公开(公告)号：US09454079B2

公开(公告)日：2016-09-27

申请号：US14271606

申请日：2014-05-07

Applicant: FUJIFILM CORPORATION

Inventor： Akinori Shibuya ,  Yoko Tokugawa ,  Tomoki Matsuda ,  Junichi Ito ,  Shohei Kataoka ,  Toshiaki Fukuhara ,  Naohiro Tango ,  Kaoru Iwato ,  Masahiro Yoshidome ,  Shinichi Sugiyama

IPC: G03F7/004 ,  C07C303/32 ,  C07C309/04 ,  C07C309/06 ,  C07C309/12 ,  C07D295/16 ,  C07D327/06 ,  C07D339/08 ,  G03F7/038 ,  G03F7/039 ,  G03F7/11 ,  G03F7/20 ,  G03F7/32

CPC classification number: G03F7/038 ,  C07C303/32 ,  C07C309/04 ,  C07C309/12 ,  C07D295/16 ,  C07D327/06 ,  C07D339/08 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/2041 ,  G03F7/325

Abstract: According to one embodiment, there is provided an actinic ray- or radiation-sensitive resin composition including (A) a compound represented by a general formula (1) below that generates an acid when exposed to actinic rays or radiation, and (B) a resin.

公开(公告)号：US10126651B2

公开(公告)日：2018-11-13

申请号：US14606189

申请日：2015-01-27

Applicant: FUJIFILM Corporation

Inventor： Shinichi Sugiyama ,  Tsukasa Yamanaka ,  Ryosuke Ueba ,  Makoto Momota

IPC: G03F7/004 ,  G03F7/38 ,  G03F7/16 ,  G03F7/40 ,  G03F7/00 ,  G03F7/30 ,  G03F7/039 ,  G03F7/11 ,  G03F7/20 ,  G03F7/32

Abstract: The pattern forming method of the invention includes (i) a step of forming a first film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition including a resin (A) capable of increasing the polarity by the action of an acid to decrease the solubility in a developer including an organic solvent; (ii) a step of exposing the first film; (iii) a step of developing the exposed first film using a developer including an organic solvent to form a negative tone pattern; and (iv) a step of forming a second film on the second substrate so as to cover the periphery of the negative tone pattern.

公开(公告)号：US11009791B2

公开(公告)日：2021-05-18

申请号：US16015358

申请日：2018-06-22

Applicant: FUJIFILM Corporation

Inventor： Takamitsu Tomiga ,  Kenichi Harada ,  Shinichi Sugiyama ,  Fumihiro Yoshino ,  Shuji Hirano

IPC: G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/38

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (A) having a glass transition temperature of 155° C. or higher, a compound (B) having a glass transition temperature of 150° C. or lower, and a solvent (C). A solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 20% by mass or more. A softening point of the resist pattern formed using the actinic ray-sensitive or radiation-sensitive resin composition is from 130° C. to 170° C.