公开(公告)号：US11562952B2

公开(公告)日：2023-01-24

申请号：US17245259

申请日：2021-04-30

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Craig McAdam ,  Jonathan Taylor ,  Douglas Macfarlane ,  John Kerr ,  James Munger ,  John Pavelka ,  Steven A. Atherton

IPC: H01L23/498 ,  H01L23/00

Abstract: The present disclosure relates to a chip scale package (CSP) comprising: a first set of CSP contact balls or bumps; a second set of CSP contact balls or bumps; and a channel routing region, the channel routing region being devoid of any CSP contact balls or bumps.

公开(公告)号：US11887924B2

公开(公告)日：2024-01-30

申请号：US17993638

申请日：2022-11-23

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Craig McAdam ,  Jonathan Taylor ,  Douglas Macfarlane ,  John Kerr ,  James Munger ,  John Pavelka ,  Steven A. Atherton

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49822 ,  H01L24/13 ,  H01L2224/16227

Abstract: The present disclosure relates to a chip scale package (CSP) comprising: a first set of CSP contact balls or bumps; a second set of CSP contact balls or bumps; and a channel routing region, the channel routing region being devoid of any CSP contact balls or bumps.

公开(公告)号：US11373968B2

公开(公告)日：2022-06-28

申请号：US16857606

申请日：2020-04-24

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Yaoyu Pang ,  Steven A. Atherton

IPC: H01L23/00 ,  H01L23/52

Abstract: A semiconductor die may be coupled to a printed circuit board using a solder ball. The semiconductor die comprises a redistribution layer formed above a semiconductor chip, a polymer layer formed on the redistribution layer, and an Under Bump Metallurgy (UBM) layer formed on the polymer layer. The polymer layer comprises a plurality of vias, which electrically couple the UBM layer to the redistribution layer. The entire UBM layer may be deposited with a continuously flat upper surface for coupling to the solder ball. The plurality of vias may be positioned such that they are centered on a point that is not central to the UBM layer.