发明授权
- 专利标题： Structure of light emitting diode and method to assemble thereof
- 专利标题（中）： 发光二极管的结构及其组装方法
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申请号： US12012379申请日： 2008-02-01
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公开(公告)号： US07960740B2公开(公告)日： 2011-06-14
- 发明人: Sheng-Jia Sheu , Chien-Chang Pei
- 申请人： Sheng-Jia Sheu , Chien-Chang Pei
- 申请人地址： TW Tu Chen, Taipei Hsien
- 专利权人： Everlight Electronics Co., Ltd.
- 当前专利权人： Everlight Electronics Co., Ltd.
- 当前专利权人地址： TW Tu Chen, Taipei Hsien
- 代理机构： Moser IP Law Group
- 优先权： TW96106508A 20070226
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.
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