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公开(公告)号：US5121870A
公开(公告)日：1992-06-16
申请号：US692884
申请日：1991-04-29
IPC分类号： B23Q15/14 , B23K20/00 , B23K20/10 , G05B19/4093 , H01L21/00
CPC分类号： H01L24/78 , B23K20/007 , B23K20/10 , H01L2224/78301 , H01L2924/00014 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/19043
摘要： In bonding a number of pads which may have different heights within a predetermined tolerance the bonding tool (28, 24, 14, 10) is moved in slow speed search mode (70) to contact the first pad (P.sub.1) and store the height (H.sub.1) of the first pad (P.sub.1). After a predetermined amount of continued overtravel (OT.sub.1) the bond is performed and the tool raised. Operations on other pads may occur at this point. The tool is then moved to a point above the location of the second pad. The tool is moved down to the second pad without a search mode but to a second pad target height (H.sub.1 +OT.sub.2) that is the sum of the sensed height of the preceding pad and an overtravel distance. The approach of the tool to the second pad is done at high speed (84,88) and senses and stores the point of contact, or the actual sensed height of the second pad, for use in determining a target height for the high speed approach to the next pad, thereby eliminating the slow speed search required for all pads but the first on a part.
摘要翻译： 在将可能具有不同高度的多个焊盘接合在预定公差内时，接合工具（28,24,14,10）以慢速搜索模式（70）移动以接触第一焊盘（P1）并存储高度 H1）的第一垫（P1）。 在预定量的连续超程（OT1）之后，执行结合并且工具升高。 此时可能会发生其他垫的操作。 然后将工具移动到第二个垫的位置上方的一个点。 工具在没有搜索模式的情况下向下移动到第二衬垫，而是向下移动到第二衬垫目标高度（H1 + OT2），其为先前焊盘的感测高度和超行距离的总和。 工具到第二垫的方法是以高速（84,88）进行的，并感测并存储接触点或第二垫的实际感测高度，以用于确定高速方法的目标高度 到下一个垫，从而消除所有垫所需的慢速搜索，而不是零件上的第一个。
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2.发明授权公开(公告)号：US07845542B2
公开(公告)日：2010-12-07
申请号：US11233553
申请日：2005-09-22
CPC分类号： B23K20/004 , B23K2101/40 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/05599 , H01L2224/4809 , H01L2224/48095 , H01L2224/48465 , H01L2224/78302 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01052 , H01L2924/01082 , H01L2924/14 , Y10T156/1002 , H01L2224/45099 , H01L2924/00
摘要： A process control procedure for a bonding process includes predetermining a deformation limit and a deforming time limit is for deforming a bonding precursor member. The bonding precursor member is deformed while monitoring instantaneous deformation values and instantaneous deforming time values for the bonding precursor member. A deforming shut-down time value is set at an instantaneous deforming time value corresponding to an occurrence of a first condition or a second condition. The first condition is an instantaneous deformation value for the bonding precursor member reaching the deformation limit and the second condition is an instantaneous deforming time value for the bonding precursor member reaching the deforming time limit. Deformation of the bonding precursor member is shut down at the deforming shut-down time value, thereby producing a deformed bond member from the bonding precursor member.
