公开(公告)号：US20140232643A1

公开(公告)日：2014-08-21

申请号：US14238907

申请日：2012-06-19

Applicant: Mohamad Iyad Al Dibs ,  Frank Fischer ,  Christoph Puttmann ,  David Slogsnat ,  Sebastian Reiss ,  Daniel Kreye

Inventor： Mohamad Iyad Al Dibs ,  Frank Fischer ,  Christoph Puttmann ,  David Slogsnat ,  Sebastian Reiss ,  Daniel Kreye

IPC: G09G3/00

CPC classification number: G09G3/002 ,  H04N5/74 ,  H04N9/3129

Abstract: A laser projection device is described having a projection unit, which is designed to project an image and to generate an interrupt signal as a function of a distance of the projection unit from at least one object located in front of the projection unit in the projection direction, and having an application control unit, which is designed to control the projection unit as a function of the interrupt signal. A method is also described.

Abstract translation: 激光投影装置被描述为具有投影单元，该投影单元被设计成投射图像并根据投影单元距投影单元前方的至少一个物体在投影方向上的距离的函数产生中断信号 并且具有应用控制单元，其被设计成根据中断信号来控制投影单元。 还描述了一种方法。

公开(公告)号：US20150022502A1

公开(公告)日：2015-01-22

申请号：US14377889

申请日：2013-02-04

Applicant: Frank Fischer ,  David Slogsnat

Inventor： Frank Fischer ,  David Slogsnat

IPC: G06F3/042 ,  G06F3/01

CPC classification number: G06F3/0421 ,  G06F3/005 ,  G06F3/017 ,  G06F3/0304 ,  G06F13/385

Abstract: A method for reading out a light sensor control unit having the method steps: (a) reading out a light signal of the light sensor by the light sensor control unit and generating a data signal corresponding to the light signal, b) storing the generated data signal in a buffer memory unit of the light sensor control unit and, if a terminating condition is not fulfilled: continuing the method with method step a), if the terminating condition is fulfilled: continuing the method with c) reading out the data signals stored in the buffer memory unit of the light sensor control unit in a data block by a processor device.

Abstract translation: 一种用于读出具有以下方法步骤的光传感器控制单元的方法步骤：（a）由光传感器控制单元读出光传感器的光信号，并产生与光信号对应的数据信号，b）存储所生成的数据 信号在光传感器控制单元的缓冲存储器单元中，并且如果不满足终止条件：如果满足终止条件则继续方法步骤a）的方法：继续该方法，c）读出存储的数据信号 在处理器设备的数据块中的光传感器控制单元的缓冲存储器单元中。

公开(公告)号：US08941193B2

公开(公告)日：2015-01-27

申请号：US13869428

申请日：2013-04-24

Applicant: Jens Frey ,  Frank Fischer

Inventor： Jens Frey ,  Frank Fischer

IPC: B81C3/00 ,  B81B1/00 ,  H01L29/84 ,  B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00269 ,  B81B7/007 ,  B81C1/00238 ,  B81C2203/0785

Abstract: A simple and cost-effective manufacturing method for hybrid integrated components including at least one MEMS element, a cap for the micromechanical structure of the MEMS element, and at least one ASIC substrate, using which a high degree of miniaturization may be achieved. The micromechanical structure of the MEMS element and the cap are manufactured in a layered structure, proceeding from a shared semiconductor substrate, by applying at least one cap layer to a first surface of the semiconductor substrate, and by processing and structuring the semiconductor substrate proceeding from its other second surface, to produce and expose the micromechanical MEMS structure. The semiconductor substrate is then mounted with the MEMS-structured second surface on the ASIC substrate.

Abstract translation: 一种用于混合集成部件的简单和成本有效的制造方法，包括至少一个MEMS元件，用于MEMS元件的微机械结构的盖，以及至少一个ASIC基板，其可以实现高度的小型化。 MEMS元件和盖的微机械结构通过将至少一个盖层施加到半导体衬底的第一表面，并且通过加工和构造半导体衬底从共享半导体衬底开始，以分层结构制造，并且从 其另一个第二表面，以产生和暴露微机械MEMS结构。 然后将半导体衬底与MEMS结构的第二表面安装在ASIC衬底上。

公开(公告)号：US20140110800A1

公开(公告)日：2014-04-24

申请号：US14058806

申请日：2013-10-21

Applicant: Johannes CLASSEN ,  Axel Franke ,  Jens Frey ,  Heribert Weber ,  Frank Fischer ,  Patrick Wellner

Inventor： Johannes CLASSEN ,  Axel Franke ,  Jens Frey ,  Heribert Weber ,  Frank Fischer ,  Patrick Wellner

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00015 ,  B81B3/0018 ,  B81B7/0058

Abstract: A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure.

