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公开(公告)号：US6102275A
公开(公告)日：2000-08-15
申请号：US113722
申请日：1998-07-10
CPC分类号： H01L24/78 , B23K20/025 , H01L2224/48091 , H01L2224/48465 , H01L2224/78301 , H01L2224/85181 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/0106 , H01L2924/14
摘要： A bond head is provided for a wire bonding machine having a linear axis frame, a rotary axis frame, a bond tool and a wire clamp. The linear axis frame is vertically linearly displacable along a linear axis, while the rotary axis frame is rotationally displacable along a rotary axis. A pivotal connector is provided which pivotally connects the rotary axis frame to the linear axis frame, enabling the rotary axis frame to rotate independent of linear displacement of the linear axis frame. The bond tool is connected to the rotary axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame and rotationally displacable in response to rotational displacement of the rotary axis frame. The wire clamp is connected to the linear axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame, while the wire clamp is maintained rotationally stationary during rotational displacement of the rotary axis frame. The bond head also includes a linear motion assembly and a rotary motion assembly. The linear motion assembly has a linear driver, a linear position detector and a linear driver controller. The rotary motion assembly correspondingly has a rotary driver, a rotary position detector and a rotary driver controller.
摘要翻译： 提供了一种用于具有线性轴框架，旋转轴框架，接合工具和线夹的引线接合机的接合头。 线性轴框架沿着线性轴线可垂直地直线排列，而旋转轴框架可沿着旋转轴线旋转移位。 提供了一种枢转连接器，其将旋转轴框架枢转地连接到线性轴框架，使得旋转轴框架能够独立于线性轴框架的线性位移而旋转。 接合工具连接到旋转轴框架，并且响应于线性轴框架的垂直线性位移而垂直地线性地置换，并且响应于旋转轴框架的旋转位移而可旋转移位。 线夹连接到线性轴框架，并且响应于线性轴框架的垂直线性位移而垂直线性地置换，同时线夹在旋转轴框架的旋转位移期间保持旋转稳定。 接合头还包括线性运动组件和旋转运动组件。 线性运动组件具有线性驱动器，线性位置检测器和线性驱动器控制器。 旋转运动组件相应地具有旋转驱动器，旋转位置检测器和旋转驱动器控制器。
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公开(公告)号：US5121870A
公开(公告)日：1992-06-16
申请号：US692884
申请日：1991-04-29
IPC分类号： B23Q15/14 , B23K20/00 , B23K20/10 , G05B19/4093 , H01L21/00
CPC分类号： H01L24/78 , B23K20/007 , B23K20/10 , H01L2224/78301 , H01L2924/00014 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/19043
摘要： In bonding a number of pads which may have different heights within a predetermined tolerance the bonding tool (28, 24, 14, 10) is moved in slow speed search mode (70) to contact the first pad (P.sub.1) and store the height (H.sub.1) of the first pad (P.sub.1). After a predetermined amount of continued overtravel (OT.sub.1) the bond is performed and the tool raised. Operations on other pads may occur at this point. The tool is then moved to a point above the location of the second pad. The tool is moved down to the second pad without a search mode but to a second pad target height (H.sub.1 +OT.sub.2) that is the sum of the sensed height of the preceding pad and an overtravel distance. The approach of the tool to the second pad is done at high speed (84,88) and senses and stores the point of contact, or the actual sensed height of the second pad, for use in determining a target height for the high speed approach to the next pad, thereby eliminating the slow speed search required for all pads but the first on a part.
