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    Systems and methods for multiple mode voice and data communications using intelligently bridged TDM and packet buses and methods for performing telephony and data functions using the same
    5.
    发明授权
    Systems and methods for multiple mode voice and data communications using intelligently bridged TDM and packet buses and methods for performing telephony and data functions using the same 有权
    使用智能桥接的TDM和分组总线的多模式语音和数据通信的系统和方法以及使用其实现电话和数据功能的方法

    公开(公告)号：US06356554B1

    公开(公告)日：2002-03-12

    申请号：US09433809

    申请日：1999-11-03

    申请人： Scott K. Pickett ,  John T. Johnston ,  Edward T. Nelson

    发明人： Scott K. Pickett ,  John T. Johnston ,  Edward T. Nelson

    IPC分类号： H04L1256

    CPC分类号： H04L65/103 ,  H04L12/2856 ,  H04L12/2859 ,  H04L12/2874 ,  H04L12/2881 ,  H04L12/43 ,  H04L12/6418 ,  H04L29/06 ,  H04L29/06027 ,  H04L29/12009 ,  H04L61/00 ,  H04L65/1026 ,  H04L65/1036 ,  H04L65/104 ,  H04L65/1043 ,  H04L65/1069 ,  H04L67/00 ,  H04L69/329 ,  H04L2012/6459 ,  H04L2012/6472 ,  H04L2012/6481 ,  H04M3/2254 ,  H04M3/42314 ,  H04M3/42323 ,  H04M3/4936 ,  H04M3/51 ,  H04M3/533 ,  H04M3/54 ,  H04M3/56 ,  H04M7/006 ,  H04M7/1295 ,  H04M2203/2061 ,  H04Q3/0045 ,  H04Q3/72 ,  H04Q11/04 ,  H04Q2213/13034 ,  H04Q2213/1322 ,  H04Q2213/13377 ,  H04Q2213/13389

    摘要： Systems and methods by which voice/data communications may occur in multiple modes/protocols are disclosed. In particular, systems and methods are provided for multiple native mode/protocol voice and data transmissions and receptions with a computing system having a multi-bus structures including, for example, a TDM bus and a packet bus, and multi-protocol framing engines. Such systems preferably include subsystem functions such as PBX, voice mail and other telephony functions, LAN hub and data router. In preferred embodiments, a TDM bus and a packet bus are intelligently bridged and managed, thereby enabling such multiple mode/protocol voice and data transmissions to be intelligently managed and controlled with a single, integrated system. A computer or other processor includes a local area network controller, which provides routing and hub(s) for one or more packet networks. The computer also is coupled to a buffer/framer, which serves to frame/deframe data to/from the computer from TDM bus. The buffer/framer includes a plurality of framer/deframer engines, supporting, for example, ATM and HDLC framing/deframing. The buffer/framer is coupled to the TDM bus by way of a switch/multiplexer, which includes the capability to intelligently map data traffic between the buffer/framer and the TDM bus to various slots of the TDM frames. Preferably, a DSP pool is coupled to buffer/framer in a manner to provide various signal processing and telecommunications support, such as dial tone generation, DTMF detection and the like. The TDM bus is coupled to a various line/station cards, serving to interface the TDM bus with telephone, facsimiles and other telecommunication devices, and also with a various digital and/or analog WAN network services.

    摘要翻译： 公开了可以在多种模式/协议中发生语音/数据通信的系统和方法。 特别地，提供了用于具有包括例如TDM总线和分组总线以及多协议成帧引擎的多总线结构的计算系统的多个本机模式/协议语音和数据传输和接收的系统和方法。 这样的系统优选地包括诸如PBX，语音邮件和其他电话功能的子系统功能，LAN集线器和数据路由器。 在优选实施例中，TDM总线和分组总线被智能地桥接和管理，从而使得能够利用单个集成系统智能地管理和控制这种多模式/协议语音和数据传输。 计算机或其他处理器包括局域网控制器，其为一个或多个分组网络提供路由和集线器。 计算机还耦合到缓冲器/成帧器，其用于从TDM总线对/从计算机的数据进行帧/分帧。 缓冲器/成帧器包括多个成帧器/去帧引擎，支持例如ATM和HDLC成帧/去帧。 缓冲器/成帧器通过开关/多路复用器耦合到TDM总线，其包括将缓冲器/成帧器和TDM总线之间的数据业务智能地映射到TDM帧的各个时隙的能力。 优选地，DSP池以提供各种信号处理和电信支持的方式耦合到缓冲器/成帧器，例如拨号音生成，DTMF检测等。 TDM总线耦合到各种线/站卡，用于将TDM总线与电话，传真机和其他电信设备以及各种数字和/或模拟WAN网络服务进行接口。

