公开(公告)号：US20020021557A1

公开(公告)日：2002-02-21

申请号：US09968041

申请日：2001-10-02

Applicant: Fujitsu Limited,

Inventor： Junichi Ishimine ,  Masahiro Suzuki ,  Akira Tamura ,  Masahiro Miyo ,  Akihiko Fujisaki ,  Keizo Takemura ,  Jie Wei ,  Hisashi Kawashima ,  Yoshiaki Udagawa ,  Haruhiko Yamamoto ,  Masahiro Mochizuki

IPC: H05K007/20

CPC classification number: H05K7/20781 ,  G06F1/181 ,  G06F1/20 ,  G06F1/206 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

Abstract translation: 一种电子设备，包括主板，安装到主板的多个多芯片模块和用于冷却多芯片模块的冷却构件。 制冷单元布置成将冷却水输送到冷却构件。 为每个多芯片模块提供连接结构，用于热和机械地可释放地将每个多芯片模块耦合到制冷单元。