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公开(公告)号:US20110304023A1
公开(公告)日:2011-12-15
申请号:US13203492
申请日:2010-03-01
CPC分类号: B26F1/28 , B23K26/0006 , B23K26/1423 , B23K26/16 , B23K26/348 , B23K26/354 , B23K26/389 , B23K2103/50 , B23K2103/52 , B23K2103/56 , B26D7/10 , C03C23/0025 , H01L21/67092 , H01L2924/0002 , H03B5/1203 , H03B5/1228 , H03B5/1296 , H03K3/0231 , H05K3/0017 , H05K2201/0129 , H05K2203/105 , H05K2203/107 , H05K2203/1105 , Y10T428/24273 , Y10T428/24479 , H01L2924/00
摘要: The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.
摘要翻译: 本发明涉及一种在电绝缘或半导体衬底中产生孔或凹槽或阱的方法,以及通过该方法产生的衬底中的孔或凹槽或阱中的方法。 本发明还涉及通过该方法产生的衬底中的孔或凹槽阵列。 本发明还涉及一种用于执行根据本发明的方法的装置。
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公开(公告)号:US20110278648A1
公开(公告)日:2011-11-17
申请号:US13132436
申请日:2009-12-02
IPC分类号: H01L29/66 , H01L21/326 , B32B3/24
CPC分类号: B26F1/28 , B23K26/354 , B23K26/384 , B26D7/10 , Y10T428/24273
摘要: This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.
摘要翻译: 本发明涉及用于生产微结构衬底的方法及其在自然科学和技术中的应用,特别是在半导体,微流体和分析装置中。 它涉及通过提供受控放电来引入诸如孔或空腔或通道或孔或凹槽或结构变化的结构的方法。
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公开(公告)号:US09427885B2
公开(公告)日:2016-08-30
申请号:US13132436
申请日:2009-12-02
IPC分类号: H01L21/326 , B26F1/28 , B26D7/10 , B23K26/38 , B23K26/00
CPC分类号: B26F1/28 , B23K26/354 , B23K26/384 , B26D7/10 , Y10T428/24273
摘要: This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.
摘要翻译: 本发明涉及用于生产微结构衬底的方法及其在自然科学和技术中的应用,特别是在半导体,微流体和分析装置中。 它涉及通过提供受控放电来引入诸如孔或空腔或通道或孔或凹槽或结构变化的结构的方法。
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公开(公告)号:US08736026B2
公开(公告)日:2014-05-27
申请号:US13203492
申请日:2010-03-01
IPC分类号: H01L23/544
CPC分类号: B26F1/28 , B23K26/0006 , B23K26/1423 , B23K26/16 , B23K26/348 , B23K26/354 , B23K26/389 , B23K2103/50 , B23K2103/52 , B23K2103/56 , B26D7/10 , C03C23/0025 , H01L21/67092 , H01L2924/0002 , H03B5/1203 , H03B5/1228 , H03B5/1296 , H03K3/0231 , H05K3/0017 , H05K2201/0129 , H05K2203/105 , H05K2203/107 , H05K2203/1105 , Y10T428/24273 , Y10T428/24479 , H01L2924/00
摘要: The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.
摘要翻译: 本发明涉及一种在电绝缘或半导体衬底中产生孔或凹槽或阱的方法,以及通过该方法产生的衬底中的孔或凹槽或阱中的方法。 本发明还涉及通过该方法产生的衬底中的孔或凹槽阵列。 本发明还涉及一种用于执行根据本发明的方法的装置。
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公开(公告)号:US20100314723A1
公开(公告)日:2010-12-16
申请号:US12747660
申请日:2008-12-12
IPC分类号: H01L29/02 , H01L21/326
CPC分类号: B26F1/28
摘要: This invention relates to methods and devices for the production of optical microstructures or domains in dielectric substrates based on electrothermal focussing. More specifically, the invention relates to a method of introducing a change of dielectric and/or optical properties in a region of an electrically insulating or electrically semiconducting substrate, and to substrates produced by such method.