    DEVICE IDENTIFICATION AND TEMPERATURE SENSOR CIRCUIT
    6.
    发明申请
    DEVICE IDENTIFICATION AND TEMPERATURE SENSOR CIRCUIT 有权

    公开(公告)号：US20130051427A1

    公开(公告)日：2013-02-28

    申请号：US13238003

    申请日：2011-09-21

    申请人： Shen Wang ,  Edward T. Nelson

    发明人： Shen Wang ,  Edward T. Nelson

    IPC分类号： G01K13/00 ,  G01K7/00

    CPC分类号： H04N5/232 ,  G01K7/01

    摘要： An integrated circuit includes a device identification circuit and a temperature sensor diode connected in parallel from a common node. The device identification circuit includes a resistor connected to a diode-connected transistor. The device identification circuit and the temperature sensor diode are adapted to not be simultaneously operating in an ON state. A first voltage is applied to the common node to place the device identification circuit in an ON state and place the temperature sensor diode in an OFF state to identify the integrated circuit. A second voltage is applied to the common node to place the device identification circuit in an OFF state and place the temperature sensor diode in an ON state to determine a temperature of the integrated circuit.

    DEVICE IDENTIFICATION AND TEMPERATURE SENSOR CIRCUIT
    7.
    发明申请
    DEVICE IDENTIFICATION AND TEMPERATURE SENSOR CIRCUIT 有权
    器件识别和温度传感器电路

    公开(公告)号：US20130049777A1

    公开(公告)日：2013-02-28

    申请号：US13238010

    申请日：2011-09-21

    申请人： Shen Wang ,  Edward T. Nelson

    发明人： Shen Wang ,  Edward T. Nelson

    IPC分类号： G01R27/08 ,  G01R5/22

    CPC分类号： H04N5/232 ,  G01K7/01

    摘要： An integrated circuit includes a device identification circuit and a temperature sensor diode connected in parallel from a common node. The device identification circuit includes a resistor connected to a diode-connected transistor. The device identification circuit and the temperature sensor diode are adapted to not be simultaneously operating in an ON state. A first voltage is applied to the common node to place the device identification circuit in an ON state and place the temperature sensor diode in an OFF state to identify the integrated circuit. A second voltage is applied to the common node to place the device identification circuit in an OFF state and place the temperature sensor diode in an ON state to determine a temperature of the integrated circuit.

    摘要翻译： 集成电路包括从公共节点并联连接的器件识别电路和温度传感器二极管。 器件识别电路包括连接到二极管连接的晶体管的电阻器。 设备识别电路和温度传感器二极管适于不处于ON状态。 将第一电压施加到公共节点以将器件识别电路置于ON状态，并将温度传感器二极管置于OFF状态以识别集成电路。 将第二电压施加到公共节点以将设备识别电路置于OFF状态，并将温度传感器二极管置于ON状态以确定集成电路的温度。

    METHOD FOR PRODUCING A LINEAR IMAGE SENSOR HAVING MULTIPLE OUTPUTS
    8.
    发明申请
    METHOD FOR PRODUCING A LINEAR IMAGE SENSOR HAVING MULTIPLE OUTPUTS 有权
    用于生产具有多个输出的线性图像传感器的方法

    公开(公告)号：US20120153133A1

    公开(公告)日：2012-06-21

    申请号：US12971743

    申请日：2010-12-17

    申请人： Edward T. Nelson ,  Shen Wang

    发明人： Edward T. Nelson ,  Shen Wang

    IPC分类号： G01J1/44

    CPC分类号： H04N5/361 ,  G01J3/2803 ,  H04N5/3692 ,  H04N5/3694 ,  H04N5/37213

    摘要： A Charge-Coupled Device (CCD) image sensor includes a linear array of photodetectors. The photodetectors in the linear array are arranged into distinct sub-arrays with each sub-array including two or more photodetectors. An output channel is connected to each sub-array of photodetectors. Each output channel includes a horizontal CCD shift register and an output structure connected to an end of the horizontal CCD shift register in a linear arrangement with respect to each other. Each successive output channel is disposed on an alternate side of the linear array. Every other output channel is disposed on an alternate side of the linear array. One or more dark reference pixels can be connected to one or more additional shift register elements in the horizontal CCD shift registers.