摘要翻译： 在将可能具有不同高度的多个焊盘接合在预定公差内时，接合工具（28,24,14,10）以慢速搜索模式（70）移动以接触第一焊盘（P1）并存储高度 H1）的第一垫（P1）。 在预定量的连续超程（OT1）之后，执行结合并且工具升高。 此时可能会发生其他垫的操作。 然后将工具移动到第二个垫的位置上方的一个点。 工具在没有搜索模式的情况下向下移动到第二衬垫，而是向下移动到第二衬垫目标高度（H1 + OT2），其为先前焊盘的感测高度和超行距离的总和。 工具到第二垫的方法是以高速（84,88）进行的，并感测并存储接触点或第二垫的实际感测高度，以用于确定高速方法的目标高度 到下一个垫，从而消除所有垫所需的慢速搜索，而不是零件上的第一个。
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公开(公告)号：US4977494A
公开(公告)日：1990-12-11
申请号：US312105
申请日：1989-02-17
IPC分类号： G05B15/02 , G05B19/414 , G05D3/12
CPC分类号： G05B19/4141 , G05B2219/33167 , G05B2219/33337 , G05B2219/34042 , G05B2219/34076 , G05B2219/34205
摘要： A system bus (13) carrying multidimensional path data interfaces with a plurality of local microprocessors (24), one for each dimension, through a plurality of dual access memory structures (21), one for each local microprocessor (24). A local arbiter (35) controls access to each dual access memory structure (21), facilitating elimination of wait states in data transfers between the bus (13) and memory (21) and between the local microprocessor (24) and memory (21). The arbiter (35) is implemented using a programmable logic device state machine approach, which implements a mode of operation wherein the circuitry is armed for a transfer between a local microprocessor (24) and the dual access memory (21) and accomplishes such transfer with no wait states. The state machines and dual access memory (21) are driven by a clock which is twice as fast as that driving the local microprocessor (24) and the state machine implementation utilizes this fact to insure memory access to both the system bus (13), and the local microprocessor (24) with priority going to the local microprocessor (24).
摘要翻译： 一种系统总线（13），其通过多个双重访问存储器结构（21）与多个本地微处理器（24）携带多维路径数据接口，每个维度一个，每个本地微处理器一个用于每个本地微处理器（24）。 本地仲裁器（35）控制对每个双重访问存储器结构（21）的访问，便于消除总线（13）和存储器（21）之间以及本地微处理器（24）和存储器（21）之间的数据传输中的等待状态， 。 仲裁器（35）使用可编程逻辑器件状态机方法来实现，该方法实现了一种操作模式，其中电路被布防用于本地微处理器（24）和双存取存储器（21）之间的传输，并且完成这样的转移 没有等待状态。 状态机和双重存取存储器（21）由驱动本地微处理器（24）的两倍的时钟驱动，并且状态机实现利用该事实来确保存储器对系统总线（13）， 和具有优先权的本地微处理器（24）到本地微处理器（24）。
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公开(公告)号：US5523956A
公开(公告)日：1996-06-04
申请号：US323406
申请日：1994-10-14
CPC分类号： B23K31/12 , B23K20/10 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/78 , H01L2224/78301 , H01L2224/85205 , H01L2224/85207 , H01L2224/859 , H01L2924/00014 , H01L2924/14
摘要： A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine's computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close, for example, to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test. When the carriage ascends, the distance it travels before closure of the contacts ( 23, 24) is used as a measure of bond deformation and, hence, bond quality.
摘要翻译： 一种焊接质量监测的方法，其中粘合机配有包括一对触点（23,24）的触地装置，所述触点通常由接合头架（13）升高和降低的接合工具（27）触地时打开， 。 当工具（27）朝向接合面（31）下降时，接合机的计算机（61）进行测试（103）以感测通过打开接触件（23,24）而产生的触地信号的产生。 如果感测到触地，则托架（13）进入超行程位置。 在达到超行程位置时，执行第二测试（108）以确认触地，然后将能量施加到债券现场。 在能量施加期间，检查触地机构的逻辑状态以确保触点不闭合，例如，以便在接合期间检查施加不足的力。 如果感测到触点闭合，则记录粘合点位置以进行进一步检查，例如非破坏性拉力测试。 当滑架上升时，其在接触件（23,24）闭合之前行进的距离被用作粘合变形的量度，因此用作粘结质量。
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公开(公告)号：US5459672A
公开(公告)日：1995-10-17
申请号：US15271
申请日：1993-02-05
CPC分类号： B23K31/12 , B23K20/10 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/78 , H01L2224/78301 , H01L2224/85205 , H01L2224/85207 , H01L2224/859 , H01L2924/00014 , H01L2924/14
摘要： A method of bond quality monitoring wherein a bonding machine is fitted with a touchdown mechanism including a pair of contacts (23, 24), which normally open upon touchdown of a bonding tool (27) raised and lowered by a bond head carriage (13). As the tool (27) is lowered towards a bonding surface (31), the bonding machine's computer (61) performs a test (103) to sense production of a touchdown signal produced by opening of the contacts (23, 24). If touchdown is sensed, the carriage (13) proceeds to an overtravel position. Upon reaching the overtravel position, a second test (108) is performed to confirm touchdown, and energy is then applied to the bond site. During energy application, the logic state of the touchdown mechanism is checked to ensure that the contacts do not close for example to check for application of inadequate force during bonding. If a contact closure is sensed, the bond site location is logged for further examination such as a nondestructive pull test. When the carriage ascends, the distance it travels before closure of the contacts ( 23, 24) is used as a measure of bond deformation and, hence, bond quality.
