公开(公告)号：US20130335183A1

公开(公告)日：2013-12-19

申请号：US13972286

申请日：2013-08-21

申请人： Harris Corporation

发明人： MICHAEL RAYMOND WEATHERSPOON ,  LOUIS JOSEPH RENDEK, JR. ,  LAWRENCE WAYNE SHACKLETTE ,  ROBERT PATRICK MALONEY ,  DAVID M. SMITH

IPC分类号： H01F27/28

CPC分类号： H01F27/2804 ,  H01F5/00 ,  H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01F2017/0073 ,  H05K1/165 ,  H05K3/146 ,  H05K3/16 ,  H05K3/20 ,  H05K2201/0141 ,  H05K2201/0305 ,  H05K2201/1003 ,  H05K2203/016 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

摘要： A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

公开(公告)号：US20160006100A1

公开(公告)日：2016-01-07

申请号：US14857943

申请日：2015-09-18

申请人： HARRIS CORPORATION

发明人： MICHAEL RAYMOND WEATHERSPOON ,  LOUIS JOSEPH RENDEK, JR. ,  LAWRENCE WAYNE SHACKLETTE ,  ROBERT PATRICK MALONEY ,  DAVID M. SMITH

IPC分类号： H01P3/12

CPC分类号： H01P3/121 ,  H01L21/4846 ,  H01L23/498 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2203/016 ,  H05K2203/308 ,  H01L2924/00

摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.