LARGE CAPACITY OPTICAL TRANSCEIVER MODULE
    2.
    发明申请
    LARGE CAPACITY OPTICAL TRANSCEIVER MODULE 有权
    大容量光收发模块

    公开(公告)号:US20150078758A1

    公开(公告)日:2015-03-19

    申请号:US14254552

    申请日:2014-04-16

    CPC classification number: H04B10/40 H04B10/504 H04J14/02

    Abstract: A large capacity optical transceiver module includes: an optical transmitter configured to convert electric signals input from an external source into optical signals to transmit the converted signals, in which the electric signals are directly modulated into optical signals in a plurality of sub groups to be multiplexed; and an optical receiver configured to receive optical signals from the external source, and to convert the received optical signals into electric signals to output the converted signals, in which the optical signals are demultiplexed in a plurality of sub groups to be converted into electric signals.

    Abstract translation: 一种大容量光收发模块,包括:光发射机,被配置为将从外部源输入的电信号转换为光信号,以将电信号直接调制成多个子组中的光信号, ; 以及光接收器,被配置为从外部源接收光信号,并将所接收的光信号转换为电信号以输出转换的信号,其中光信号在多个子组中解复用以转换为电信号。

    OPTICAL FIBER COUPLER
    7.
    发明申请

    公开(公告)号:US20220326444A1

    公开(公告)日:2022-10-13

    申请号:US17587194

    申请日:2022-01-28

    Abstract: An optical fiber coupler includes a plurality of optical fibers parallel to each other in a first direction, an optical fiber array block (FAB) configured to maintain a constant center-to-center distance between the plurality of optical fibers, and an optical waveguide block including a plurality of optical waveguides coupled to the plurality of optical fibers, respectively, and configured to transfer optical signals transmitted through the plurality of optical fibers connected to the optical FAB in a second direction in which a photonics chip is placed and which is different from the first direction.

    MANUFACTURING METHOD AND APPLICATION OF OPTICAL INTERCONNECTION MODULE

    公开(公告)号:US20220317395A1

    公开(公告)日:2022-10-06

    申请号:US17575981

    申请日:2022-01-14

    Abstract: A manufacturing method and application of an optical interconnection module are disclosed. According to example embodiments, by providing the method of manufacturing the optical interconnection module in which an optical fiber optical coupler is disposed at its lower portion by using the FOWLP process, it is possible to provide advantages such as lightness, thinness and compactness of the optical interconnection module, guarantee of signal integrity, and high yield in mass production. Further, it is possible to provide a structure providing an electrical ground to an electronic chip by mounting the electronic chip on ETB and capable of being used as a heat dissipation path.

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