公开(公告)号：US20130292160A1

公开(公告)日：2013-11-07

申请号：US13939801

申请日：2013-07-11

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Suk YANG ,  In-Kyu YOU ,  Jae Bon KOO ,  Yong-Young NOH

IPC: H01L21/48 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02

CPC classification number: H01L21/4814 ,  H01L21/4867 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/105 ,  H05K3/125 ,  H05K3/4069 ,  H05K2203/1105 ,  H05K2203/125 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.

Abstract translation: 提供一种多层互连结构及其制造方法。 多层互连结构包括基板; 在基板上的第一布线; 第一布线上的层间绝缘层; 层间绝缘层上的第二布线; 以及通孔接触，其包括穿过所述第二布线和所述第一布线之间的所述层间绝缘层的至少一个导电丝，以电连接到所述第一布线和所述第二布线。