发明申请
- 专利标题： Light-Emitting Diode Packaging Structure and Module and Assembling Method Thereof
- 专利标题（中）： 发光二极管封装结构及模块及其组装方法
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申请号： US13149309申请日： 2011-05-31
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公开(公告)号： US20110254025A1公开(公告)日： 2011-10-20
- 发明人: Sheng-Jia Sheu , Chien-Chang Pei
- 申请人： Sheng-Jia Sheu , Chien-Chang Pei
- 申请人地址： TW New Taipei City CN Shanghai
- 专利权人： EVERLIGHT ELECTRONICS CO., LTD.,EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD.
- 当前专利权人： EVERLIGHT ELECTRONICS CO., LTD.,EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD.
- 当前专利权人地址： TW New Taipei City CN Shanghai
- 优先权： TW096222647 20071231
- 主分类号： H01L27/15
- IPC分类号： H01L27/15 ; H01L33/62
摘要：
A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.
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