公开(公告)号：US20140362457A1

公开(公告)日：2014-12-11

申请号：US14331315

申请日：2014-07-15

Applicant: Cisco Technology, Inc.

Inventor： Mary NADEAU ,  Vipulkumar PATEL ,  Prakash GOTHOSKAR ,  John FANGMAN ,  John Matthew FANGMAN ,  Mark WEBSTER

IPC: G02B7/02 ,  G02B7/00 ,  H01L23/544

CPC classification number: G02B7/025 ,  G02B6/4228 ,  G02B6/4239 ,  G02B7/003 ,  H01L23/345 ,  H01L23/544 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2223/54426 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/83121 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/83234 ,  H01L2224/83385 ,  H01L2224/83862 ,  H01L2924/14 ,  Y10T428/24479 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and “shape” of an adhesive “dot” so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots (“channels”) may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.

Abstract translation: 用于改善组件中微组件的粘合附着的装置利用形成在用于支撑微组件的衬底顶表面中的多个平行布置的槽。 这些槽用于控制粘合剂“点”的流动和“形状”，以便将微组件快速且精确地附着在基板的表面上。 在衬底的表面中形成（优选地，蚀刻）狭槽，使其自身具有从一个衬底到另一个衬底的可再现精度。 其它槽（“通道”）可以与结合槽结合形成，使得外来粘合剂材料将流入这些通道并且不会扩散到不需要的区域。