    摘要翻译： 电荷耦合器件（CCD）图像传感器包括光电检测器的线性阵列。 线性阵列中的光电检测器被布置成不同的子阵列，每个子阵列包括两个或更多个光电检测器。 输出通道连接到光电检测器的每个子阵列。 每个输出通道包括水平CCD移位寄存器和输出结构，其相对于彼此以线性排列连接到水平CCD移位寄存器的一端。 每个连续的输出通道设置在线性阵列的另一侧上。 每个其他输出通道设置在线性阵列的另一侧上。 一个或多个暗参考像素可以连接到水平CCD移位寄存器中的一个或多个附加移位寄存器元件。

    Charge coupled device (CCD) having high transfer efficiency at low temperature operation
    9.
    发明授权
    Charge coupled device (CCD) having high transfer efficiency at low temperature operation 失效
    电荷耦合器件（CCD）在低温工作时具有高转印效率

    公开(公告)号：US5241199A

    公开(公告)日：1993-08-31

    申请号：US988380

    申请日：1992-12-08

    申请人： Gilbert A. Hawkins ,  Edward T. Nelson ,  Christopher R. Hoople

    发明人： Gilbert A. Hawkins ,  Edward T. Nelson ,  Christopher R. Hoople

    IPC分类号： H01L29/10 ,  H01L29/768

    CPC分类号： H01L29/1062 ,  H01L29/76841

    摘要： A charge coupled device having a layer of a semiconductor material on a surface of a substrate body of a semiconductor material. The layer is of a material which can be epitaxially deposited on the body with good crystalline quality. The material of the layer has a conduction band and/or valence band which is different from that of the body so as to provide a discontinuity in the energy level of the conduction band and/or valence band at the junction of the layer and the body during the operation of the charge coupled device. At least one electrode is over and insulated from the layer. The discontinuity in the conduction band and/or valence band creates a well in which photogenerated charge is collected.

    摘要翻译： 一种电荷耦合器件，其在半导体材料的衬底主体的表面上具有半导体材料层。 该层是可以以良好的结晶质量外延沉积在人体上的材料。 该层的材料具有不同于本体的导带和/或价带，以便在层和体的接合处的导带和/或价带的能级提供不连续性 在电荷耦合器件的操作期间。 至少有一个电极与该层结合并绝缘。 导带和/或价带的不连续性产生了收集光生电荷的阱。

    Device identification and temperature sensor circuit
    10.
    发明授权
    Device identification and temperature sensor circuit 有权
    设备识别和温度传感器电路

    公开(公告)号：US08810267B2

    公开(公告)日：2014-08-19

    申请号：US13238010

    申请日：2011-09-21

    申请人： Shen Wang ,  Edward T. Nelson

    发明人： Shen Wang ,  Edward T. Nelson

    IPC分类号： G01R31/36 ,  H04N5/232 ,  G01K7/01

    CPC分类号： H04N5/232 ,  G01K7/01

    摘要： An integrated circuit includes a device identification circuit and a temperature sensor diode connected in parallel from a common node. The device identification circuit includes a resistor connected to a diode-connected transistor. The device identification circuit and the temperature sensor diode are adapted to not be simultaneously operating in an ON state. A first voltage is applied to the common node to place the device identification circuit in an ON state and place the temperature sensor diode in an OFF state to identify the integrated circuit. A second voltage is applied to the common node to place the device identification circuit in an OFF state and place the temperature sensor diode in an ON state to determine a temperature of the integrated circuit.

    摘要翻译： 集成电路包括从公共节点并联连接的器件识别电路和温度传感器二极管。 器件识别电路包括连接到二极管连接的晶体管的电阻器。 设备识别电路和温度传感器二极管适于不处于ON状态。 将第一电压施加到公共节点以将器件识别电路置于ON状态，并将温度传感器二极管置于OFF状态以识别集成电路。 将第二电压施加到公共节点以将设备识别电路置于OFF状态，并将温度传感器二极管置于ON状态以确定集成电路的温度。