Method of cleaning a CVD processing chamber
    1.
    发明申请
    Method of cleaning a CVD processing chamber 审中-公开
    清洗CVD处理室的方法

    公开(公告)号:US20110041873A1

    公开(公告)日:2011-02-24

    申请号:US12925767

    申请日:2010-10-28

    IPC分类号: B08B7/00

    CPC分类号: C23C16/0209 C23C16/5096

    摘要: We have a method of improving the deposition rate uniformity of the chemical vapor deposition (CVD) of films when a number of substrates are processed in series, sequentially in a deposition chamber. The method includes the plasma pre-heating of at least one processing volume structure within the processing volume which surrounds the substrate when the substrate is present in the deposition chamber. We also have a device-controlled method which adjusts the deposition time for a few substrates at the beginning of the processing of a number of substrates in series, sequentially in a deposition chamber, so that the deposited film thickness remains essentially constant during processing of the series of substrates. A combination of these methods into a single method provides the best overall results in terms of controlling average film thickness from substrate to substrate.

    摘要翻译: 当在沉积室中顺序地处理多个基板时,我们具有提高膜的化学气相沉积(CVD)的沉积速率均匀性的方法。 该方法包括当衬底存在于沉积室中时,围绕衬底的处理体积内的至少一个处理体积结构的等离子体预热。 我们还有一种装置控制的方法,其可以在沉积室中顺次地串联处理多个基板的开始时调整几个基板的沉积时间,使得沉积膜厚度在处理期间保持基本恒定 系列底物。 将这些方法组合成单一方法提供了从基材到底物控制平均膜厚度方面的最佳总体结果。

    Repeatability of CVD film deposition during sequential processing of substrates in a deposition chamber
    2.
    发明授权
    Repeatability of CVD film deposition during sequential processing of substrates in a deposition chamber 有权
    在沉积室中的衬底的顺序处理期间CVD膜沉积的重复性

    公开(公告)号:US07879409B2

    公开(公告)日:2011-02-01

    申请号:US10898472

    申请日:2004-07-23

    IPC分类号: C08J7/04

    CPC分类号: C23C16/0209 C23C16/5096

    摘要: We have a method of improving the deposition rate uniformity of the chemical vapor deposition (CVD) of films when a number of substrates are processed in series, sequentially in a deposition chamber. The method includes the plasma pre-heating of at least one processing volume structure within the processing volume which surrounds the substrate when the substrate is present in the deposition chamber. We also have a device-controlled method which adjusts the deposition time for a few substrates at the beginning of the processing of a number of substrates in series, sequentially in a deposition chamber, so that the deposited film thickness remains essentially constant during processing of the series of substrates. A combination of these methods into a single method provides the best overall results in terms of controlling average film thickness from substrate to substrate.

    摘要翻译: 当在沉积室中顺序地处理多个基板时,我们具有提高膜的化学气相沉积(CVD)的沉积速率均匀性的方法。 该方法包括当衬底存在于沉积室中时,围绕衬底的处理体积内的至少一个处理体积结构的等离子体预热。 我们还有一种装置控制的方法,其可以在沉积室中顺次地串联处理多个基板的开始时调整几个基板的沉积时间,使得沉积膜厚度在处理期间保持基本恒定 系列底物。 将这些方法组合成单一方法提供了从基材到底物控制平均膜厚度方面的最佳总体结果。

    Plasma uniformity control by gas diffuser hole design
    4.
    发明授权
    Plasma uniformity control by gas diffuser hole design 有权
    通过气体扩散器孔设计的等离子体均匀性控制

    公开(公告)号:US08083853B2

    公开(公告)日:2011-12-27

    申请号:US10889683

    申请日:2004-07-12

    摘要: Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.

