes Microvision, Inc.
Inventor： Wei Fang
IPC: G06T7/00 , G06T7/30 , G01N23/2251
Abstract: An image is obtained by using a charged particle beam, and a design layout information is generated to select patterns of interest. Grey levels among patterns can be compared with each other to identify abnormal, or grey levels within one pattern can be compared to a determined threshold grey level to identify abnormal.
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公开(公告)号：US10380731B1
公开(公告)日：2019-08-13
申请号：US14697066
申请日：2015-04-27
Applicant: Hermes Microvision Inc.
IPC: H01J37/28 , G06T7/00 , H01J37/22 , G01N23/2251
Abstract: A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.
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公开(公告)号：US09953803B2
公开(公告)日：2018-04-24
申请号：US15049524
申请日：2016-02-22
Applicant: Hermes Microvision Inc.
CPC classification number: H01J37/20 , H01J37/06 , H01J37/222 , H01J37/3045 , H01J2237/202 , H01J2237/2826 , H01L22/12
Abstract: A calibration method for calibrating the position error in the point of interest induced from the stage of the defect inspection tool is achieved by controlling the deflectors directly. The position error in the point of interest is obtained from the design layout database.
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公开(公告)号：US09965844B1
公开(公告)日：2018-05-08
申请号：US15250184
申请日：2016-08-29
Applicant: Hermes Microvision, Inc.
Inventor： Wei Fang , Zhao-Li Zhang , Jack Jau
CPC classification number: G06T7/0004 , G06K9/4671 , G06T2207/10061 , G06T2207/30148
Abstract: An inspection method includes the following steps: identifying a plurality of patterns within an image; and comparing the plurality of patterns with each other for measurement values thereof. The above-mentioned inspection method uses the pattern within the image as a basis for comparison; therefore, measurement values of the plurality of pixels constructing the pattern can be processed with statistical methods and then compared, and the false rate caused by variation of a few pixels is decreased significantly. An inspection system implementing the above-mentioned method is also disclosed.
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公开(公告)号：US09541824B1
公开(公告)日：2017-01-10
申请号：US14268213
申请日：2014-05-02
Applicant: HERMES MICROVISION, INC.
IPC: G03F1/84 , G06T7/00 , G01N23/225 , H05K1/00 , G03F1/00 , G01N21/956
CPC classification number: G03F1/84 , G01N21/9501 , G01N21/95607 , G01N23/2251 , G03F1/144 , G03F1/86 , G03F7/7065 , G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/30141 , G06T2207/30148 , H05K1/00
Abstract: A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.
Abstract translation: 用于检查缺陷的方法和系统将扫描的原始数据保存为原始图像，从而节省重复扫描的时间，并通过使用相同的方式检查原始图像中的可疑缺陷和其他感兴趣的区域，从而实现更快的缺陷检查和降低错误率 不同的图像处理算法具有相同或不同的参数。
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Patent Agency Ranking
公开(公告)号：US20160247660A1
公开(公告)日：2016-08-25
申请号：US15049524
申请日：2016-02-22
Applicant: Hermes Microvision Inc.
CPC classification number: H01J37/20 , H01J37/06 , H01J37/222 , H01J37/3045 , H01J2237/202 , H01J2237/2826 , H01L22/12
Abstract: A calibration method for calibrating the position error in the point of interest induced from the stage of the defect inspection tool is achieved by controlling the deflectors directly. The position error in the point of interest is obtained from the design layout database.
Abstract translation: 通过直接控制偏转器来实现校准从缺陷检查工具的阶段引起的感兴趣点的位置误差的校准方法。 感兴趣点的位置误差是从设计布局数据库获得的。
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公开(公告)号：US09041795B2
公开(公告)日：2015-05-26
申请号：US13785222
申请日：2013-03-05
Applicant: HERMES MICROVISION INC.
CPC classification number: H04N7/18 , G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/20016 , G06T2207/30148 , H04N7/183
Abstract: A method for measuring critical dimension (CD) includes steps of: scanning at least one area of interest of a die to obtain at least one scanned image; aligning the scanned image to at least one designed layout pattern to identify a plurality of borders within the scanned image; and averaging distances each measured from the border or the plurality of borders of a pattern associated with a specific type of CD corresponding to the designed layout pattern to obtain a value of CD of the die. The value of critical dimensions of dies can be obtained from the scanned image with lower resolution which is obtained by relatively higher scanning speed, so the above-mentioned method can obtain value of CD for every die within entire wafer to monitor the uniformity of the semiconductor manufacturing process within an acceptable inspection time.
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公开(公告)号：US09282293B2
公开(公告)日：2016-03-08
申请号：US13785240
申请日：2013-03-05
Applicant: HERMES MICROVISION INC.
CPC classification number: H04N7/18 , G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/20016 , G06T2207/30148 , H04N7/183
Abstract: A method for measuring critical dimension (CD) includes steps of: scanning at least one area of interest of a die to obtain at least one scanned image; aligning the scanned image to at least one designed layout pattern to identify a plurality of borders within the scanned image; and averaging distances each measured from the border or the plurality of borders of a pattern associated with a specific type of CD corresponding to the designed layout pattern to obtain a value of CD of the die. The value of critical dimensions of dies can be obtained from the scanned image with lower resolution which is obtained by relatively higher scanning speed, so the above-mentioned method can obtain value of CD for every die within entire wafer to monitor the uniformity of the semiconductor manufacturing process within an acceptable inspection time.
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公开(公告)号：US10102619B1
公开(公告)日：2018-10-16
申请号：US14738791
申请日：2015-06-12
Applicant: Hermes Microvision Inc.
Inventor： Wei Fang , Zhao-Li Zhang , Jack Jau
Abstract: An inspection method includes the following steps: identifying a plurality of patterns within an image; and comparing the plurality of patterns with each other for measurement values thereof. The above-mentioned inspection method uses the pattern within the image as a basis for comparison; therefore, measurement values of the plurality of pixels constructing the pattern can be processed with statistical methods and then compared, and the false rate caused by variation of a few pixels is decreased significantly. An inspection system implementing the above-mentioned method is also disclosed.
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公开(公告)号：US20160314572A1
公开(公告)日：2016-10-27
申请号：US14952067
申请日：2015-11-25
Applicant: Hermes Microvision, Inc.
Inventor： Wei Fang
CPC classification number: G06T7/001 , G01N23/2251 , G01N2223/401 , G01N2223/418 , G01N2223/6116 , G01N2223/6466 , G06T7/30 , G06T2207/10061 , G06T2207/30148
Abstract: An image is obtained by using a charged particle beam, and a design layout information is generated to select patterns of interest. Grey levels among patterns can be compared with each other to identify abnormal, or grey levels within one pattern can be compared to a determined threshold grey level to identify abnormal.
Abstract translation: 通过使用带电粒子束获得图像，并且生成设计布局信息以选择感兴趣的图案。 模式之间的灰度级可以相互比较来识别异常，或者将一个模式内的灰度级别与确定的阈值灰度级进行比较以识别异常。
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