FLAME RETARDANT COMPOUND INCLUDING HOST-GUEST COMPLEX

    公开(公告)号:US20190382565A1

    公开(公告)日:2019-12-19

    申请号:US16553992

    申请日:2019-08-28

    摘要: A flame retardant compound is provided. The flame retardant compound includes a polymer base resin, a carbonific host compound, and a guest compound including at least one atom of a transition metal. The carbonific host compound and the guest compound form a host-guest complex, and the host-guest complex acts to inhibit at least one of smoke release and smoke formation when exposed to heat. The host-guest complex is distributed within the polymer base resin. An intumescent flame retardant compound is also provided. The intumescent flame retardant compound includes a base resin, an acid donor, a spumific agent, a cyclodextrin host compound, and a guest compound including at least one atom of molybdenum. The cyclodextrin host compound and the guest compound form a host-guest complex. The acid donor, carbonific host compound, and spumific agent react when exposed to a temperature above 280° C. to form a foam.

    Flame retardant compound including host-guest complex

    公开(公告)号:US10538653B2

    公开(公告)日:2020-01-21

    申请号:US16553992

    申请日:2019-08-28

    摘要: A flame retardant compound is provided. The flame retardant compound includes a polymer base resin, a carbonific host compound, and a guest compound including at least one atom of a transition metal. The carbonific host compound and the guest compound form a host-guest complex, and the host-guest complex acts to inhibit at least one of smoke release and smoke formation when exposed to heat. The host-guest complex is distributed within the polymer base resin. An intumescent flame retardant compound is also provided. The intumescent flame retardant compound includes a base resin, an acid donor, a spumific agent, a cyclodextrin host compound, and a guest compound including at least one atom of molybdenum. The cyclodextrin host compound and the guest compound form a host-guest complex. The acid donor, carbonific host compound, and spumific agent react when exposed to a temperature above 280° C. to form a foam.