    摘要翻译: 提供了用于在处理室中分配气体的气体扩散板的实施例。 气体分配板包括具有上游侧和下游侧的扩散板,以及在扩散板的上游侧和下游侧之间通过的多个气体通路。 气体通道包括在下游侧的中空阴极腔,以增强等离子体电离。 延伸到下游端的气体通道的空心阴极腔的深度,直径,表面积和密度可以从扩散板的中心到边缘逐渐增加,以改善衬底上的膜厚度和性能均匀性 。 从扩散板的中心到边缘的直径,深度和表面积的增加可以通过向下游侧弯曲扩散板,然后在凸出的下游侧加工出来。 扩散板的弯曲可以通过热处理或真空工艺来实现。 从扩散板的中心到边缘的直径,深度和表面积的增加也可以用计算机数字控制加工。 具有从扩散板的中心到边缘的中空阴极腔的直径逐渐增加,深度和表面积逐渐增大的扩散板已被证明可以产生改善的膜厚度和膜性质的均匀性。

    METHODS AND APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM WITH FLOW GRADIENT DESIGNS
    5.
    发明申请
    METHODS AND APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM WITH FLOW GRADIENT DESIGNS 审中-公开
    用流平面设计沉积均匀硅膜的方法和装置

    公开(公告)号:US20080302303A1

    公开(公告)日:2008-12-11

    申请号:US11759599

    申请日:2007-06-07

    IPC分类号: C23C16/00 B05B1/14

    摘要: Methods and apparatus having a flow gradient created from a gas distribution plate are provided. In one embodiment, the method and apparatus are particularly useful for, but not limited to, depositing a silicon film for solar cell applications. The apparatus for depositing a uniform film for solar cell applications includes a processing chamber, and a quadrilateral gas distribution plate disposed in the processing chamber and having at least four corners separated by four sides. The gas distribution plate further includes a first plurality of chokes formed through the gas distribution plate, the first plurality of chokes located in the corners, and a second plurality of chokes formed through the gas distribution plate, the second plurality of chokes located along the sides of the gas distribution plate between the corner regions, wherein the first plurality of chokes have a greater flow resistance than that of the second plurality of chokes.

    摘要翻译: 提供了具有由气体分配板产生的流动梯度的方法和装置。 在一个实施例中,该方法和装置特别适用于但不限于沉积太阳能电池应用的硅膜。 用于沉积用于太阳能电池应用的均匀膜的设备包括处理室和设置在处理室中的四边形气体分配板,并且具有由四个侧面分开的至少四个角。 气体分配板还包括通过气体分配板形成的第一多个扼流圈,位于角部的第一多个扼流圈,以及通过气体分配板形成的第二多个扼流圈,沿着侧面设置的第二多个扼流圈 在所述角区域之间的所述气体分配板中,所述第一多个扼流器具有比所述第二多个扼流圈更大的流动阻力。

    Apparatus for depositing a uniform silicon film and methods for manufacturing the same
    7.
    发明授权
    Apparatus for depositing a uniform silicon film and methods for manufacturing the same 有权
    用于沉积均匀硅膜的设备及其制造方法

    公开(公告)号:US08142606B2

    公开(公告)日:2012-03-27

    申请号:US11759542

    申请日:2007-06-07

    IPC分类号: C23F1/00 H01L21/306 C23C16/00

    摘要: Methods and apparatus having a gradient spacing created between a substrate support assembly and a gas distribution plate for depositing a silicon film for solar cell applications are provided. In one embodiment, an apparatus for depositing films for solar cell applications may include a processing chamber, a substrate support disposed in the processing chamber and configured to support a quadrilateral substrate thereon, and a gas distribution plate disposed in the processing chamber above the substrate support, wherein a bottom surface of the gas distribution plate has a perimeter that includes edges and corners, and wherein the corners of the gas distribution plate are closer to the substrate support than the edges of the gas distribution plate.

    摘要翻译: 提供了在衬底支撑组件和用于沉积太阳能电池应用的硅膜的气体分配板之间产生梯度间隔的方法和装置。 在一个实施例中,一种用于沉积太阳能电池薄膜的设备可以包括处理室,设置在处理室中的基板支撑件,并且被配置为在其上支撑四边形基板,以及布置在处理室中的基板支撑件上方的气体分配板 其中,所述气体分配板的底面具有包括边缘和角部的周边,并且其中所述气体分配板的角部比所述气体分配板的边缘更靠近所述基板支撑。

    Plasma enhanced chemical vapor deposition technology for large-size processing
    8.
    发明授权
    Plasma enhanced chemical vapor deposition technology for large-size processing 有权
    用于大尺寸加工的等离子体增强化学气相沉积技术