摘要翻译: 本发明涉及用于在基于电热聚焦的电介质基底中制造光学微结构或结构域的方法和装置。 更具体地,本发明涉及一种在电绝缘或电半导体衬底的区域中引入电介质和/或光学特性的变化的方法以及通过这种方法产生的衬底。
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公开(公告)号:US20120138339A1
公开(公告)日:2012-06-07
申请号:US13390158
申请日:2010-08-04
申请人: Leander Dittmann
发明人: Leander Dittmann
CPC分类号: B26F1/28 , H05K3/0017 , H05K3/0032 , H05K3/0035 , H05K3/105 , H05K3/4038 , H05K2201/0323 , H05K2203/105 , H05K2203/1115 , H05K2203/1136 , Y10T29/49165
摘要: The present invention relates to a method of producing an electrically-conducting via in a substrate and to a substrate produced thereby. The method comprises the steps: a) providing a substrate made of at least one electrically insulating material (1), b) placing said substrate between two electrodes (3, 3′), said two electrodes being connected to a user-controlled voltage source (4), c) appling a voltage to said substrate, d) causing a dielectric breakdown and energy dissipation between said two electrodes through said substrate by locally or globally increasing the electrical conductivity of said substrate, wherein, in step d), a modification of said at least one electrically insulating material into an electrically conducting material occurs, thereby generating an electrically conducting via (6). In particular, in one embodiment, the present invention relates to a substrate, such as a printed circuit board having one or several metal-free electrically conducting vias.
摘要翻译: 本发明涉及一种在衬底中制造导电通孔的方法及其制造的衬底。 该方法包括以下步骤:a)提供由至少一个电绝缘材料(1)制成的衬底,b)将所述衬底放置在两个电极(3,3')之间,所述两个电极连接到用户控制的电压源 (4),c)向所述衬底施加电压,d)通过局部地或全面地增加所述衬底的导电性,在所述两个电极之间通过所述衬底造成电介质击穿和能量耗散,其中在步骤d)中, 所述至少一个电绝缘材料变成导电材料,从而产生导电通孔(6)。 特别地,在一个实施例中,本发明涉及一种基板,例如具有一个或多个无金属导电通孔的印刷电路板。
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公开(公告)号:US08323588B2
公开(公告)日:2012-12-04
申请号:US12598760
申请日:2008-05-05
申请人: Olaf Hoyer , Leander Dittmann , Giso Gessner , Andreas Vester
发明人: Olaf Hoyer , Leander Dittmann , Giso Gessner , Andreas Vester
IPC分类号: B01L9/00
CPC分类号: B06B1/16 , B01F11/0014
摘要: A sample handling device (100) for handling a sample, the sample handling device (100) comprising a drive shaft (101) being drivable by a drive unit (102), a base plate (103) mounted to follow a motion of the drive shaft (101) when being driven by the drive unit (102), wherein the base plate (103) is configured to receive a sample carrier block (104) mountable to follow a motion of the base plate (103), and a compensation weight (105, 106) mounted asymmetrically on the drive shaft (101) in a manner to at least partially compensate an unbalanced mass of the sample handling device (100) during the motion.
摘要翻译: 一种用于处理样品的样品处理装置(100),所述样品处理装置(100)包括可由驱动单元(102)驱动的驱动轴(101),安装成跟随驱动器的运动的基板(103) 轴(101)由驱动单元(102)驱动时,其中基板(103)构造成接收可安装成跟随基板(103)的运动的样品载体块(104),以及补偿重量 (105,106),其以在运动期间至少部分地补偿样品处理装置(100)的不平衡质量的方式不对称地安装在驱动轴(101)上。
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公开(公告)号:US20100218620A1
公开(公告)日:2010-09-02
申请号:US12598760
申请日:2008-05-05
申请人: Olaf Hoyer , Leander Dittmann , Giso Gessner , Andreas Vester
发明人: Olaf Hoyer , Leander Dittmann , Giso Gessner , Andreas Vester
IPC分类号: G01N1/00
CPC分类号: B06B1/16 , B01F11/0014
摘要: A sample handling device (100) for handling a sample, the sample handling device (100) comprising a drive shaft (101) being drivable by a drive unit (102), a base plate (103) mounted to follow a motion of the drive shaft (101) when being driven by the drive unit (102), wherein the base plate (103) is configured to receive a sample carrier block (104) mountable to follow a motion of the base plate (103), and a compensation weight (105, 106) mounted asymmetrically on the drive shaft (101) in a manner to at least partially compensate an unbalanced mass of the sample handling device (100) during the motion.
摘要翻译: 一种用于处理样品的样品处理装置(100),所述样品处理装置(100)包括可由驱动单元(102)驱动的驱动轴(101),安装成跟随驱动器的运动的基板(103) 轴(101)由驱动单元(102)驱动时,其中基板(103)构造成接收可安装成跟随基板(103)的运动的样品载体块(104),以及补偿重量 (105,106),其以在运动期间至少部分地补偿样品处理装置(100)的不平衡质量的方式不对称地安装在驱动轴(101)上。
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