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公开(公告)号：US10427498B2
公开(公告)日：2019-10-01
申请号：US15318927
申请日：2015-04-24
Applicant: DENSO CORPORATION
Inventor： Yasuhiro Sagou , Hideaki Kako , Kimitake Ishikawa , Hiroyasu Oide , Hideki Seki , Kouji Kondoh , Kazuo Tada , Masaaki Inoguchi
Abstract: A heating part of this radiant heater has a plurality of heating wires. The plurality of heating wires are connected in parallel such that a plurality of parallel groups may be formed by electrodes. Further, the plurality of parallel groups are connected in series by the electrodes. The heating parts are set to reach a radiation temperature for emitting the heat radiation which makes a human to feel warmth. The heating parts have a thermal resistance in a longitudinal direction which is set, when an object contacts on the surface, a temperature of the part where the object touches falls to a suppressed temperature lower than the radiation temperature. The temperature of the heating part increases rapidly in response to electric supply. When there is a contact with an object, the temperature of the heating part decreases rapidly.
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公开(公告)号：US09769879B2
公开(公告)日：2017-09-19
申请号：US14402664
申请日：2013-05-21
Applicant: DENSO CORPORATION
Inventor： Koji Ota , Manabu Maeda , Yasuhiro Sagou , Kouji Kondoh , Gentaro Masuda , Hidetada Kajino , Yoshihiko Shiraishi
CPC classification number: H05B3/0042 , B60H1/2215 , H05B3/06 , H05B3/26 , H05B3/267 , H05B2203/002 , H05B2203/003 , H05B2203/005 , H05B2203/007 , H05B2203/013 , H05B2203/014 , H05B2203/032
Abstract: A radiation heater apparatus has a plurality of heat radiation parts and a plurality of heating parts. A low thermal conductive part is formed between adjacent two of the heat radiation parts. The low thermal conductive part is provided with resin material which mainly forms a substrate part. The low thermal conductive part thermally isolates the heat radiation part by surrounding a periphery of the heat radiation part. As a body contacts with the surface of the apparatus, the thermal energy of specific heat radiation part directly under the body dissipates heat to the body. Furthermore, heat transfer from the periphery of the specific heat radiation part to the specific heat radiation part is reduced by the low thermal conductive part.
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公开(公告)号：US20150110477A1
公开(公告)日：2015-04-23
申请号：US14402664
申请日：2013-05-21
Applicant: DENSO CORPORATION
Inventor： Koji Ota , Manabu Maeda , Yasuhiro Sagou , Kouji Kondoh , Gentaro Masuda , Hidetada Kajino , Yoshihiko Shiraishi
CPC classification number: H05B3/0042 , B60H1/2215 , H05B3/06 , H05B3/26 , H05B3/267 , H05B2203/002 , H05B2203/003 , H05B2203/005 , H05B2203/007 , H05B2203/013 , H05B2203/014 , H05B2203/032
Abstract: A radiation heater apparatus has a plurality of heat radiation parts and a plurality of heating parts. A low thermal conductive part is formed between adjacent two of the heat radiation parts. The low thermal conductive part is provided with resin material which mainly forms a substrate part. The low thermal conductive part thermally isolates the heat radiation part by surrounding a periphery of the heat radiation part. As a body contacts with the surface of the apparatus, the thermal energy of specific heat radiation part directly under the body dissipates heat to the body. Furthermore, heat transfer from the periphery of the specific heat radiation part to the specific heat radiation part is reduced by the low thermal conductive part.
Abstract translation: 辐射加热装置具有多个散热部和多个加热部。 在相邻的两个散热部件之间形成低导热部件。 低导热部件设置有主要形成基板部件的树脂材料。 低导热部件通过围绕散热部件的周边来热隔离散热部件。 当身体与设备的表面接触时，直接在身体下方的特定热辐射部分的热能将热量散发到身体。 此外，通过低导热部件减少从特定放热部分的周边到特定散热部分的热传递。
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公开(公告)号：US20130114212A1
公开(公告)日：2013-05-09
申请号：US13668748
申请日：2012-11-05
Applicant: DENSO CORPORATION
Inventor： Kazuo Tada , Kouji Kondoh , Kouhei Fujihara , Yoshihiko Shiraishi
CPC classification number: H01B1/026 , H01B1/02 , H05K1/0206 , H05K1/186 , H05K3/4069 , H05K7/20409
Abstract: An electrically conductive material used in the formation of heat-releasing filled via holes in an electronic component-incorporated multilayer circuit board with a heat radiation member, in which the electrically conductive material comprises metal particles as a conductive metal which is a mixture of a first conductive metal consisting of silver (Ag) or copper (Cu) and a second conductive metal consisting of tin (Sn), and a ratio of the atomicity of tin to the atomicity of silver or copper and tin is 27 to 40%, and an electronic device using the same.
Abstract translation: 一种用于在具有散热构件的电子元件结合多层电路板中形成散热填充通孔的导电材料，其中导电材料包括作为导电金属的金属颗粒，其是第一 由银（Ag）或铜（Cu）组成的导电金属和由锡（Sn）组成的第二导电金属，锡的原子数与银或铜和锡的原子数的比率为27〜40％，并且 电子设备使用相同。
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