公开(公告)号：US20130164956A1

公开(公告)日：2013-06-27

申请号：US13664761

申请日：2012-10-31

Applicant: Fujitsu Limited

Inventor： Seiki SAKUYAMA ,  Toshiya AKAMATSU ,  Nobuhiro IMAIZUMI ,  Keisuke UENISHI ,  Kenichi YASAKA ,  Toru SAKAI

IPC: H01R12/51

CPC classification number: H01L24/16 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2924/00014 ,  H05K3/3436 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/05552

Abstract: A surface of a connection terminal of an electronic component is covered with a protection layer made of a AgSn alloy. The electronic component is soldered to a connection terminal of a circuit board.