公开(公告)号：US20230207507A1

公开(公告)日：2023-06-29

申请号：US18177876

申请日：2023-03-03

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Bob Benjamin Buckley

IPC: H01L23/00 ,  G06N10/00 ,  H01L25/16

CPC classification number: H01L24/13 ,  H01L24/81 ,  G06N10/00 ,  H01L25/16 ,  H01L2924/04941 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13144 ,  H01L2224/13179 ,  H01L2224/13147 ,  H01L2224/13117 ,  H01L2224/13139 ,  H01L2224/13109 ,  H01L2224/13105 ,  H01L2224/1357 ,  H01L2224/13666 ,  H01L2224/8112 ,  H01L2224/81203 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01041 ,  H01L2924/01029 ,  H01L2924/01048 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01031

Abstract: A quantum computing system can include a first substrate including one or more quantum control devices. The quantum computing system can include a second substrate including one or more quantum circuit elements. The quantum computing system can include one or more tin contact bonds formed on the first substrate and the second substrate. The tin contact bonds can bond the first substrate to the second substrate. The tin contact bonds can be or can include tin, such as a tin alloy.

公开(公告)号：US20240194661A1

公开(公告)日：2024-06-13

申请号：US18080729

申请日：2022-12-13

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Michael C. Hamilton ,  Marissa Giustina ,  Brian James Burkett ,  Theodore Charles White ,  Ofer Naaman

IPC: H01L25/00 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L24/81 ,  H01L24/13 ,  H01L2224/13109 ,  H01L2224/81815

Abstract: A method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. The circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. The method includes removing the sacrificial material.

公开(公告)号：US20240194532A1

公开(公告)日：2024-06-13

申请号：US18080715

申请日：2022-12-13

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Michael C. Hamilton ,  Marissa Giustina ,  Brian James Burkett ,  Theodore Charles White ,  Ofer Naaman

IPC: H01L21/822 ,  H01L21/02 ,  H01L21/311 ,  H01L21/768 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L21/8221 ,  H01L21/02505 ,  H01L21/02598 ,  H01L21/31127 ,  H01L21/7688 ,  H01L24/16 ,  H01L24/29 ,  H01L25/074 ,  B82Y10/00

Abstract: A method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. The circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. The method includes removing the sacrificial material.

公开(公告)号：US12218091B2

公开(公告)日：2025-02-04

申请号：US18177876

申请日：2023-03-03

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Bob Benjamin Buckley

IPC: H01L23/00 ,  G06N10/00 ,  H01L25/16

Abstract: A quantum computing system can include a first substrate including one or more quantum control devices. The quantum computing system can include a second substrate including one or more quantum circuit elements. The quantum computing system can include one or more tin contact bonds formed on the first substrate and the second substrate. The tin contact bonds can bond the first substrate to the second substrate. The tin contact bonds can be or can include tin, such as a tin alloy.

公开(公告)号：US11600588B1

公开(公告)日：2023-03-07

申请号：US17163232

申请日：2021-01-29

Applicant: Google LLC

Inventor： Zhimin Jamie Yao ,  Bob Benjamin Buckley

IPC: H01L23/00 ,  G06N10/00 ,  H01L25/16

Abstract: A quantum computing system can include a first substrate including one or more quantum control devices. The quantum computing system can include a second substrate including one or more quantum circuit elements. The quantum computing system can include one or more tin contact bonds formed on the first substrate and the second substrate. The tin contact bonds can bond the first substrate to the second substrate. The tin contact bonds can be or can include tin, such as a tin alloy.