公开(公告)号：US09165927B2

公开(公告)日：2015-10-20

申请号：US14323382

申请日：2014-07-03

Applicant: JTEKT CORPORATION ,  DENSO CORPORATION

Inventor： Shigeki Nagase ,  Kazuo Tada

IPC: H01L27/088 ,  H01L23/48 ,  H05K1/18 ,  H01L23/538 ,  H01L25/07

CPC classification number: H01L27/088 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/074 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/00

Abstract: In a semiconductor device, each of a first connection metal member, a second connection metal member, a third connection metal member, and a fourth connection metal member electrically connects a corresponding line to a corresponding one of main electrodes formed on lower surfaces and upper surfaces of first and second semiconductor elements. A cross-sectional area of each of the first connection metal member, the second connection metal member, the third connection metal member, and the fourth connection metal member is larger than a cross-sectional area of a fifth connection metal member that is disposed at a region located outside regions of the first and second semiconductor elements in a plan view.

Abstract translation: 在半导体装置中，第一连接金属构件，第二连接金属构件，第三连接金属构件和第四连接金属构件中的每一个将对应的线电连接到形成在下表面和上表面上的对应的一个主电极 的第一和第二半导体元件。 第一连接金属构件，第二连接金属构件，第三连接金属构件和第四连接金属构件的横截面积大于设置在第一连接金属构件，第二连接金属构件和第四连接金属构件的第五连接金属构件的横截面积 在平面图中位于第一和第二半导体元件的区域外的区域。

公开(公告)号：US10427498B2

公开(公告)日：2019-10-01

申请号：US15318927

申请日：2015-04-24

Applicant: DENSO CORPORATION

Inventor： Yasuhiro Sagou ,  Hideaki Kako ,  Kimitake Ishikawa ,  Hiroyasu Oide ,  Hideki Seki ,  Kouji Kondoh ,  Kazuo Tada ,  Masaaki Inoguchi

IPC: B60H1/22 ,  F24H3/00 ,  H05B3/24

Abstract: A heating part of this radiant heater has a plurality of heating wires. The plurality of heating wires are connected in parallel such that a plurality of parallel groups may be formed by electrodes. Further, the plurality of parallel groups are connected in series by the electrodes. The heating parts are set to reach a radiation temperature for emitting the heat radiation which makes a human to feel warmth. The heating parts have a thermal resistance in a longitudinal direction which is set, when an object contacts on the surface, a temperature of the part where the object touches falls to a suppressed temperature lower than the radiation temperature. The temperature of the heating part increases rapidly in response to electric supply. When there is a contact with an object, the temperature of the heating part decreases rapidly.

公开(公告)号：US20130114212A1

公开(公告)日：2013-05-09

申请号：US13668748

申请日：2012-11-05

Applicant: DENSO CORPORATION

Inventor： Kazuo Tada ,  Kouji Kondoh ,  Kouhei Fujihara ,  Yoshihiko Shiraishi

IPC: H01B1/02 ,  H05K7/20

CPC classification number: H01B1/026 ,  H01B1/02 ,  H05K1/0206 ,  H05K1/186 ,  H05K3/4069 ,  H05K7/20409

Abstract: An electrically conductive material used in the formation of heat-releasing filled via holes in an electronic component-incorporated multilayer circuit board with a heat radiation member, in which the electrically conductive material comprises metal particles as a conductive metal which is a mixture of a first conductive metal consisting of silver (Ag) or copper (Cu) and a second conductive metal consisting of tin (Sn), and a ratio of the atomicity of tin to the atomicity of silver or copper and tin is 27 to 40%, and an electronic device using the same.

Abstract translation: 一种用于在具有散热构件的电子元件结合多层电路板中形成散热填充通孔的导电材料，其中导电材料包括作为导电金属的金属颗粒，其是第一 由银（Ag）或铜（Cu）组成的导电金属和由锡（Sn）组成的第二导电金属，锡的原子数与银或铜和锡的原子数的比率为27〜40％，并且 电子设备使用相同。