摘要翻译： 用于接合工艺的工艺控制程序包括预先确定变形极限，并且变形时间限制用于使接合前体构件变形。 接合前体构件在监测接合前体构件的瞬时变形值和瞬时变形时间值的同时变形。 变形关闭时间值被设定为对应于第一状态或第二状态的发生的瞬时变形时间值。 第一条件是接合前体部件达到变形极限的瞬时变形值，第二条件是接合前体部件达到变形时限的瞬时变形时间值。 接合前体构件的变形在变形关闭时间值处停止，从而从接合前体构件产生变形的接合构件。
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公开(公告)号：US4977494A
公开(公告)日：1990-12-11
申请号：US312105
申请日：1989-02-17
IPC分类号： G05B15/02 , G05B19/414 , G05D3/12
CPC分类号： G05B19/4141 , G05B2219/33167 , G05B2219/33337 , G05B2219/34042 , G05B2219/34076 , G05B2219/34205
摘要： A system bus (13) carrying multidimensional path data interfaces with a plurality of local microprocessors (24), one for each dimension, through a plurality of dual access memory structures (21), one for each local microprocessor (24). A local arbiter (35) controls access to each dual access memory structure (21), facilitating elimination of wait states in data transfers between the bus (13) and memory (21) and between the local microprocessor (24) and memory (21). The arbiter (35) is implemented using a programmable logic device state machine approach, which implements a mode of operation wherein the circuitry is armed for a transfer between a local microprocessor (24) and the dual access memory (21) and accomplishes such transfer with no wait states. The state machines and dual access memory (21) are driven by a clock which is twice as fast as that driving the local microprocessor (24) and the state machine implementation utilizes this fact to insure memory access to both the system bus (13), and the local microprocessor (24) with priority going to the local microprocessor (24).
摘要翻译： 一种系统总线（13），其通过多个双重访问存储器结构（21）与多个本地微处理器（24）携带多维路径数据接口，每个维度一个，每个本地微处理器一个用于每个本地微处理器（24）。 本地仲裁器（35）控制对每个双重访问存储器结构（21）的访问，便于消除总线（13）和存储器（21）之间以及本地微处理器（24）和存储器（21）之间的数据传输中的等待状态， 。 仲裁器（35）使用可编程逻辑器件状态机方法来实现，该方法实现了一种操作模式，其中电路被布防用于本地微处理器（24）和双存取存储器（21）之间的传输，并且完成这样的转移 没有等待状态。 状态机和双重存取存储器（21）由驱动本地微处理器（24）的两倍的时钟驱动，并且状态机实现利用该事实来确保存储器对系统总线（13）， 和具有优先权的本地微处理器（24）到本地微处理器（24）。
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公开(公告)号：US4893068A
公开(公告)日：1990-01-09
申请号：US271477
申请日：1988-11-15
申请人： Daniel D. Evans, Jr.
发明人： Daniel D. Evans, Jr.
IPC分类号： G05B19/23
CPC分类号： G05B19/232 , G05B2219/37313 , G05B2219/41177 , G05B2219/41434 , G05B2219/42035 , G05B2219/42104
摘要： A digital servo system for causing a mechanical element (48) to track a desired path and hold various positions along the path and employing a lead/lag integrator (18) in parallel with a feedback control loop. The input to the integrator (18) is switched between velocity (V.sub.EK) error during pathtracking and position error (E.sub.K) during holding to increase the resistance of the mechanical element (48) to position changes caused by outside forces during both pathtracking and holding. The integrator function employed uses a term (U.sub.integrator(k-1)) representing a previous integrator output value to assist in smoothing perturbations caused by switching between position and velocity error.
摘要翻译： 一种数字伺服系统，用于使机械元件（48）跟踪所需路径并保持沿着路径的各种位置并且采用与反馈控制回路并联的引导/滞后积分器（18）。 积分器（18）的输入在轨迹跟踪期间的速度（VEK）误差和保持期间的位置误差（EK）之间切换，以增加机械元件（48）的阻力，以便在轨迹跟踪期间由外力引起的位置变化。 所采用的积分器功能使用表示先前积分器输出值的项（Uintegrator（k-1））来协助由位置和速度误差之间的切换引起的平滑扰动。
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公开(公告)号：US6102275A
公开(公告)日：2000-08-15
申请号：US113722
申请日：1998-07-10
CPC分类号： H01L24/78 , B23K20/025 , H01L2224/48091 , H01L2224/48465 , H01L2224/78301 , H01L2224/85181 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/0106 , H01L2924/14
摘要： A bond head is provided for a wire bonding machine having a linear axis frame, a rotary axis frame, a bond tool and a wire clamp. The linear axis frame is vertically linearly displacable along a linear axis, while the rotary axis frame is rotationally displacable along a rotary axis. A pivotal connector is provided which pivotally connects the rotary axis frame to the linear axis frame, enabling the rotary axis frame to rotate independent of linear displacement of the linear axis frame. The bond tool is connected to the rotary axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame and rotationally displacable in response to rotational displacement of the rotary axis frame. The wire clamp is connected to the linear axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame, while the wire clamp is maintained rotationally stationary during rotational displacement of the rotary axis frame. The bond head also includes a linear motion assembly and a rotary motion assembly. The linear motion assembly has a linear driver, a linear position detector and a linear driver controller. The rotary motion assembly correspondingly has a rotary driver, a rotary position detector and a rotary driver controller.
