摘要:
A test selector that multiplexes different test structures (202) to an adjacent probe pad (206) in dependence on the probe voltage. In addition, a scribeline test circuit is disclosed that includes a test selector circuit located in a single scribeline portion between two adjacent die locations. Multiple test structures and at least one probe pad also are located in the single scribeline portion. The test selector circuit makes an electrical connection from the probe pad to a selected one of the test structures depending upon a voltage applied at the probe pad.
摘要:
A method for decreasing CHC degradation is provided. The method includes providing a semiconductor device (10) having at least one metal layer (28) completed. Then, a planarizing dielectric layer (30) is added to the semiconductor device (10). The semiconductor device (10) is heated in a hydrogen rich environment until hydrogen completely saturates the semiconductor device (10).
摘要:
An apparatus is provided for thermoforming a plurality of protrusions in a plastic sheet. The thermoforming apparatus comprises a pneumatic press having a pair of male and female die plates with respective projections and cavities. One of the die plates is heated. The other die plate is cooled. The cooled die plate is provided with vacuum to ensure that the thermoformed plastic sheet is held against the cooled die plate upon the opening of the press to, in turn, ensure the cooling of the plastic sheet prior to its removal.
摘要:
According to one embodiment of the invention, a method for predicting burn-in conditions includes identifying a baseline IDDQ, a baseline temperature, and a baseline IDDQ current density based on a plurality of existing burn-in data for one or more existing devices, determining a theoretical IDDQ current density for a device, determining a ratio of the theoretical IDDQ current density to the baseline IDDQ current density, determining a theoretical process metric for the device at the baseline temperature based on the ratio and the baseline IDDQ, measuring a process metric for an actual device, comparing the process metric for the actual device and the theoretical process metric for the device, and determining an actual burn-in temperature for the actual device based on the comparison.
摘要:
A floating-gate memory which uses a skewed reference for sensing. The skewed reference preferably has a substantially different VT implant dose than the array cells, and can also have different sizing.
摘要:
A robust reference sensing cell for FLASH memory is formed. The cell utilizes floating gate transistors with a drain transition region concentration gradient that is less than the drain transition region concentration gradient of the floating gate transistors used to form the FLASH memory cell array.