公开(公告)号：US10222565B2

公开(公告)日：2019-03-05

申请号：US15783263

申请日：2017-10-13

Applicant: Elenion Technologies, LLC

Inventor： David Henry Kinghorn ,  Ari Jason Novack ,  Holger N. Klein ,  Nathan A. Nuttall ,  Kishor V. Desai ,  Daniel J. Blumenthal ,  Michael J. Hochberg ,  Ruizhi Shi

IPC: G02B6/42 ,  G02B6/14 ,  G02B6/13 ,  G02B6/12 ,  G02B6/136 ,  H01L31/12 ,  H01L31/18 ,  H01L25/00 ,  H01L25/16

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

公开(公告)号：US10678005B2

公开(公告)日：2020-06-09

申请号：US16248963

申请日：2019-01-16

Applicant: Elenion Technologies, LLC

Inventor： David Henry Kinghorn ,  Ari Jason Novack ,  Holger N. Klein ,  Nathan A. Nuttall ,  Kishor V. Desai ,  Daniel J. Blumenthal ,  Michael J. Hochberg ,  Ruizhi Shi

IPC: G02B6/42 ,  G02B6/13 ,  G02B6/136 ,  H01L25/00 ,  G02B6/12 ,  H01L25/16 ,  H01L31/12 ,  H01L31/18

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

公开(公告)号：US20190179091A1

公开(公告)日：2019-06-13

申请号：US16248963

申请日：2019-01-16

Applicant: Elenion Technologies, LLC

Inventor： David Henry Kinghorn ,  Ari Jason Novack ,  Holger N. Klein ,  Nathan A. Nuttall ,  Kishor V. Desai ,  Daniel J. Blumenthal ,  Michael J. Hochberg ,  Ruizhi Shi

IPC: G02B6/42 ,  G02B6/13 ,  G02B6/136

CPC classification number: G02B6/423 ,  G02B6/131 ,  G02B6/136 ,  G02B6/4232 ,  G02B6/4238 ,  G02B6/4251 ,  G02B6/4268 ,  G02B6/4274 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/121 ,  H01L25/16 ,  H01L25/162 ,  H01L25/167 ,  H01L25/50 ,  H01L31/125 ,  H01L31/18 ,  Y02P70/521

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

公开(公告)号：US20180052290A1

公开(公告)日：2018-02-22

申请号：US15783263

申请日：2017-10-13

Applicant: Elenion Technologies, LLC

Inventor： David Henry Kinghorn ,  Ari Jason Novack ,  Holger N. Klein ,  Nathan A. Nuttall ,  Kishor V. Desai ,  Daniel J. Blumenthal ,  Michael J. Hochberg ,  Ruizhi Shi

IPC: G02B6/42 ,  H01L31/18 ,  H01L31/12 ,  G02B6/13 ,  G02B6/136 ,  H01L25/00 ,  H01L25/16 ,  G02B6/12

CPC classification number: G02B6/423 ,  G02B6/131 ,  G02B6/136 ,  G02B6/4232 ,  G02B6/4238 ,  G02B6/4251 ,  G02B6/4268 ,  G02B6/4274 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/121 ,  H01L25/16 ,  H01L25/162 ,  H01L25/167 ,  H01L25/50 ,  H01L31/125 ,  H01L31/18 ,  Y02P70/521

Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.