摘要翻译： 提供了一种用于具有线性轴框架，旋转轴框架，接合工具和线夹的引线接合机的接合头。 线性轴框架沿着线性轴线可垂直地直线排列，而旋转轴框架可沿着旋转轴线旋转移位。 提供了一种枢转连接器，其将旋转轴框架枢转地连接到线性轴框架，使得旋转轴框架能够独立于线性轴框架的线性位移而旋转。 接合工具连接到旋转轴框架，并且响应于线性轴框架的垂直线性位移而垂直地线性地置换，并且响应于旋转轴框架的旋转位移而可旋转移位。 线夹连接到线性轴框架，并且响应于线性轴框架的垂直线性位移而垂直线性地置换，同时线夹在旋转轴框架的旋转位移期间保持旋转稳定。 接合头还包括线性运动组件和旋转运动组件。 线性运动组件具有线性驱动器，线性位置检测器和线性驱动器控制器。 旋转运动组件相应地具有旋转驱动器，旋转位置检测器和旋转驱动器控制器。
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公开(公告)号：US5523956A
公开(公告)日：1996-06-04
申请号：US323406
申请日：1994-10-14
CPC分类号： B23K31/12 , B23K20/10 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/78 , H01L2224/78301 , H01L2224/85205 , H01L2224/85207 , H01L2224/859 , H01L2924/00014 , H01L2924/14
摘要： A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine's computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close, for example, to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test. When the carriage ascends, the distance it travels before closure of the contacts ( 23, 24) is used as a measure of bond deformation and, hence, bond quality.
摘要翻译： 一种焊接质量监测的方法，其中粘合机配有包括一对触点（23,24）的触地装置，所述触点通常由接合头架（13）升高和降低的接合工具（27）触地时打开， 。 当工具（27）朝向接合面（31）下降时，接合机的计算机（61）进行测试（103）以感测通过打开接触件（23,24）而产生的触地信号的产生。 如果感测到触地，则托架（13）进入超行程位置。 在达到超行程位置时，执行第二测试（108）以确认触地，然后将能量施加到债券现场。 在能量施加期间，检查触地机构的逻辑状态以确保触点不闭合，例如，以便在接合期间检查施加不足的力。 如果感测到触点闭合，则记录粘合点位置以进行进一步检查，例如非破坏性拉力测试。 当滑架上升时，其在接触件（23,24）闭合之前行进的距离被用作粘合变形的量度，因此用作粘结质量。
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公开(公告)号：US5459672A
公开(公告)日：1995-10-17
申请号：US15271
申请日：1993-02-05
CPC分类号： B23K31/12 , B23K20/10 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/78 , H01L2224/78301 , H01L2224/85205 , H01L2224/85207 , H01L2224/859 , H01L2924/00014 , H01L2924/14
摘要： A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine's computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close for example to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test. When the carriage ascends, the distance it travels before closure of the contacts ( 23, 24) is used as a measure of bond deformation and, hence, bond quality.
