公开(公告)号：US20040200229A1

公开(公告)日：2004-10-14

申请号：US10837651

申请日：2004-05-04

Applicant: FUJITSU LIMITED

Inventor： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

IPC: F25B039/02 ,  F25C001/00 ,  F25B041/04

CPC classification number: F28D15/0266 ,  F25B39/02 ,  F25B2600/21 ,  F25D19/006 ,  F28F3/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H01L2924/00

Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant *remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

Abstract translation: 制冷系统允许制冷剂循环通过封闭的循环通道。 干燥蒸发器结合在循环通道中。 干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。 每单位面积的传热量，即传热系数取决于质量。 当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。 在干燥蒸发器中的冷凝器蒸发期间，制冷剂的质量保持在预定阈值水平以下，可以可靠地建立更高的冷却性能。 另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数*显着下降。 因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。

公开(公告)号：US20020021557A1

公开(公告)日：2002-02-21

申请号：US09968041

申请日：2001-10-02

Applicant: Fujitsu Limited,

Inventor： Junichi Ishimine ,  Masahiro Suzuki ,  Akira Tamura ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC: H05K007/20

CPC classification number: H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract translation: 一种电子设备，包括主板，安装到主板的多个多芯片模块和用于冷却多芯片模块的冷却构件。 制冷单元布置成将冷却水输送到冷却构件。 为每个多芯片模块提供连接结构，用于热和机械地可释放地将每个多芯片模块耦合到制冷单元。