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    Light emitting diode package
    2.
    发明申请
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US20080013319A1

    公开(公告)日：2008-01-17

    申请号：US11635046

    申请日：2006-12-07

    申请人： Chien-Chang Pei ,  Shih-Jen Chuang

    发明人： Chien-Chang Pei ,  Shih-Jen Chuang

    IPC分类号： F21V29/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2924/0002 ,  H05K3/3442 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting diode package is disclosed. It includes a chip, a slug, a PCB, a lens and a reflector. The chip is mounted on the slug. The slug transmits the heat of the chip out of the light emitting diode package. The PCB connects the chip with circuits or wires. The lens transmits the emitting light of the chip out of the light emitting diode package. The reflector reflects the emitting light of the chip, and combines the slug, the PCB and the lens together.

    摘要翻译： 公开了一种发光二极管封装。 它包括芯片，芯片，PCB，透镜和反射器。 芯片安装在芯片上。 芯片将芯片的热量传送出发光二极管封装。 PCB将芯片与电路或电线连接。 透镜将芯片的发光发射出发光二极管封装。 反射器反射芯片的发光，并将芯片，PCB和透镜组合在一起。

    Light tube
    3.
    发明授权
    Light tube 失效
    灯管

    公开(公告)号：US08556454B2

    公开(公告)日：2013-10-15

    申请号：US12611934

    申请日：2009-11-04

    申请人： Chien-Chang Pei ,  Yi-Hung Chen

    发明人： Chien-Chang Pei ,  Yi-Hung Chen

    IPC分类号： F21S6/00

    CPC分类号： F21V23/02 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10

    摘要： A light tube including a heat sink, a light transmissive cover disposed on the heat sink, and at least one light source module is provided. A containing space is formed between the heat sink and the light transmissive cover. The light source module includes a carrier, a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of non-light-emitting passive devices. The carrier is disposed on the heat sink. The first light-emitting devices are arranged on the carrier along a first straight reference line to form a first line of light-emitting devices. The second emitting devices are arranged on the carrier along a second straight reference line to form a second line of light-emitting devices. The non-light-emitting passive devices are disposed on the carrier and between the first and second lines of light-emitting devices and electrically connected to the first and the second light-emitting devices.

    摘要翻译： 提供了包括散热器，设置在散热器上的透光盖和至少一个光源模块的灯管。 在散热器和透光罩之间形成容纳空间。 光源模块包括载体，多个第一发光器件，多个第二发光器件和多个非发光无源器件。 载体设置在散热器上。 第一发光器件沿着第一直线参考线布置在载体上以形成第一行发光器件。 第二发光器件沿着第二直线参考线布置在载体上以形成第二行发光器件。 非发光无源器件设置在载体上并且位于第一和第二线发光器件之间并电连接到第一和第二发光器件。

    Light-Emitting Diode Packaging Structure and Module and Assembling Method Thereof
    4.
    发明申请
    Light-Emitting Diode Packaging Structure and Module and Assembling Method Thereof 有权
    发光二极管封装结构及模块及其组装方法

    公开(公告)号：US20110254025A1

    公开(公告)日：2011-10-20

    申请号：US13149309

    申请日：2011-05-31

    申请人： Sheng-Jia Sheu ,  Chien-Chang Pei

    发明人： Sheng-Jia Sheu ,  Chien-Chang Pei

    IPC分类号： H01L27/15 ,  H01L33/62

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.

    摘要翻译： 发光二极管封装结构包括发光二极管和安装有发光二极管的第一和第二金属板。 发光二极管包括第一和第二电极引线，第二电极引线在第二电极引线的外边缘上具有第一和第二接触表面。 第一金属板包括夹持并固定第一金属板上的第一电极引线的至少一个夹持部分。 第二金属板至少包括第一和第二夹紧部分。 第二电极引线的第一接触表面接触第一夹持部分，第二电极引线的第二接触表面接触第二夹紧部分，使得发光二极管至少在两个维度上固定在第二金属板上 平行于其上安装有发光二极管的第二金属板的主表面。

    Connector and Light Source Apparatus
    6.
    发明申请
    Connector and Light Source Apparatus 有权
    连接器和光源设备

    公开(公告)号：US20110097944A1

    公开(公告)日：2011-04-28

    申请号：US12984819

    申请日：2011-01-05

    申请人： Chien-Chang Pei ,  Yi-Hung Chen ,  Feng-Ting Hsu

    发明人： Chien-Chang Pei ,  Yi-Hung Chen ,  Feng-Ting Hsu

    IPC分类号： H01R33/09

    CPC分类号： H01R4/06 ,  F21K9/272 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/724 ,  H01R13/04 ,  H01R13/7175 ,  H01R33/06 ,  H01R33/0854 ,  H01R33/942

    摘要： A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided.

