Invention Grant
- Patent Title: Method of introducing a structure in a substrate
- Patent Title (中): 在衬底中引入结构的方法
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Application No.: US13132436Application Date: 2009-12-02
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Publication No.: US09427885B2Publication Date: 2016-08-30
- Inventor: Christian Schmidt , Leander Dittmann , Enrico Stura
- Applicant: Christian Schmidt , Leander Dittmann , Enrico Stura
- Applicant Address: CH Lausanne
- Assignee: picoDrill SA
- Current Assignee: picoDrill SA
- Current Assignee Address: CH Lausanne
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/EP2009/008598 WO 20091202
- International Announcement: WO2010/063462 WO 20100610
- Main IPC: H01L21/326
- IPC: H01L21/326 ; B26F1/28 ; B26D7/10 ; B23K26/38 ; B23K26/00
Abstract:
This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.
Public/Granted literature
- US20110278648A1 METHOD OF INTRODUCING A STRUCTURE IN A SUBSTRATE Public/Granted day:2011-11-17
Information query
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