    公开(公告)号:US08114484B2

    公开(公告)日:2012-02-14

    申请号:US11833983

    申请日:2007-08-04

    IPC分类号: H01H1/24 C23C16/00

    摘要: Methods for forming a film stack suitable for transistor fabrication using a low temperature plasma enhanced chemical vapor deposition (PECVD) process are provided. In one embodiment, the method includes providing a substrate in a PECVD chamber, depositing a dual layer SiNx film on the substrate, depositing a dual layer amorphous silicon film on the SiNx film, and depositing a n-doped silicon film on the dual layer amorphous silicon film. The aforementioned films are deposited at a temperature less than about 300 degrees Celsius in the same PECVD chamber.

    摘要翻译: 提供了使用低温等离子体增强化学气相沉积(PECVD)工艺形成适用于晶体管制造的膜堆叠的方法。 在一个实施例中,该方法包括在PECVD室中提供衬底,在衬底上沉积双层SiNx膜,在SiNx膜上沉积双层非晶硅膜,以及在双层非晶体上沉积n掺杂硅膜 硅膜。 上述膜在相同的PECVD室中以低于约300摄氏度的温度沉积。

    Method of improving the uniformity of PECVD-deposited thin films
    9.
    发明授权
    Method of improving the uniformity of PECVD-deposited thin films 有权
    提高PECVD沉积薄膜均匀度的方法

    公开(公告)号:US07754294B2

    公开(公告)日:2010-07-13

    申请号:US12215602

    申请日:2008-06-25

    IPC分类号: H05H1/24

    CPC分类号: H01L21/3185

    摘要: We have discovered that controlling a combination of PECVD deposition process parameters during deposition of silicon-containing thin film provides improved control over surface standing wave effects. By minimizing surface standing wave effects, the uniformity of film properties (particularly film thickness) across a substrate surface onto which the films have been deposited is improved.

    摘要翻译: 我们已经发现,在沉积含硅薄膜期间控制PECVD沉积工艺参数的组合提供了改进的对表面驻波效应的控制。 通过最小化表面驻波效应,改善了其上沉积有薄膜的基板表面上的膜性质(特别是膜厚度)的均匀性。

    METHODS AND APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM WITH FLOW GRADIENT DESIGNS
    10.
    发明申请
    METHODS AND APPARATUS FOR DEPOSITING A UNIFORM SILICON FILM WITH FLOW GRADIENT DESIGNS 审中-公开
    用流平面设计沉积均匀硅膜的方法和装置

    公开(公告)号:US20120103264A1

    公开(公告)日:2012-05-03

    申请号:US13349332

    申请日:2012-01-12

    IPC分类号: C23C16/455

    摘要: Methods and apparatus having a flow gradient created from a gas distribution plate are provided. In one embodiment, the method and apparatus are particularly useful for, but not limited to, depositing a silicon film for solar cell applications. The apparatus for depositing a uniform film for solar cell applications includes a processing chamber, and a quadrilateral gas distribution plate disposed in the processing chamber and having at least four corners separated by four sides. The gas distribution plate further includes a first plurality of chokes formed through the gas distribution plate, the first plurality of chokes located in the corners, and a second plurality of chokes formed through the gas distribution plate, the second plurality of chokes located along the sides of the gas distribution plate between the corner regions, wherein the first plurality of chokes have a greater flow resistance than that of the second plurality of chokes.

    摘要翻译: 提供了具有由气体分配板产生的流动梯度的方法和装置。 在一个实施例中,该方法和装置特别适用于但不限于沉积太阳能电池应用的硅膜。 用于沉积用于太阳能电池应用的均匀膜的设备包括处理室和设置在处理室中的四边形气体分配板,并且具有由四个侧面分开的至少四个角。 气体分配板还包括通过气体分配板形成的第一多个扼流圈,位于角部的第一多个扼流圈,以及通过气体分配板形成的第二多个扼流圈,沿着侧面设置的第二多个扼流圈 在所述角区域之间的所述气体分配板中,所述第一多个扼流器具有比所述第二多个扼流圈更大的流动阻力。