    摘要翻译： 提供了适于布置在载体上并且电连接到载体的连接器。 连接器包括绝缘基座和两个电极。 绝缘基底具有第一侧表面，第二侧表面，底表面和两个通孔。 底面连接第一和第二侧表面。 通孔从第一侧表面延伸到第二侧表面。 电极分别穿透通孔。 每个电极具有杆部分和从杆部分延伸的弯曲部分。 杆部分位于相应的通孔中，并从第一侧面突出。 弯曲部分在第二侧表面上延伸并且朝向托架延伸。 弯曲部分的端部穿过载体并与载体电连接。 还提供了光源装置。

    Light emitting diode back light module
    8.
    发明授权
    Light emitting diode back light module 失效
    发光二极管背光模块

    公开(公告)号：US08021032B2

    公开(公告)日：2011-09-20

    申请号：US11890722

    申请日：2007-08-07

    申请人： Chien-Chang Pei

    发明人： Chien-Chang Pei

    IPC分类号： F21V7/04 ,  G02F1/1333 ,  G02F1/1335

    CPC分类号： H05K3/0061 ,  F21K9/00 ,  F21V19/003 ,  F21V29/503 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02F2001/133628 ,  H05K2201/10106 ,  H05K2201/10393

    摘要： An LED back light module includes a metal support, a thermal conductive material, a circuit board and at least one light emitting diode. The metal support has a recess and a plurality of holes. The thermal conductive material has a first surface in contact with a bottom of the recess. The circuit board is disposed on a second surface of the thermal conductive material, in which the circuit board has a plurality of flanges lodged into the holes of the metal support for compacting the circuit board, the thermal conductive material and the metal support. The light emitting diode is disposed on the circuit board, in which the thermal energy generated by the light emitting diode is delivered to the metal support through the circuit board and the thermal conductive material.

    摘要翻译： LED背光模块包括金属支架，导热材料，电路板和至少一个发光二极管。 金属支撑件具有凹部和多个孔。 导热材料具有与凹部的底部接触的第一表面。 所述电路板设置在所述导热材料的第二表面上，其中所述电路板具有多个凸缘，所述多个凸缘嵌入所述金属支撑件的孔中，用于压缩所述电路板，所述导热材料和所述金属支撑。 发光二极管设置在电路板上，其中由发光二极管产生的热能通过电路板和导热材料传送到金属支架。

    Structure of light emitting diode and method to assemble thereof
    9.
    发明授权
    Structure of light emitting diode and method to assemble thereof 有权
    发光二极管的结构及其组装方法

    公开(公告)号：US07960740B2

    公开(公告)日：2011-06-14

    申请号：US12012379

    申请日：2008-02-01

    申请人： Sheng-Jia Sheu ,  Chien-Chang Pei

    发明人： Sheng-Jia Sheu ,  Chien-Chang Pei

    IPC分类号： H01L33/00

    CPC分类号： H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

    摘要： A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.

    摘要翻译： 提供发光二极管的结构。 发光二极管包括发光二极管管芯; 电子地分别连接到发光二极管管芯的阴极和阳极的两个导电框架和两个基板。 每个导电框架具有固定孔，并且每个基板具有突出支柱。 固定孔的上部开口比底部开口宽。 突出柱插入到固定孔中，突出柱的形状变形以与固定孔嵌合。

    LIGHT EMITTING DIODE
    10.
    发明申请
    LIGHT EMITTING DIODE 失效
    发光二极管

    公开(公告)号：US20110031524A1

    公开(公告)日：2011-02-10

    申请号：US12606051

    申请日：2009-10-26

    申请人： Chien-Chang Pei

    发明人： Chien-Chang Pei

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00

    摘要： The invention provides a light emitting diode. The light emitting diode includes a ceramic substrate having a first surface and an opposite second surface. A first conductive trace metal layer and a second conductive trace metal layer are disposed on the first surface of the ceramic substrate. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate, respectively and electrically connected to the first and second conductive trace metal layers. A plurality of thermal metal pads is disposed on the second surface of the ceramic substrate, wherein the thermal metal pads are electrically isolated from the light emitting diode chip.

    摘要翻译： 本发明提供一种发光二极管。 发光二极管包括具有第一表面和相对的第二表面的陶瓷基板。 第一导电迹线金属层和第二导电迹线金属层设置在陶瓷基板的第一表面上。 至少一个发光二极管芯片分别设置在陶瓷基板的第一表面上并电连接到第一和第二导电迹线金属层。 多个热金属焊盘设置在陶瓷衬底的第二表面上，其中热金属焊盘与发光二极管芯片电隔离。