Abstract translation: 一种用于具有MEMS部件的混合垂直集成部件的盖的制造方法，具有较低的洞穴内部压力的相对较大的洞穴体积以及用于MEMS部件的微机械结构的可靠的过载保护。 在多步骤各向异性蚀刻中，在平盖基板中制造盖结构，并且包括至少一个安装框架，该安装框架具有至少一个安装表面和止动结构，在盖内侧具有至少一个止动表面， 掩模基板被掩模用于具有由不同材料制成的至少两个掩模层的多步各向异性蚀刻，并且选择掩模层的布局以及蚀刻步骤的数量和持续时间，使得安装表面，止动表面和 帽内侧位于帽结构的不同表面水平处。

公开(公告)号：US20130299924A1

公开(公告)日：2013-11-14

申请号：US13890450

申请日：2013-05-09

Applicant: Heribert WEBER ,  Frank Fischer ,  Mirko Hattass ,  Yvonne Bergmann

Inventor： Heribert WEBER ,  Frank Fischer ,  Mirko Hattass ,  Yvonne Bergmann

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81B2201/025 ,  B81B2207/096 ,  B81C1/00238 ,  B81C1/00261 ,  B81C1/00301 ,  B81C2203/0792 ,  H01L2224/13 ,  H01L2224/48463 ,  H01L2224/73257 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A component system includes at least one MEMS element, a cap for a micromechanical structure of the MEMS element, and at least one ASIC substrate. The micromechanical structure of the MEMS element is implemented in the functional layer of an SOI wafer. The MEMS element is mounted face down, with the structured functional layer on the ASIC substrate, and the cap is implemented in the substrate of the SOI wafer. The ASIC substrate includes a starting substrate provided with a layered structure on both sides. At least one circuit level is implemented in each case both in the MEMS-side layered structure and in the rear-side layered structure of the ASIC substrate. In the ASIC substrate, at least one ASIC through contact is implemented which electrically contacts at least one circuit level of the rear-side layered structure and/or at least one circuit level of the MEMS-side layered structure.

Abstract translation: 组件系统包括至少一个MEMS元件，用于MEMS元件的微机械结构的盖以及至少一个ASIC基板。 MEMS元件的微机械结构在SOI晶片的功能层中实现。 MEMS元件面朝下安装，ASIC结构上的结构化功能层，并且帽被实现在SOI晶片的衬底中。 ASIC基板包括在两侧设置有分层结构的起始衬底。 在ASIC基板的MEMS侧分层结构和后侧层叠结构中，每种情况都至少实现一个电路电平。 在ASIC基板中，实现至少一个ASIC接触，其电接触后侧分层结构的至少一个电路电平和/或MEMS侧分层结构的至少一个电路电平。

公开(公告)号：US08362897B2

公开(公告)日：2013-01-29

申请号：US12526559

申请日：2008-02-06

Applicant: Alexander Fink ,  Frank Fischer ,  Gregor Kuchler

Inventor： Alexander Fink ,  Frank Fischer ,  Gregor Kuchler

IPC: G08B1/08 ,  B60C23/00 ,  G01L3/00

CPC classification number: B60C23/0416 ,  B60C23/007 ,  B60C23/008 ,  B60C23/0444

Abstract: A method and a device for locating tires mounted on a vehicle. High frequency signals are captured by way of a first transmit/receive device arranged on a vehicle, said high-frequency signals originating from a wheel electronic system arranged on the vehicle, said wheel electronic system interacting with tires of a first tire group that are mounted on the vehicle. A trigger signal having a frequency that is clearly lower than the frequency of the high frequency signal, is emitted by the first transmit/receive device. The first transmit/receive device is arranged on the vehicle in such a manner that the tires of the first tire group are mounted on the vehicle and the level of the first trigger signal is selected in such a manner that only one part of the wheel electronic system, which is associated with the tires of the first tire group, captures the first trigger signal and the high frequency signals which originate from the part of the wheel electronic system of the tires of the first wheel group that has captured the first trigger signal, contains information on the obtained first trigger signal.

Abstract translation: 一种用于定位安装在车辆上的轮胎的方法和装置。 通过布置在车辆上的第一发射/接收装置捕获高频信号，所述高频信号源自布置在车辆上的车轮电子系统，所述车轮电子系统与安装的第一轮胎组的轮胎相互作用 在车上 具有明显低于高频信号频率的频率的触发信号由第一发射/接收装置发射。 第一发送/接收装置被布置在车辆上，使得第一轮胎组的轮胎安装在车辆上，并且以这样的方式选择第一触发信号的电平，使得只有一部分车轮电子 与第一轮胎组的轮胎相关联的系统捕获第一触发信号和源自已经捕获了第一触发信号的第一轮组的轮胎的车轮电子系统的部分的高频信号， 包含获得的第一触发信号的信息。