摘要翻译： 一种焊接质量监测的方法，其中粘合机配有包括一对触点（23,24）的触地装置，所述触点通常由接合头架（13）升高和降低的接合工具（27）触地时打开， 。 当工具（27）朝向接合面（31）下降时，接合机的计算机（61）进行测试（103）以感测通过打开接触件（23,24）而产生的触地信号的产生。 如果感测到触地，则托架（13）进入超行程位置。 在达到超行程位置时，执行第二测试（108）以确认触地，然后将能量施加到债券现场。 在能量施加期间，检查触地机构的逻辑状态以确保触点例如不接合以检查在接合期间是否施加不足的力。 如果感测到触点闭合，则记录粘合点位置以进行进一步检查，例如非破坏性拉力测试。 当滑架上升时，其在接触件（23,24）闭合之前行进的距离被用作粘合变形的量度，因此用作粘结质量。
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公开(公告)号：US5398265A
公开(公告)日：1995-03-14
申请号：US243052
申请日：1994-05-16
IPC分类号： G06F1/24
CPC分类号： G06F1/24
摘要： In a system wherein a system master (11) communicates with a plurality of subsystems (13, 25, 27, 29), each subsystem (13, 25, 27, 29) is associated with a unique reset address and a reset circuit which recognizes that reset address and generates a reset signal. Each reset circuit includes an address decoder (15) for decoding the reset address to produce a signal which closes a logic gate switch (19). The logic gate switch (19) is repeatedly closed in response to repeated assertions of the address to successively discharge the voltage on a capacitor (C). When the capacitor voltage is discharged to a selected level, a buffer level detector circuit (23) generates the reset signal.
摘要翻译： 在系统主机（11）与多个子系统（13,25,27,29）通信的系统中，每个子系统（13,25,27,29）与唯一的复位地址和复位电路相关联，该电路识别 该复位地址并产生复位信号。 每个复位电路包括用于解码复位地址以产生闭合逻辑门开关（19）的信号的地址解码器（15）。 逻辑门开关（19）响应于地址的重复断言而重复关闭，以连续放电电容器（C）上的电压。 当电容器电压被放电到选定电平时，缓冲电平检测器电路（23）产生复位信号。
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公开(公告)号：US5148967A
公开(公告)日：1992-09-22
申请号：US729963
申请日：1991-07-15
CPC分类号： H01L24/85 , B23K20/007 , H01L24/78 , H01L2224/48463 , H01L2224/78301 , H01L2224/78823 , H01L2224/85 , H01L2224/85205 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01082 , H01L2924/3011
摘要： Apparatus and method for detecting missing interconnect material. The distance traveled by a bonding tool is measured while the interconnect material is being bonded to a site. Unless it exceeds a predetermined threshold, a signal is generated indicating missing interconnect material. A pivoting system associated mating electrical contacts, and a measurement/comparator are advantageously employed to facilitate this measurement.
