公开(公告)号：US20210305167A1

公开(公告)日：2021-09-30

申请号：US17345174

申请日：2021-06-11

申请人： Dialog Semiconductor (UK) Limited

发明人： Ernesto Gutierrez, III ,  Jesus Mennen Belonio ,  Eric Hu ,  Melvin Martin ,  Jerry Li ,  Francisco Vergara Cadacio

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L25/16 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065

摘要： A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output.

公开(公告)号：US20200251350A1

公开(公告)日：2020-08-06

申请号：US16265009

申请日：2019-02-01

申请人： Dialog Semiconductor (UK) Limited

发明人： Ernesto Gutierrez, III ,  Jesus Mennen Belonio, JR. ,  Eric Hu ,  Melvin Martin ,  Jerry Li ,  Francisco Vergara Cadacio

IPC分类号： H01L21/48 ,  H01L25/16 ,  H01L23/498 ,  H01L23/00

摘要： A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output.

公开(公告)号：US11532489B2

公开(公告)日：2022-12-20

申请号：US17345174

申请日：2021-06-11

申请人： Dialog Semiconductor (UK) Limited

发明人： Ernesto Gutierrez, III ,  Jesus Mennen Belonio, Jr. ,  Eric Hu ,  Melvin Martin ,  Jerry Li ,  Francisco Vergara Cadacio

IPC分类号： H01L21/48 ,  H01L25/16 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/538 ,  H01L21/683

摘要： A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output.

公开(公告)号：US11075167B2

公开(公告)日：2021-07-27

申请号：US16265009

申请日：2019-02-01

申请人： Dialog Semiconductor (UK) Limited

发明人： Ernesto Gutierrez, III ,  Jesus Mennen Belonio, Jr. ,  Eric Hu ,  Melvin Martin ,  Jerry Li ,  Francisco Vergara Cadacio

IPC分类号： H01L23/48 ,  H01L23/538 ,  H01L21/48 ,  H01L25/16 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065

摘要： A substrate is provided having a top side and a bottom side, having redistribution layers therein, having at least one copper pillar connected to the redistribution layers on the top side and at least one copper pillar connected to the redistribution layers on the bottom side, and having at least one cavity extending partially into the bottom side of the substrate. At least one passive component is mounted onto the copper pillar on the top side and embedded in a molding compound. At least one silicon die is mounted in the cavity wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers. At least one solder ball is mounted on the at least one copper pillar on the bottom side of the substrate to provide package output.