公开(公告)号：US08089828B2

公开(公告)日：2012-01-03

申请号：US12598994

申请日：2008-06-10

Applicant: Frank Fischer ,  Arnim Hoechst

Inventor： Frank Fischer ,  Arnim Hoechst

IPC: H04R19/04

CPC classification number: H04R19/04 ,  H04R19/005

Abstract: A micromechanical acoustic sensor element, which has at least one diaphragm and at least one fixed counter element, the diaphragm being situated in a cavity between a substrate and the counter element and acting as movable electrode of a capacitor system, the counter element acting as first fixed counter electrode of this capacitor system, and at least one through hole being formed in the substrate for the application of sound pressure to the diaphragm. For fixation and strengthening purposes, the counter element is connected to the substrate via at least one support element. The support element is situated in the region of the cavity, and an opening is formed in the diaphragm for the support element.

Abstract translation: 一种微机械声学传感器元件，其具有至少一个隔膜和至少一个固定的计数元件，所述隔膜位于基板和所述相对元件之间的空腔中，并且用作电容器系统的可移动电极，所述对置元件作为第一 该电容器系统的固定对置电极，以及至少一个通孔，形成在基板中，用于向隔膜施加声压。 为了固定和加强目的，计数元件通过至少一个支撑元件连接到基底。 支撑元件位于空腔的区域中，并且在用于支撑元件的隔膜中形成开口。

公开(公告)号：US20110257339A1

公开(公告)日：2011-10-20

申请号：US13141528

申请日：2009-12-17

Applicant: Frank Fischer ,  Ralf Widmaier ,  Angelika Maschke ,  Karl Kolter ,  Antonietta Mauri

Inventor： Frank Fischer ,  Ralf Widmaier ,  Angelika Maschke ,  Karl Kolter ,  Antonietta Mauri

IPC: C08F226/10 ,  C08F283/06 ,  C08F26/10

CPC classification number: C08F6/02 ,  C08F26/10 ,  C08G65/30 ,  C08G65/321 ,  C08G69/02 ,  C08G69/48 ,  C08L39/06

Abstract: Process for the preparation of low-peroxide polymer comprising the treatment of the polymer with elemental metal in the presence of a liquid, polymer obtainable by this process, the use thereof, and also drugs comprising this polymer.

Abstract translation: 制备低过氧化物聚合物的方法，包括在液体存在下用元素金属处理聚合物，可通过该方法获得的聚合物，其用途，以及包含该聚合物的药物。

公开(公告)号：US20110108932A1

公开(公告)日：2011-05-12

申请号：US11793853

申请日：2005-11-04

Applicant: Hubert Benzel ,  Stefan Finkbeiner ,  Frank Fischer ,  Helmut Baumann ,  Lars Metzger ,  Roland Scheuerer ,  Peter Brauchle ,  Andreas Feustel ,  Matthias Neubauer

Inventor： Hubert Benzel ,  Stefan Finkbeiner ,  Frank Fischer ,  Helmut Baumann ,  Lars Metzger ,  Roland Scheuerer ,  Peter Brauchle ,  Andreas Feustel ,  Matthias Neubauer

IPC: H01L29/84 ,  H01L21/02

CPC classification number: G01L9/0073

Abstract: A manufacturing method for producing a micromechanical sensor element which may be produced in a monolithically integrable design and has capacitive detection of a physical quantity is described. In addition to the manufacturing method, a micromechanical device containing such. a sensor element, e.g., a pressure sensor or an acceleration sensor, is described.

Abstract translation: 描述了可以以单片可集成设计制造并具有物理量的电容检测的微机械传感器元件的制造方法。 除了制造方法之外，还含有这样的微机械装置。 描述了传感器元件，例如压力传感器或加速度传感器。

公开(公告)号：US07902615B2

公开(公告)日：2011-03-08

申请号：US12084477

申请日：2006-11-14

Applicant: Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

Inventor： Roman Schlosser ,  Stefan Weiss ,  Frank Fischer ,  Christoph Schelling

IPC: H01L29/84 ,  H04R19/00

CPC classification number: H04R19/005

Abstract: A micromechanical structure and a method for producing a micromechanical structure are provided, the micromechanical structure being configured for receiving and/or generating acoustic signals in a medium at least partially surrounding the structure. The structure includes a first counterelement that has first openings and essentially forms a first side of the structure, a second counterelement that has second openings and essentially forms a second side of the structure, and an essentially closed diaphragm disposed between the first counterelement and the second counterelement.

Abstract translation: 提供微机械结构和用于产生微机械结构的方法，所述微机械结构被配置为在至少部分地围绕所述结构的介质中接收和/或产生声信号。 该结构包括具有第一开口并且基本上形成该结构的第一侧面的第一反应体，具有第二开口并且基本上形成该结构的第二侧的第二反应体，以及设置在该第一反应体和该第二反应器之间的基本封闭的隔膜 反数