摘要翻译： 用于检测缺失的互连材料的装置和方法。 在将互连材料粘合到部位的同时测量由粘合工具行进的距离。 除非超过预定阈值，否则产生指示缺少互连材料的信号。 有利地采用了一种相关联的电气触点的枢转系统和一个测量/比较器来促进这种测量。
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公开(公告)号：US6068171A
公开(公告)日：2000-05-30
申请号：US113665
申请日：1998-07-10
CPC分类号： H01L24/78 , B23K20/004 , B65H51/205 , B65H59/105 , H01L2224/78 , H01L2924/00014 , H01L2924/01007 , H01L2924/01033 , H01L2924/14
摘要： A wire conveyance system is provided for a wire bonding machine having, in series, a first wire handler, a wire slacking device and a second wire handler. The wire slacking device includes a wire support chamber having a substantially enclosed bottom, opposing first and second vertical sidewalls, a substantially open top, a back opening and a front opening. The wire slacking device further includes a pressurized fluid source and first and second fluid orifices for receiving a pressurized fluid from the pressurized fluid source. The fluid orifices extend through the first or second sidewall of the wire support chamber with the second fluid orifice being positioned downstream of the first fluid orifice. First and second fluid paths are provided in fluid communication with the pressurized fluid source via the first and second fluid orifices. The first and second fluid paths extend upward between the first and second sidewalls of the wire support chamber and out the open top. A wire support path extends laterally through the wire support chamber above the first and second fluid orifices. The wire support path is substantially contactless with respect to the wire slacking device.
摘要翻译： 提供了一种用于线焊机的电线传送系统，其串联地具有第一电线处理器，电线松弛装置和第二电线处理器。 线材松弛装置包括线支撑室，其具有基本封闭的底部，相对的第一和第二垂直侧壁，基本上敞开的顶部，后开口和前开口。 钢丝松弛装置还包括加压流体源和用于从加压流体源接收加压流体的第一和第二流体孔。 流体孔口延伸穿过线材支撑室的第一或第二侧壁，第二流体孔口位于第一流体孔口的下游。 第一和第二流体通道经由第一和第二流体孔口与加压流体源流体连通地设置。 第一和第二流体路径在线支撑室的第一和第二侧壁之间向上延伸并且从开口顶部延伸出来。 线支撑路径横向延伸穿过第一和第二流体孔之上的线支撑室。 电线支撑路径相对于电线松弛装置基本上是非接触的。
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公开(公告)号：US4817848A
公开(公告)日：1989-04-04
申请号：US193450
申请日：1988-05-12
申请人： John B. Gabaldon
发明人： John B. Gabaldon
IPC分类号： H01L21/607 , B23K20/10 , G05B19/23 , G05D3/12 , H01L21/60
CPC分类号： H01L24/78 , B23K20/106 , G05B19/235 , G05B2219/45033 , G05B2219/49362 , H01L2224/78 , H01L2224/78301 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/12041 , H01L2924/14
摘要： An automatic ultrasonic wire bonder employs a compliant motion servo (17, 119, 239, 200) on its Z axis drive to maintain a known, constant and steady force applied by the bonding tool (13) to the wire. The tool is resiliently mounted to a carriage (15) that is driven by a force control servo (17, 119, 238, 200). During bonding, the tool is pressed against the wire, and effects of variations in tool tip Z axis position caused by vibration, wire deformation during bonding and other factors of the equipment are minimized by a servo that precisely controls and maintains a fixed position of the carriage relative to the wire to thereby maintain a preselected force between the bonding tool tip and the wire.
摘要翻译： 自动超声波引线接合器在其Z轴驱动器上采用顺应运动伺服（17,119,239,200）以保持由焊接工具（13）施加到线的已知，恒定和稳定的力。 工具弹性地安装到由力控制伺服机构（17,119,238,200）驱动的滑架（15）上。 在接合期间，工具被压在线上，并且通过伺服来最小化由振动引起的刀尖Z轴位置的变化，接合期间的线变形以及设备的其他因素的影响，精确地控制和保持固定位置 从而在接合工具尖端和线之间保持预选力。
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