-
公开(公告)号：US10317623B2
公开(公告)日：2019-06-11
申请号：US16134086
申请日：2018-09-18
Applicant: Elenion Technologies, LLC
Inventor： Ruizhi Shi , Michael J. Hochberg , Ari Jason Novack , Thomas Wetteland Baehr-Jones
Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
-
公开(公告)号：US10222565B2
公开(公告)日：2019-03-05
申请号：US15783263
申请日：2017-10-13
Applicant: Elenion Technologies, LLC
Inventor： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
IPC: G02B6/42 , G02B6/14 , G02B6/13 , G02B6/12 , G02B6/136 , H01L31/12 , H01L31/18 , H01L25/00 , H01L25/16
Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
-
公开(公告)号：US20190101697A1
公开(公告)日：2019-04-04
申请号：US16134086
申请日：2018-09-18
Applicant: Elenion Technologies, LLC
Inventor： Ruizhi Shi , Michael J. Hochberg , Ari Jason Novack , Thomas Wetteland Baehr-Jones
Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
-
公开(公告)号：US20190179091A1
公开(公告)日：2019-06-13
申请号：US16248963
申请日：2019-01-16
Applicant: Elenion Technologies, LLC
Inventor： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
CPC classification number: G02B6/423 , G02B6/131 , G02B6/136 , G02B6/4232 , G02B6/4238 , G02B6/4251 , G02B6/4268 , G02B6/4274 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , H01L25/16 , H01L25/162 , H01L25/167 , H01L25/50 , H01L31/125 , H01L31/18 , Y02P70/521
Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
-
公开(公告)号：US10101533B2
公开(公告)日：2018-10-16
申请号：US15826897
申请日：2017-11-30
Applicant: Elenion Technologies, LLC
Inventor： Ruizhi Shi , Michael J. Hochberg , Ari Jason Novack , Thomas Wetteland Baehr-Jones
Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
-
Patent Agency Ranking
公开(公告)号：US20180052290A1
公开(公告)日：2018-02-22
申请号：US15783263
申请日：2017-10-13
Applicant: Elenion Technologies, LLC
Inventor： David Henry Kinghorn , Ari Jason Novack , Holger N. Klein , Nathan A. Nuttall , Kishor V. Desai , Daniel J. Blumenthal , Michael J. Hochberg , Ruizhi Shi
CPC classification number: G02B6/423 , G02B6/131 , G02B6/136 , G02B6/4232 , G02B6/4238 , G02B6/4251 , G02B6/4268 , G02B6/4274 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , H01L25/16 , H01L25/162 , H01L25/167 , H01L25/50 , H01L31/125 , H01L31/18 , Y02P70/521
Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
-
公开(公告)号：US11506840B2
公开(公告)日：2022-11-22
申请号：US16398634
申请日：2019-04-30
Applicant: Elenion Technologies, LLC
Inventor： Ruizhi Shi , Michael J. Hochberg , Ari Jason Novack , Thomas Wetteland Baehr-Jones
Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
-
公开(公告)号：US11256046B2
公开(公告)日：2022-02-22
申请号：US16789878
申请日：2020-02-13
Applicant: Elenion Technologies, LLC
Inventor： Michael J. Hochberg , Ari Jason Novack , Peter D. Magill
Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
-
公开(公告)号：US10928593B2
公开(公告)日：2021-02-23
申请号：US16151079
申请日：2018-10-03
Applicant: Elenion Technologies, LLC
Inventor： Ari Jason Novack , Amir Hanjani , Anna Mikami
Abstract: In order to bond an opto-electronic device with fiber pigtails to a larger PCB, the fibers need to be secured in place so that they don't become entangled in the bonding elements resulting in misalignment of the electronic connectors and of the optics. Accordingly, there is a need for packaged parts, which enables customers to use their own surface mount technology (SMT) bonding process without the fiber pigtails interfering with the process. Ideally, the fiber holder device is disposable and provides a spool and a fiber track to guide the fibers from the package to the spool. Ideally, an opening is provided through the spool to enable the components on the opto-electronic device to be accessed.
-
公开(公告)号：US20200183103A1
公开(公告)日：2020-06-11
申请号：US16789878
申请日：2020-02-13
Applicant: Elenion Technologies, LLC
Inventor： Michael J. Hochberg , Ari Jason Novack , Peter D. Magill
Abstract: A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
-
-
-
-
-
-
-
-
-
Search Results
16
records
(took 0.02 seconds)
