公开(公告)号：US20040016257A1

公开(公告)日：2004-01-29

申请号：US10370525

申请日：2003-02-24

Applicant: FUJITSU LIMITED

Inventor： Jie Wei

IPC: F28F007/00 ,  F25D023/12

CPC classification number: H01L23/467 ,  F28D1/0477 ,  F28F1/32 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling system, applied to an electronic apparatus having a plurality of exoergic circuit elements, which cools the exoergic circuit elements using air supplied from the outside includes a fin heat sink provided on the exoergic circuit elements, and an evaporator, located above the exoergic circuit elements, which cools the air and for guiding the cooled air to the fin heat sink.

Abstract translation: 应用于具有多个排气电路元件的电子设备的冷却系统，其使用从外部供应的空气来冷却散热元件的散热元件包括设置在散热电路元件上的散热片散热器和位于散热回路之上的蒸发器 元件，其冷却空气并将冷却的空气引导到散热片散热片。

公开(公告)号：US20030205054A1

公开(公告)日：2003-11-06

申请号：US10452631

申请日：2003-06-03

Applicant: FUJITSU LIMITED

Inventor： Hitoshi Nori ,  Jie Wei

IPC: F25D023/12 ,  F28D005/00

CPC classification number: H01L23/427 ,  F28D2015/0225 ,  H01L2224/16

Abstract: The cooling system allows the liquid coolant discharged from the pump to flow into the evaporation chamber. The liquid coolant passes through the atomizer. Minute droplets of the atomized coolant is discharged from the atomizer into the evaporation chamber. The minute droplets serve to form a uniform thin liquid film over the surface of the fin. Heat conducting from a target heat generating object to the fin promotes the evaporation of the liquid coolant over the surface of the fin, for example. The coolant absorbs a large amount of heat from the fin based on the evaporation. The target heat generating object can thus efficiently be cooled.

Abstract translation: 冷却系统允许从泵排出的液体冷却剂流入蒸发室。 液体冷却剂通过雾化器。 雾化的冷却剂的微小液滴从雾化器排放到蒸发室中。 微滴用于在翅片的表面上形成均匀的薄液膜。 从目标发热体到翅片的导热，例如促进了液体冷却剂在翅片表面上的蒸发。 基于蒸发，冷却剂从翅片吸收大量的热量。 因此能够有效地冷却目标发热体。

公开(公告)号：US20040200229A1

公开(公告)日：2004-10-14

申请号：US10837651

申请日：2004-05-04

Applicant: FUJITSU LIMITED

Inventor： Hideo Kubo ,  Hisashi Kawashima ,  Jie Wei ,  Junichi Ishimine ,  Masahiro Suzuki ,  Yoshiaki Udagawa ,  Masahiro Mochizuki

IPC: F25B039/02 ,  F25C001/00 ,  F25B041/04

CPC classification number: F28D15/0266 ,  F25B39/02 ,  F25B2600/21 ,  F25D19/006 ,  F28F3/12 ,  F28F13/06 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H01L2924/00

Abstract: A refrigeration system allows the refrigerant to circulate through a closed circulation channel. A dry evaporator is incorporated in the circulation channel. The dry evaporator is designed to keep a quality smaller than 1.0 in evaporating the refrigerant. The quantity of heat transfer per unit area, namely, a heat transfer coefficient depends on the quality. The heat transfer coefficient remarkably drops when the quality of the refrigerant exceeds a predetermined threshold level before the quality actually reaches 1.0. The quality of the refrigerant kept below the predetermined threshold level during vaporization of the refrigetant in the dry evaporator allows a reliable establishment of a higher performance of cooling. On the other hand, if a refrigerant completely evaporates in a dry evaporator in a conventional manner, the heat transfer coefficient of the refrigerant *remarkably drops after the quality of the refrigerant exceeds the predetermined threshold level. Accordingly, the conventional dry evaporator is forced to absorb heat at a lower heat transfer coefficient, as compared with the present dry evaporator.

Abstract translation: 制冷系统允许制冷剂循环通过封闭的循环通道。 干燥蒸发器结合在循环通道中。 干蒸发器设计成在蒸发制冷剂时保持小于1.0的质量。 每单位面积的传热量，即传热系数取决于质量。 当质量实际达到1.0之前制冷剂的质量超过预定阈值水平时，传热系数显着下降。 在干燥蒸发器中的冷凝器蒸发期间，制冷剂的质量保持在预定阈值水平以下，可以可靠地建立更高的冷却性能。 另一方面，如果制冷剂在干式蒸发器中以常规方式完全蒸发，则在制冷剂的质量超过预定阈值水平之后，制冷剂的传热系数*显着下降。 因此，与本发明的干式蒸发器相比，传统的干式蒸发器被迫以较低的传热系数吸收热量。

公开(公告)号：US20020021557A1

公开(公告)日：2002-02-21

申请号：US09968041

申请日：2001-10-02

Applicant: Fujitsu Limited,

Inventor： Junichi Ishimine ,  Masahiro Suzuki ,  Akira Tamura ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC: H05K007/20

CPC classification number: H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract translation: 一种电子设备，包括主板，安装到主板的多个多芯片模块和用于冷却多芯片模块的冷却构件。 制冷单元布置成将冷却水输送到冷却构件。 为每个多芯片模块提供连接结构，用于热和机械地可释放地将每个多芯片模块耦合到制冷单元。