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    Oven Appliance
    1.
    发明申请
    Oven Appliance 审中-公开

    公开(公告)号：US20170130967A1

    公开(公告)日：2017-05-11

    申请号：US14933116

    申请日：2015-11-05

    Applicant: General Electric Company

    Inventor： Stanton Earl Weaver, JR. ,  Gary Dwayne Mandrusiak ,  Nandini Nagraj

    IPC: F24C15/20 ,  F24C15/18 ,  F24C15/32 ,  F24C15/00

    CPC classification number: F24C15/2007

    Abstract: The present subject matter provides an oven appliance with a fluid analysis assembly fluidly mounted to a duct. The fluid analysis assembly includes a casing and a sensor array. A fluid inlet of the casing extends between the duct and a dilution chamber of the casing. An ambient inlet of the casing is contiguous with ambient air about the casing and the dilution chamber. The sensor array includes a plurality of fluid sensors positioned at the dilution chamber of the casing.

    ELECTRONIC DEVICE COOLING WITH MICROJET IMPINGEMENT AND METHOD OF ASSEMBLY
    2.
    发明申请
    ELECTRONIC DEVICE COOLING WITH MICROJET IMPINGEMENT AND METHOD OF ASSEMBLY 有权
    电子设备用微型喷墨冷却和组装方法

    公开(公告)号：US20140160677A1

    公开(公告)日：2014-06-12

    申请号：US13709469

    申请日：2012-12-10

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Hendrik Pieter Jacobus de Bock ,  Stanton Earl Weaver, Jr. ,  Raj Bahadur ,  Eric Ayres Browne ,  Gary Dwayne Mandrusiak

    IPC: F28F13/18 ,  H01L23/46 ,  H05K7/20 ,  H01L21/50

    CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.

    Abstract translation: 提供了一种集成电路装置，其包括具有第一表面的基板的模具和与第一表面相对的第二表面。 模具包括位于第一表面上的至少一个电路元件。 形成在第二表面上，是一种润湿特征，其包括间隔开的纳米尺度结构的阵列和/或间隔开的微结构的阵列。 润湿特征还包括施加到第二表面的至少一部分的润湿性涂层。 集成电路器件包括耦合到与第二表面相邻的管芯的间隔件。 此外，喷射器板联接到间隔件。 喷射器板包括至少一个微喷射器和至少一个通过喷射器板限定的出射孔。 所述至少一个出口孔邻近所述至少一个微型喷射器定位。

    Liquid driven thermal module and thermal management system
    6.
    发明授权
    Liquid driven thermal module and thermal management system 有权

    公开(公告)号：US10746084B2

    公开(公告)日：2020-08-18

    申请号：US16218477

    申请日：2018-12-13

    Applicant: General Electric Company

    Inventor： Juan Antonio Sabate ,  Ruxi Wang ,  Karthik Kumar Bodla ,  Krishna Mainali ,  Yash Veer Singh ,  Gary Dwayne Mandrusiak ,  William John Bonneau ,  Douglas Carl Hofer

    IPC: F01P7/04 ,  A61B6/00

    Abstract: At least one thermal module in fluidic communication with the one or more electronic components. The thermal module including a hydraulic motor operable to rotate a motor output shaft. The module further including a fan coupled to the motor output shaft, at least one heat exchanger in fluidic communication with the fan to provide passage therethrough of an air stream in response to rotational movement of the fan, and a conduit carrying a pressurized liquid stream through the hydraulic motor and each of the at least one heat exchanger. The pressurized liquid stream causing the motor output shaft to rotate and wherein heat in one of the air stream or the pressurized liquid stream is passed through each of the at least one heat exchanger and rejected into the other of the air stream or the pressurized liquid stream. A thermal management system including the at least one thermal module is disclosed.

    Electronic device cooling with microjet impingement and method of assembly
    9.
    发明授权
    Electronic device cooling with microjet impingement and method of assembly 有权
    电子设备冷却与微型喷射冲击和组装方法

    公开(公告)号：US08912643B2

    公开(公告)日：2014-12-16

    申请号：US13709469

    申请日：2012-12-10

    Applicant: General Electric Company

    Inventor： Hendrik Pieter Jacobus de Bock ,  Stanton Earl Weaver, Jr. ,  Raj Bahadur ,  Eric Ayres Browne ,  Gary Dwayne Mandrusiak

    IPC: H01L23/34 ,  F28F13/18 ,  H01L23/473

    CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.

    Abstract translation: 提供了一种集成电路装置，其包括具有第一表面的基板的模具和与第一表面相对的第二表面。 模具包括位于第一表面上的至少一个电路元件。 形成在第二表面上，是一种润湿特征，其包括间隔开的纳米尺度结构的阵列和/或间隔开的微结构的阵列。 润湿特征还包括施加到第二表面的至少一部分的润湿性涂层。 集成电路器件包括耦合到与第二表面相邻的管芯的间隔件。 此外，喷射器板联接到间隔件。 喷射器板包括至少一个微喷射器和至少一个通过喷射器板限定的出射孔。 所述至少一个出口孔邻近所述至少一个微型喷射器定位。

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