公开(公告)号：US20130114212A1

公开(公告)日：2013-05-09

申请号：US13668748

申请日：2012-11-05

Applicant: DENSO CORPORATION

Inventor： Kazuo Tada ,  Kouji Kondoh ,  Kouhei Fujihara ,  Yoshihiko Shiraishi

IPC: H01B1/02 ,  H05K7/20

CPC classification number: H01B1/026 ,  H01B1/02 ,  H05K1/0206 ,  H05K1/186 ,  H05K3/4069 ,  H05K7/20409

Abstract: An electrically conductive material used in the formation of heat-releasing filled via holes in an electronic component-incorporated multilayer circuit board with a heat radiation member, in which the electrically conductive material comprises metal particles as a conductive metal which is a mixture of a first conductive metal consisting of silver (Ag) or copper (Cu) and a second conductive metal consisting of tin (Sn), and a ratio of the atomicity of tin to the atomicity of silver or copper and tin is 27 to 40%, and an electronic device using the same.

Abstract translation: 一种用于在具有散热构件的电子元件结合多层电路板中形成散热填充通孔的导电材料，其中导电材料包括作为导电金属的金属颗粒，其是第一 由银（Ag）或铜（Cu）组成的导电金属和由锡（Sn）组成的第二导电金属，锡的原子数与银或铜和锡的原子数的比率为27〜40％，并且 电子设备使用相同。