摘要翻译： 一种焊接质量监测的方法，其中粘合机配有包括一对触点（23,24）的触地装置，所述触点通常由接合头架（13）升高和降低的接合工具（27）触地时打开， 。 当工具（27）朝向接合面（31）下降时，接合机的计算机（61）进行测试（103）以感测通过打开接触件（23,24）而产生的触地信号的产生。 如果感测到触地，则托架（13）进入超行程位置。 在达到超行程位置时，执行第二测试（108）以确认触地，然后将能量施加到债券现场。 在能量施加期间，检查触地机构的逻辑状态以确保触点例如不接合以检查在接合期间是否施加不足的力。 如果感测到触点闭合，则记录粘合点位置以进行进一步检查，例如非破坏性拉力测试。 当滑架上升时，其在接触件（23,24）闭合之前行进的距离被用作粘合变形的量度，因此用作粘结质量。
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公开(公告)号：US5398265A
公开(公告)日：1995-03-14
申请号：US243052
申请日：1994-05-16
IPC分类号： G06F1/24
CPC分类号： G06F1/24
摘要： In a system wherein a system master (11) communicates with a plurality of subsystems (13, 25, 27, 29), each subsystem (13, 25, 27, 29) is associated with a unique reset address and a reset circuit which recognizes that reset address and generates a reset signal. Each reset circuit includes an address decoder (15) for decoding the reset address to produce a signal which closes a logic gate switch (19). The logic gate switch (19) is repeatedly closed in response to repeated assertions of the address to successively discharge the voltage on a capacitor (C). When the capacitor voltage is discharged to a selected level, a buffer level detector circuit (23) generates the reset signal.
摘要翻译： 在系统主机（11）与多个子系统（13,25,27,29）通信的系统中，每个子系统（13,25,27,29）与唯一的复位地址和复位电路相关联，该电路识别 该复位地址并产生复位信号。 每个复位电路包括用于解码复位地址以产生闭合逻辑门开关（19）的信号的地址解码器（15）。 逻辑门开关（19）响应于地址的重复断言而重复关闭，以连续放电电容器（C）上的电压。 当电容器电压被放电到选定电平时，缓冲电平检测器电路（23）产生复位信号。
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公开(公告)号：US5148967A
公开(公告)日：1992-09-22
申请号：US729963
申请日：1991-07-15
CPC分类号： H01L24/85 , B23K20/007 , H01L24/78 , H01L2224/48463 , H01L2224/78301 , H01L2224/78823 , H01L2224/85 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01082 , H01L2924/3011
摘要： Apparatus and method for detecting missing interconnect material. The distance traveled by a bonding tool is measured while the interconnect material is being bonded to a site. Unless it exceeds a predetermined threshold, a signal is generated indicating missing interconnect material. A pivoting system associated mating electrical contacts, and a measurement/comparator are advantageously employed to facilitate this measurement.
摘要翻译： 用于检测缺失的互连材料的装置和方法。 在将互连材料粘合到部位的同时测量由粘合工具行进的距离。 除非超过预定阈值，否则产生指示缺少互连材料的信号。 有利地采用了一种相关联的电气触点的枢转系统和一个测量/比较器来促进这种测量。
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10.发明授权Robot axis controller employing feedback and open loop (feedforward) control 失效采用反馈和开环（前馈）控制的机器人轴控制器
公开(公告)号：US4912753A
公开(公告)日：1990-03-27
申请号：US177564
申请日：1988-04-04
申请人： Daniel D. Evans, Jr.
发明人： Daniel D. Evans, Jr.
CPC分类号： G05B19/39
摘要： A digital robotic axis controller which employs a digital processor to apply the inverse of a plant model transfer function to positional information representative of a target path to generate a feed forward position control signal and to combine an error signal with the positional information to generate a feedback control signal. The feed forward and feedback control signals are combined to produce a total position control signal which is supplied to a digital-to-analog converter and then to a plant comprising an amplifier, a motor for establishing the actual position of a robotic member, and an encoder for deriving the error signal from the motor position. In application, a number of such plants are controlled to achieve a coordinated multidimensional movement with increased accuracy.
摘要翻译： 一种数字机器人轴控制器，其使用数字处理器将工厂模型传递函数的反向应用于表示目标路径的位置信息，以产生前馈位置控制信号，并将误差信号与位置信息组合以产生反馈 控制信号。 前馈和反馈控制信号被组合以产生总位置控制信号，该总位置控制信号被提供给数模转换器，然后被提供给包括放大器，用于确定机器人构件的实际位置的电动机的设备，以及 用于从电机位置导出误差信号的编码器。 在应用中，多个这样的植物被控制以实现具有更高精度的协调的多维运动。
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