ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER
    3.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER 有权
    包含乙烯多嵌段共聚物的电子器件模块

    公开(公告)号:US20130112270A1

    公开(公告)日:2013-05-09

    申请号:US13667722

    申请日:2012-11-02

    IPC分类号: C08F210/02 H01L31/048

    摘要: An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

    摘要翻译: 电子设备模块包括:A.至少一个电子设备,例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料,聚合物材料包含乙烯多嵌段共聚物。 通常,聚烯烃材料是密度小于约0.90克/立方厘米(g / cc)的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件,或者它可以层压到器件的一个表面。 任选地,聚合物材料还可以包含焦烧抑制剂,并且该共聚物可以保持未交联或可以交联。

    DURABLE FOAM OF OLEFIN POLYMERS, METHODS OF MAKING FOAM AND ARTICLES PREPARED FROM SAME
    5.
    发明申请
    DURABLE FOAM OF OLEFIN POLYMERS, METHODS OF MAKING FOAM AND ARTICLES PREPARED FROM SAME 有权
    OLEFIN聚合物的耐用泡沫,制备泡沫的方法和由其制备的制品

    公开(公告)号:US20130116356A1

    公开(公告)日:2013-05-09

    申请号:US13714505

    申请日:2012-12-14

    IPC分类号: C08F210/02

    摘要: Olefin polymer-based, durable, open-cell foam compositions, structures and articles derived from same; methods for preparation of such foams; and use of the dry durable foams in various applications are disclosed. Further described is use of the foams and structures and articles made of same in absorption, filtration, insulation, cushioning and backing applications, and in particular for odor removal, hygiene and medical applications due to, among other properties, good absorption capabilities, softness and/or flexibility of the foams and their recyclable nature.

    摘要翻译: 烯烃聚合物基,耐久,开孔泡沫组合物,由其衍生的结构和制品; 制备这种泡沫的方法; 并且公开了在各种应用中使用干燥耐久泡沫。 进一步描述的是在吸收,过滤,绝缘,缓冲和背衬应用中使用由它们制成的泡沫和结构物以及特别是除臭,卫生和医疗应用的泡沫和结构物以及由此产生的良好的吸收能力,柔软度和 /或泡沫的灵活性及其可回收性质。

    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER
    8.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号:US20130118583A1

    公开(公告)日:2013-05-16

    申请号:US13667744

    申请日:2012-11-02

    IPC分类号: H01L31/048 H01L31/18

    摘要: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    摘要翻译: 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料,所述聚合材料包含(1)聚烯烃共聚物, (a)小于约0.90g / cc的密度,(b)通过ASTM D-882-02测量的小于约150兆帕(mPa)的2%割线模量中的至少一个),(c) 熔点小于约95℃,(d)基于聚合物的重量,至少约15至小于约50重量%的烯烃含量,(e)小于约-35℃的Tg, 和(f)至少约50的SCBDI,(2)任选的自由基引发剂,例如过氧化物或偶氮化合物,或光引发剂,例如二苯甲酮,和(3)任选的助剂。 通常,聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地,聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂,并且共聚物可保持未交联或交联。

    Electronic device module comprising polyolefin copolymer
    9.
    发明授权
    Electronic device module comprising polyolefin copolymer 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号:US08592679B2

    公开(公告)日:2013-11-26

    申请号:US13667744

    申请日:2012-11-02

    IPC分类号: H01L31/042 H02N6/00 H01L31/00

    摘要: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    摘要翻译: 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料,所述聚合材料包含(1)聚烯烃共聚物, (a)小于约0.90g / cc的密度,(b)通过ASTM D-882-02测量的小于约150兆帕(mPa)的2%割线模量中的至少一个),(c) 熔点小于约95℃,(d)基于聚合物的重量,至少约15至小于约50重量%的烯烃含量,(e)小于约-35℃的Tg, 和(f)至少约50的SCBDI,(2)任选的自由基引发剂,例如过氧化物或偶氮化合物,或光引发剂,例如二苯甲酮,和(3)任选的助剂。 通常,聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地,聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂,并且共聚物可保持未交联或交联。