公开(公告)号：US11667763B2

公开(公告)日：2023-06-06

申请号：US16641134

申请日：2017-08-23

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Jirou Hiroishi ,  Hidekazu Hara ,  Yuka Sawada ,  Masami Tazuke ,  Toshihiro Suzuki ,  Shingo Mitsugi

IPC分类号： C08J5/04 ,  C08G63/183 ,  C08J5/18 ,  C08J11/06 ,  C08K7/02 ,  C08L1/02 ,  C08L23/06 ,  C08L23/12 ,  C08L77/00

CPC分类号： C08J5/04 ,  C08G63/183 ,  C08J5/18 ,  C08J11/06 ,  C08K7/02 ,  C08L1/02 ,  C08L23/06 ,  C08L23/12 ,  C08L77/00 ,  C08K2201/004 ,  C08L2203/16 ,  C08L2205/03 ,  C08L2205/16 ,  C08L2207/062 ,  C08L2207/066 ,  C08L2207/20

摘要： A cellulose fiber dispersion polyethylene resin composite material formed by dispersing a cellulose fiber into a polyethylene resin, in which a proportion of the above-described cellulose fiber is 1 part by mass or more and 70 parts by mass or less in a total content of 100 parts by mass of the polyethylene resin and the cellulose fiber, and the polyethylene resin satisfies a relationship: 1.7>half-width (Log(MH/ML))>1.0 in a molecular weight pattern obtained by gel permeation chromatography measurement, and a formed body and a pellet using the same, a production method therefor, and a recycling method for the cellulose fiber adhesion polyethylene thin film piece.

公开(公告)号：US12068088B2

公开(公告)日：2024-08-20

申请号：US17931378

申请日：2022-09-12

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Tetsuya Mieda ,  Kazuyoshi Akizuki ,  Shingo Mitsugi

IPC分类号： H01B3/30 ,  H01B9/02 ,  H01B13/00 ,  H01B13/14

CPC分类号： H01B13/14 ,  H01B3/30 ,  H01B9/02 ,  H01B13/0016

摘要： Provided is a power cable and a method for manufacturing a power cable that reduces occurrence of uneven thickness of an insulating layer and voids and peeling due to shrinkage and has good dielectric breakdown strength. The power cable includes the insulating layer containing 15 mass % or more of a propylene-based resin having a melting point of 110° C. or higher with respect to a whole. The power cable further includes a relationship between a cooling rate X [° C./min] at the time of manufacturing an interface portion in the insulating layer with the inner semiconductive layer and a cooling rate Y [° C./min] at the time of manufacturing a central portion of the insulating layer and is expressed by the relationship (Z), wherein X≥Y×0.8 . . . (Z).