公开(公告)号：US20100143706A1

公开(公告)日：2010-06-10

申请号：US12633776

申请日：2009-12-08

申请人： Der-Jen Sun ,  Yen-Huey Hsu ,  Ming-Hsiang Chen ,  Hsiu-Yeh Hu

发明人： Der-Jen Sun ,  Yen-Huey Hsu ,  Ming-Hsiang Chen ,  Hsiu-Yeh Hu

IPC分类号： B32B5/16 ,  C25D5/56 ,  B32B15/08

CPC分类号： B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B2264/102 ,  B32B2264/107 ,  B32B2307/302 ,  B32B2457/00 ,  C25D7/00 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/257 ,  Y10T428/31681

摘要： Disclosed herein are a polyimide laminate and a method for fabricating the same. In the disclosed method, a polyimide film having a thermally-conductive filler distributed homogenously therein is prepared, the polyimide film is characterized in having a thermal conductivity greater than 0.3 W/m-° C. Then, at least one metal film is subsequently deposited on one or both sides of the polyimide film by electroplating, electroless plating, evaporation, sputtering or lamination and thereby forming the desired polyimide laminate.

摘要翻译： 本文公开了聚酰亚胺层压板及其制造方法。 在所公开的方法中，制备了具有均匀分布在其中的导热填料的聚酰亚胺膜，其特征在于具有大于0.3W / m·℃的导热率。然后，随后沉积至少一种金属膜 通过电镀，化学镀，蒸发，溅射或层压在聚酰亚胺膜的一侧或两侧上，从而形成所需的聚酰亚胺层压体。

公开(公告)号：US20090061243A1

公开(公告)日：2009-03-05

申请号：US12007360

申请日：2008-01-09

申请人： Der-Jen Sun ,  Yen-Huey Hsu

发明人： Der-Jen Sun ,  Yen-Huey Hsu

IPC分类号： B32B15/08 ,  B05D5/12

CPC分类号： B05D7/14 ,  B05D1/26 ,  B05D1/30 ,  B05D3/0254 ,  B05D3/0466 ,  B05D2202/10 ,  B05D2202/25 ,  B05D2202/45 ,  B05D2252/02 ,  B05D2601/20 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/34 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/0759 ,  Y10T428/31681

摘要： A method for manufacturing a metal clad laminate is provided. A poly(amic acid) solution is first formed. The poly(amic acid) solution includes a heat-conductive filler, a poly(amic acid) and a solvent. The thermal conductivity of the heat-conductive filler is higher than 10 W/m-° C. The content of the heat-conductive filler is about 10˜90 wt % of the solid content of the poly(amic acid) solution. Then, the poly(amic acid) solution is coated on a metal foil. Finally, the poly(amic acid) solution on the metal foil is heated to form a polyimide layer on the metal foil.

摘要翻译： 提供一种制造覆金属层压板的方法。 首先形成聚（酰胺酸）溶液。 聚（酰胺酸）溶液包括导热填料，聚（酰胺酸）和溶剂。 导热填料的导热率高于10W / m-℃。导热填料的含量约为聚（酰胺酸）溶液固体含量的10〜90wt％。 然后，将聚（酰胺酸）溶液涂覆在金属箔上。 最后，加热金属箔上的聚（酰胺酸）溶液，在金属箔上形成聚酰亚胺层。

公开(公告)号：US6133408A

公开(公告)日：2000-10-17

申请号：US231669

申请日：1999-01-15

申请人： Chien-Hwa Chiu ,  Der-Jen Sun ,  Yen-Huey Hsu ,  Fu-Ti Shiang ,  Chien-Hsiang Chen ,  Paul S. C. Wu

发明人： Chien-Hwa Chiu ,  Der-Jen Sun ,  Yen-Huey Hsu ,  Fu-Ti Shiang ,  Chien-Hsiang Chen ,  Paul S. C. Wu

IPC分类号： B32B15/08 ,  C08G73/10 ,  C09J179/08 ,  H05K1/03 ,  B32B3/00

CPC分类号： H05K1/0346 ,  B32B15/08 ,  C08G73/1032 ,  C09J179/08 ,  H05K2201/0154 ,  H05K2203/065 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A polyimide resin having good thermal stability and good adhesion to a metal foil is disclosed. The polyimide resin is prepared by dissolving at least one diamine in a polar aprotic solvent followed by the addition of an aromatic tetracarboxylic acid dianhydride to the solution of the aromatic diamines to prepare a polyamic acid solution, imidizing this solution to a polyimide resin by heating at a temperature above 250.degree. C., the polar aprotic solvent comprising at least 1 weight % of acetone. Polyimide laminates with a metal foil, such as a copper foil, are also described. The laminates may be used to form flexible printed circuit boards.

