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公开(公告)号:US20210285125A1
公开(公告)日:2021-09-16
申请号:US17258080
申请日:2019-07-05
Applicant: ELEMENT SIX TECHNOLOGIES LIMITED
Inventor: IAN FRIEL , KATHARINE LOUISE ATKINSON , DANIEL JAMES TWITCHEN
Abstract: A method of manufacturing synthetic diamond material using a chemical vapour deposition process, and a diamond obtained by such a method are described. The method comprises providing a freestanding synthetic single crystal diamond substrate wafer having a dislocation density of at least 107 cm−2. The synthetic single crystal diamond substrate wafer is located over a substrate holder within a chemical vapour deposition reactor. Process gases are fed into the reactor, the process gases including a gas comprising carbon. Crack-free synthetic diamond material is grown on a surface of the single crystal diamond substrate wafer at a temperature of at least 900° C. to a thickness of at least 0.5 mm and with lateral dimensions of at least 4 mm by 4 mm.
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公开(公告)号:US20230272551A1
公开(公告)日:2023-08-31
申请号:US18143557
申请日:2023-05-04
Applicant: ELEMENT SIX TECHNOLOGIES LIMITED
Inventor: IAN FRIEL , KATHARINE LOUISE ATKINSON , DANIEL JAMES TWITCHEN
CPC classification number: C30B25/205 , C30B25/105 , C30B25/16 , C30B29/04
Abstract: A method of manufacturing synthetic diamond material using a chemical vapour deposition process, and a diamond obtained by such a method are described. The method comprises providing a freestanding synthetic single crystal diamond substrate wafer having a dislocation density of at least 107cm−2. The synthetic single crystal diamond substrate wafer is located over a substrate holder within a chemical vapour deposition reactor. Process gases are fed into the reactor, the process gases including a gas comprising carbon. Crack-free synthetic diamond material is grown on a surface of the single crystal diamond substrate wafer at a temperature of at least 900° C. to a thickness of at least 0.5 mm and with lateral dimensions of at least 4 mm by 4 mm.
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