PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

    公开(公告)号:US20230367212A1

    公开(公告)日:2023-11-16

    申请号:US18355053

    申请日:2023-07-19

    CPC classification number: G03F7/039 G03F7/325

    Abstract: A pattern forming method including: (1) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition that contains a resin (A) which is decomposed by action of acid to increase polarity and a compound (B) which generates an acid by irradiation with an actinic ray or a radiation; (2) exposing the film; and (3) subjecting the exposed film to at least one of development or rinsing with an organic treatment liquid containing butyl acetate and a hydrocarbon having 11 or more carbon atoms, in which a content of the hydrocarbon having 11 or more carbon atoms in the organic treatment liquid is 1% by mass or more and 35% by mass or less.

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