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1.发明申请公开(公告)号：US20150277068A1
公开(公告)日：2015-10-01
申请号：US14687119
申请日：2015-04-15
Applicant: Cisco Technology, Inc.
Inventor： Kishor DESAI , Ravinder Kachru , Vipulkumar Patel , Bipin Dama , Kalpendu Shastri , Soham Pathak
CPC classification number: G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。
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公开(公告)号：US08876410B2
公开(公告)日：2014-11-04
申请号：US13737080
申请日：2013-01-09
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Soham Pathak , Utpal Chakrabarti , Vipulkumar Patel , Bipin Dama , Ravinder Kachru , Kishor Desai
CPC classification number: G02B6/4292 , B82Y20/00 , C03C15/00 , G02B6/136 , G02B6/4214 , G02B6/4246 , G02B6/4259 , Y10T29/4978
Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.
Abstract translation: 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。
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公开(公告)号：US09575267B1
公开(公告)日：2017-02-21
申请号：US14930857
申请日：2015-11-03
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Soham Pathak , Rao V. Yelamarty , Neeraj Kumar Dubey
IPC: G02B6/42
CPC classification number: G02B6/4292 , G02B6/421 , G02B6/423 , G02B6/4243 , G02B6/425
Abstract: Embodiments herein include an optical system that passively aligns an optical component (e.g., a fiber array connector, lens array, lens body, etc.) with a semiconductor substrate using trenches that mate with optical fiber stubs. In one embodiment, the trenches are etched into the semiconductor substrate which provides support to optical devices (e.g., lasers, lens arrays, photodetectors, etc.) that transmit optical signals to, or receive optical signals from, the optical component. An underside of the optical component is etched to include at least two grooves (e.g., V-grooves) for receiving optical fiber stubs. In one embodiment, the optical fiber stubs are a portion of optical fiber that includes the core and cladding but not the insulative jacket. Once the fiber stubs are attached to the grooves, the fiber stubs are disposed into the trenches in the semiconductor substrate thereby passively aligning the optical component to the optical device on the substrate.
Abstract translation: 本文的实施例包括使用与光纤短截线配合的沟槽将光学部件（例如，光纤阵列连接器，透镜阵列，透镜主体等）与半导体基板无功地对准的光学系统。 在一个实施例中，沟槽被蚀刻到半导体衬底中，该半导体衬底为向光学部件发射光信号或从光学部件接收光信号的光学器件（例如，激光器，透镜阵列，光电检测器等）提供支持。 光学部件的下侧被蚀刻以包括用于接收光纤短截线的至少两个凹槽（例如，V形槽）。 在一个实施例中，光纤短截线是包括芯和包层而不是绝缘套的光纤的一部分。 一旦纤维短截线连接到凹槽上，则将光纤短截线设置在半导体衬底中的沟槽中，从而将光学部件无源地对准衬底上的光学器件。
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4.发明授权公开(公告)号：US09052445B2
公开(公告)日：2015-06-09
申请号：US13656528
申请日：2012-10-19
Applicant: Cisco Technology, Inc.
Inventor： Kishor Desai , Ravinder Kachru , Vipulkumar Patel , Bipin Dama , Kalpendu Shastri , Soham Pathak
IPC: H01L21/00 , G02B6/12 , H01L33/52 , G02B6/42 , G02B6/43 , H01L23/04 , H01L23/48 , H01L25/16 , H01L31/0203 , H05K1/02 , H01L21/50
CPC classification number: G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。
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5.发明授权Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components 有权具有热隔离区域的插入器配置，用于温度敏感的光电子部件公开(公告)号：US08905632B2
公开(公告)日：2014-12-09
申请号：US13687021
申请日：2012-11-28
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Soham Pathak , Vipulkumar Patel , Bipin Dama , Kishor Desai
CPC classification number: H01S5/02415 , G02B6/42 , G02B6/4273 , H01S5/005 , H01S5/0064 , H01S5/02248 , H01S5/024 , H01S5/02469 , H01S5/4025
Abstract: An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.
Abstract translation: 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。
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Patent Agency Ranking
6.发明授权Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components 有权具有热隔离区域的插入器配置，用于温度敏感的光电子部件公开(公告)号：US09031107B2
公开(公告)日：2015-05-12
申请号：US14510654
申请日：2014-10-09
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Soham Pathak , Vipulkumar Patel , Bipin Dama , Kishor Desai
CPC classification number: H01S5/02415 , G02B6/42 , G02B6/4273 , H01S5/005 , H01S5/0064 , H01S5/02248 , H01S5/024 , H01S5/02469 , H01S5/4025
Abstract: An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.
Abstract translation: 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。
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公开(公告)号：US10048450B2
公开(公告)日：2018-08-14
申请号：US15831075
申请日：2017-12-04
Applicant: Cisco Technology, Inc.
Inventor： Neeraj Kumar Dubey , Rao V. Yelamarty , Soham Pathak , Gnyaneshwar Ramakrishna , Kalpendu Shastri
Abstract: Embodiments herein include an optical system, an optical component, and an associated method of passive alignment in which complementary magnetic patterns are used to provide passive alignment between optical elements. The magnetic coupling between the magnetic patterns operates to align optical elements in at least two dimensions. The magnetic coupling provides a temporary holding force on the optical elements until the optical elements are secured using epoxy or other adhesive.
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公开(公告)号：US09835809B2
公开(公告)日：2017-12-05
申请号：US15082908
申请日：2016-03-28
Applicant: Cisco Technology, Inc.
Inventor： Neeraj Kumar Dubey , Rao V. Yelamarty , Soham Pathak , Gnyaneshwar Ramakrishna , Kalpendu Shastri
CPC classification number: G02B6/3886 , G02B6/3885 , G02B6/421 , G02B6/423 , G02B6/425 , G02B6/4257 , G02B6/4292
Abstract: Embodiments herein include an optical system, an optical component, and an associated method of passive alignment in which complementary magnetic patterns are used to provide passive alignment between optical elements. The magnetic coupling between the magnetic patterns operates to align optical elements in at least two dimensions. The magnetic coupling provides a temporary holding force on the optical elements until the optical elements are secured using epoxy or other adhesive.
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9.发明授权公开(公告)号：US09575266B2
公开(公告)日：2017-02-21
申请号：US14687119
申请日：2015-04-15
Applicant: Cisco Technology, Inc.
Inventor： Kishor Desai , Ravinder Kachru , Vipulkumar Patel , Bipin Dama , Kalpendu Shastri , Soham Pathak
IPC: G02B6/12 , G02B6/42 , H01L33/52 , G02B6/43 , H01L23/04 , H01L23/48 , H01L25/16 , H01L31/0203 , G02B6/13 , H05K1/02 , H01L21/50
CPC classification number: G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。
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公开(公告)号：US09213152B2
公开(公告)日：2015-12-15
申请号：US13737029
申请日：2013-01-09
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Soham Pathak , John Fangman , Vipulkumar Patel , Kishor Desai , Ravinder Kachru
CPC classification number: G02B6/42 , G02B6/12 , G02B6/3886 , G02B6/4214 , G02B6/4259 , G02B6/4292 , Y10T29/49155
Abstract: An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.
Abstract translation: 一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。 外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。 磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。 这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。
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