摘要:
A wire conveyance system is provided for a wire bonding machine having, in series, a first wire handler, a wire slacking device and a second wire handler. The wire slacking device includes a wire support chamber having a substantially enclosed bottom, opposing first and second vertical sidewalls, a substantially open top, a back opening and a front opening. The wire slacking device further includes a pressurized fluid source and first and second fluid orifices for receiving a pressurized fluid from the pressurized fluid source. The fluid orifices extend through the first or second sidewall of the wire support chamber with the second fluid orifice being positioned downstream of the first fluid orifice. First and second fluid paths are provided in fluid communication with the pressurized fluid source via the first and second fluid orifices. The first and second fluid paths extend upward between the first and second sidewalls of the wire support chamber and out the open top. A wire support path extends laterally through the wire support chamber above the first and second fluid orifices. The wire support path is substantially contactless with respect to the wire slacking device.
摘要:
A bond head is provided for a wire bonding machine having a linear axis frame, a rotary axis frame, a bond tool and a wire clamp. The linear axis frame is vertically linearly displacable along a linear axis, while the rotary axis frame is rotationally displacable along a rotary axis. A pivotal connector is provided which pivotally connects the rotary axis frame to the linear axis frame, enabling the rotary axis frame to rotate independent of linear displacement of the linear axis frame. The bond tool is connected to the rotary axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame and rotationally displacable in response to rotational displacement of the rotary axis frame. The wire clamp is connected to the linear axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame, while the wire clamp is maintained rotationally stationary during rotational displacement of the rotary axis frame. The bond head also includes a linear motion assembly and a rotary motion assembly. The linear motion assembly has a linear driver, a linear position detector and a linear driver controller. The rotary motion assembly correspondingly has a rotary driver, a rotary position detector and a rotary driver controller.
摘要:
A forensically sound image of a computer readable storage medium can be transferred across a low bandwidth communications network. The method can include the step of scanning an image of the computer readable storage medium for redundant data, the redundant data duplicative of locally stored data. The method can also include generating a skeleton image based on the image of the computer readable storage medium by excluding the redundant data from the image of the computer readable storage medium. The method can include transmitting, by a transmitting device, the skeleton image over the communications network to a receiving device to enable reconstruction of an image copy of the computer readable storage medium using the skeleton image and the locally stored data. A receiving device can reconstruct a bit-for-bit copy of the image of the computer readable storage medium.
摘要:
A force limiting weld head (11) which includes a supporting structure (13), a pressure barrel (15) and an output member (17) mounted for movement on the supporting structure, a fixed electrode (19) mounted on the supporting structure, a movable electrode (21) driven by the output member, a coupling (23) for drivingly coupling the pressure barrel and the output member. The coupling includes a variable-volume chamber (89) and a piston (77) responsive to overtravel for varying the volume of the chamber.
摘要:
Two parallel elongated closely spaced electrodes for welding electronic circuit components are mounted for limited rotation about an axis extending generally longitudinally of the electrodes to allow the electrode pair to be oriented with respect to a workpiece without angularly moving the workpiece. The electrodes are mounted in a pair of mutually aligned and mutually insulated bobbins against which are firmly pressed a pair of contacts for conducting weld current between the electrodes. The bobbins and the electrodes mounted therein are free to rotate relative to the fixed contacts, but the latter are firmly pressed against the bobbins to provide increased contact pressure and decreased electrical resistance between the contacts and bobbins and to provide a relatively large surface area for such contact.
摘要:
A movable open center mounting for the tool of an ultrasonic wire bonding machine employs ball-bearing rollers (22, 24, 30, 32) to permit limited motion of the wire bonding tip (13a) substantially constrained to a vertical line with a minimum of tip skid. The mounting structure which is all positioned on one side of the tool tip includes a frame (10) of inverted U-shape having a pair of mutually spaced ball-bearing rollers (22, 24, 30, 32) on the end of each frame leg and a transducer support (12) positioned between the frame legs and having fixed roller contacting rods (90, 92, 96, 98) extending fore-and-aft between and partly under each of the respective rollers. A pair of springs (80, 82) urges the transducer support upwardly to press the fixed rods against the roller surfaces, allowing the transducer support to effectively rock about a center of motion (120) that is well below the bonder frame and transducer support, with the rocking motion being so constrained that the bonder tip moves substantially in a straight vertical line for small displacements.
摘要:
A bonding tool and clamp assembly is disclosed and includes an upper wire guide (23,51) and a bonding tool (17,75) having a short guide hole (45) adjacent the heel of the bonding tool foot (41). The bonding tool tip (17a) includes a clamping surface (47) adjacent the guide hole (45); and a clamp (21b,49b) is selectively forced toward the clamping surface (47) to clamp the bonding wire (39,77). The clamp (21b,49b) is biased toward the clamping surface by a spring (37,73), and is released from the clamping surface by an electromagnet (29,57).
摘要:
Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long dimensions all perpendicular to the chip edge, making all of the first bonds along lines perpendicular to the chip edge and then bending the wire to extend to the second bond.
摘要:
In the well-known technique of disinfecting caries-infected or potentially caries-infected dental tissue with silver nitrate, silver thiocyanate or its complexes have been substituted for silver nitrate with excellent disinfecting results and lowered side effects, e.g., with lowered toxicity toward dental tissues and mouth membranes and less blackening of exposed portions of the teeth.
摘要:
A parallel-gap welder applies a precisely controlled force to the weld head (40) by means of a solenoid (60) having a plunger (72) aligned with the axis of the welding electrodes (50,52). To precisely control the amount of force applied by the solenoid a load cell (80) is interposed between the weld head (40) and the solenoid plunger (72) to provide a feedback force signal (158) indicative of the force applied by the solenoid. The feedback force signal is used to control current through the solenoid coil (68) and thereby servo the applied force to a force command input. The solenoid plunger (72) and load cell (80) are axially aligned with the axis of the electrodes (50,52) and solenoid force is applied through a universal joint (76,78) connection to assure an in-line driving force on the electrodes.