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公开(公告)号:US12068088B2
公开(公告)日:2024-08-20
申请号:US17931378
申请日:2022-09-12
发明人: Tetsuya Mieda , Kazuyoshi Akizuki , Shingo Mitsugi
CPC分类号: H01B13/14 , H01B3/30 , H01B9/02 , H01B13/0016
摘要: Provided is a power cable and a method for manufacturing a power cable that reduces occurrence of uneven thickness of an insulating layer and voids and peeling due to shrinkage and has good dielectric breakdown strength. The power cable includes the insulating layer containing 15 mass % or more of a propylene-based resin having a melting point of 110° C. or higher with respect to a whole. The power cable further includes a relationship between a cooling rate X [° C./min] at the time of manufacturing an interface portion in the insulating layer with the inner semiconductive layer and a cooling rate Y [° C./min] at the time of manufacturing a central portion of the insulating layer and is expressed by the relationship (Z), wherein X≥Y×0.8 . . . (Z).