摘要翻译： 公开了具有良好的热稳定性和对金属箔的良好粘附性的聚酰亚胺树脂。 通过将至少一种二胺溶解在极性非质子溶剂中，然后在芳族二胺溶液中加入芳族四羧酸二酐制备聚酰胺酸溶液，将该溶液酰亚胺化成聚酰亚胺树脂，通过在 温度高于250℃，极性非质子溶剂包含至少1重量％的丙酮。 还描述了具有诸如铜箔的金属箔的聚酰亚胺层压体。 层压板可用于形成柔性印刷电路板。

公开(公告)号：US08691131B2

公开(公告)日：2014-04-08

申请号：US13618670

申请日：2012-09-14

申请人： Yen-Huey Hsu ,  Der-Jen Sun

发明人： Yen-Huey Hsu ,  Der-Jen Sun

IPC分类号： B29C69/02

CPC分类号： B29D7/01 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K3/36 ,  C08L79/08

摘要： Disclosed herein is a polyimide film having inorganic particles. The polyimide film is 12-250 μm in thickness. The polyimide film includes about 50-90 weight parts of polyimide and about 10-50 weight parts of the inorganic particles. The particle size of each of the inorganic particles is about 0.1 μm to about 5 μm. The polyimide film is characterized in that the thermal expansion coefficient is equal to or less than 30 ppm/° C. in any direction, the difference between two thermal expansion coefficients in two mutually perpendicular directions on the film surface is less than 10 ppm/° C., and the Young's modulus of the polyimide film is greater than 4 GPa in any direction. The dimensional stability of the polyimide film measured by the standard of IPC-TM-650 is less than 0.10% in any direction. A method for manufacturing the polyimide film is disclosed as well.

摘要翻译： 本文公开了具有无机颗粒的聚酰亚胺膜。 聚酰亚胺膜的厚度为12-250μm。 聚酰亚胺膜包括约50-90重量份的聚酰亚胺和约10-50重量份的无机颗粒。 无机粒子的粒径为0.1μm〜5μm左右。 聚酰亚胺膜的特征在于，热膨胀系数在任何方向等于或小于30ppm /℃，膜表面上两个相互垂直的方向上的两个热膨胀系数之间的差小于10ppm /° C.，聚酰亚胺膜的杨氏模量在任何方向均大于4GPa。 通过IPC-TM-650标准测定的聚酰亚胺膜的尺寸稳定性在任何方向均小于0.10％。 还公开了制造聚酰亚胺膜的方法。

公开(公告)号：US20130273254A1

公开(公告)日：2013-10-17

申请号：US13616047

申请日：2012-09-14

申请人： Yen-Huey Hsu ,  Der-Jen Sun

发明人： Yen-Huey Hsu ,  Der-Jen Sun

IPC分类号： C08L79/08 ,  C08K3/04 ,  C08K3/36 ,  B05D7/24 ,  B05D3/02 ,  B82Y30/00

CPC分类号： C08K3/04 ,  B82Y30/00 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08K3/36 ,  C09D179/08 ,  C08K3/34

摘要： A black matte polyimide film having inorganic particles and carbon particles is provided. The polyimide film has a thickness ranging from 12 μm to 250 μm. The polyimide film includes 1 wt % to 49 wt % of the carbon particles and 1 wt % to 49 wt % of the inorganic particles. Each of the carbon particles and the inorganic particles respectively has a particle size ranging from about 0.1 μm to about 10 μm. The polyimide film is characterized in that the 60° lustrousness is equal to or less than 60 Gloss Unit (GU). The thermal expansion coefficient (CTE) is equal to or less than 30 ppm/° C. The light transmittance is equal to or less than 10%. A method for manufacturing the polyimide film is disclosed as well.

摘要翻译： 提供了具有无机粒子和碳粒子的黑色无光泽聚酰亚胺膜。 聚酰亚胺膜的厚度范围为12〜250μm。 聚酰亚胺膜包括1重量％至49重量％的碳颗粒和1重量％至49重量％的无机颗粒。 碳颗粒和无机颗粒中的每一个分别具有约0.1μm至约10μm的粒度。 聚酰亚胺膜的特征在于，60°光泽度等于或小于60光泽单位（GU）。 热膨胀系数（CTE）等于或小于30ppm /℃。透光率等于或小于10％。 还公开了制造聚酰亚胺膜的方法。

公开(公告)号：US20070164400A1

公开(公告)日：2007-07-19

申请号：US11309689

申请日：2006-09-12

申请人： Ching-Yu Chou ,  Yen-Huey Hsu ,  Wei-Yuan Chen

发明人： Ching-Yu Chou ,  Yen-Huey Hsu ,  Wei-Yuan Chen

IPC分类号： H01L23/58

CPC分类号： H01L51/0005 ,  H01L27/3295

摘要： A substrate structure includes a substrate and a number of banks formed on the substrate. The banks and the substrate cooperatively define a number of accommodating rooms. The accommodating rooms are configured for accommodating ink. A spread-control layer is formed on the substrate beneath the accommodating rooms. The spread-control layer enables the ink applied on the spread-control layer to spread at a lower spreading rate than the rate on the substrate without the spread-control layer formed thereon.

摘要翻译： 衬底结构包括衬底和形成在衬底上的多个堤。 银行和基板协调地界定了许多容纳室。 容纳室被配置为容纳墨水。 扩展控制层形成在容纳室下方的基板上。 扩展控制层能够使涂布在扩展控制层上的油墨以比基板上的速率更低的扩展速率扩展，而不会在其上形成扩展控制层。