公开(公告)号：US08952526B2

公开(公告)日：2015-02-10

申请号：US13287374

申请日：2011-11-02

申请人： Charles W. C. Lin ,  Chia-Chung Wang

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L23/34 ,  H01L23/31 ,  H01L21/56 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H05K1/02 ,  H05K1/18

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0207 ,  H05K1/186 ,  H01L2224/13099 ,  H01L2924/00

摘要： A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a plated through-hole, first build-up circuitry and second build-up circuitry. The heat spreader includes a bump and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the first build-up circuitry and thermally connected to the bump. The bump extends into an opening in the adhesive and the flange extends laterally from the bump at the cavity entrance. The first build-up circuitry and the second build-up circuitry extend beyond the semiconductor device in opposite vertical directions. The plated through-hole extends through the adhesive and provides signal routing between the first build-up circuitry and the second build-up circuitry. The heat spreader provides heat dissipation for the semiconductor device.

摘要翻译： 可堆叠半导体组件包括半导体器件，散热器，粘合剂，电镀通孔，第一堆积电路和第二堆积电路。 散热器包括凸块和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到第一积聚电路并热连接到凸块。 凸块延伸到粘合剂中的开口中，并且凸缘从空腔入口处的凸起横向延伸。 第一积聚电路和第二堆积电路在相反的垂直方向上延伸超出半导体器件。 电镀通孔延伸穿过粘合剂并且在第一聚集电路和第二聚集电路之间提供信号路由。 散热器为半导体器件提供散热。

公开(公告)号：US08525214B2

公开(公告)日：2013-09-03

申请号：US13111966

申请日：2011-05-20

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

IPC分类号： H01L33/00 ,  H01L23/367 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace, an adhesive and a support layer. The heat spreader includes a post, a base, an underlayer and a thermal via. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post, the support layer is sandwiched between the base and the underlayer and the thermal via extends from the base through the support layer to the underlayer. The conductive trace provides signal routing between the pad and the terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线，粘合剂和支撑层。 散热器包括柱，基座，​​底层和热通孔。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 柱从基部向上延伸到粘合剂中的开口中，基部从柱延伸，支撑层夹在基部和底层之间，并且热通孔从基部延伸穿过支撑层到底层。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US08324653B1

公开(公告)日：2012-12-04

申请号：US12848176

申请日：2010-08-01

申请人： Charles W. C. Lin ,  Chia-Chung Wang

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L33/00

CPC分类号： H01L23/36 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an insulative material. The heat spreader includes a base and a ceramic block. The conductive trace provides signal routing between a pad and a terminal. The insulative material extends between the base and the terminal. The ceramic block is embedded in the base. The semiconductor device overlaps the ceramic block, is electrically connected to the conductive trace and is thermally connected to the heat spreader.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和绝缘材料。 散热器包括基座和陶瓷块。 导电迹线提供焊盘和端子之间的信号路由。 绝缘材料在基座和端子之间延伸。 陶瓷块嵌入底座。 半导体器件与陶瓷块重叠，电连接到导电迹线并与散热器热连接。

公开(公告)号：US08310043B2

公开(公告)日：2012-11-13

申请号：US12975429

申请日：2010-12-22

申请人： Charles W. C. Lin ,  Chia-Chung Wang

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L23/60 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L33/483 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/0104 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base, an ESD protection layer and an underlayer. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace, electrically isolated from the underlayer and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ESD protection layer is sandwiched between the base and the underlayer. The conductive trace provides signal routing between the pad and the terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括支柱，基座，​​ESD保护层和底层。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线，与底层电隔离并热连接到散热器。 柱从基部向上延伸到粘合剂中的开口中，基部从柱延伸，并且ESD保护层夹在基部和底层之间。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US08304292B1

公开(公告)日：2012-11-06

申请号：US12849018

申请日：2010-08-03

申请人： Charles W. C. Lin ,  Chia-Chung Wang

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/58

CPC分类号： H01L23/36 ,  H01L23/142 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method of making a semiconductor chip assembly includes providing a metal plate, providing a ceramic block in the metal plate, providing an insulative material in the metal plate, wherein the metal plate includes a base and a terminal, then providing a conductive layer on the base and the ceramic block, providing a conductive trace that includes a pad, the terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the ceramic block, wherein a heat spreader includes the base and the ceramic block, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 制造半导体芯片组件的方法包括提供金属板，在金属板中提供陶瓷块，在金属板中提供绝缘材料，其中金属板包括基座和端子，然后在导体层上提供导电层 基底和陶瓷块，提供导电迹线，其包括衬垫，端子和导电层的选定部分，然后将半导体器件安装在陶瓷块上，其中散热器包括基座和陶瓷块，电连接 半导体器件到导电迹线并将半导体器件热连接到散热器上。

公开(公告)号：US08288792B2

公开(公告)日：2012-10-16

申请号：US12987166

申请日：2011-01-10

申请人： Charles W. C. Lin ,  Chia-Chung Wang

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L33/00 ,  H01L23/367 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 散热器包括第一柱，第二柱和基部。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 第一柱从第一垂直方向的基部延伸到第一粘合剂中的第一开口中，第二柱从第二垂直方向的基部延伸到第二粘合剂中的第二开口中，并且基部夹在两侧之间并且横向延伸 从帖子。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US08236619B2

公开(公告)日：2012-08-07

申请号：US13092913

申请日：2011-04-23

申请人： Charles W. C. Lin ,  Chia-Chung Wang

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L21/00

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/15174 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/06 ,  H05K2201/09054 ,  H05K2201/09509 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/00012

摘要： A method of making a semiconductor chip assembly includes providing a post and a base, mounting a second adhesive on the base, mounting a substrate with a conductive pattern on the second adhesive, mounting a first adhesive on the substrate and mounting a conductive layer on the first adhesive, then flowing the first adhesive upward between the post and the conductive layer and flowing the second adhesive upward between the post and the substrate, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal, the conductive pattern, first and second vias and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 一种制造半导体芯片组件的方法包括提供柱和基座，将第二粘合剂安装在基座上，将具有导电图案的基板安装在第二粘合剂上，将第一粘合剂安装在基板上并将导电层安装在 第一粘合剂，然后使第一粘合剂在柱和导电层之间向上流动并使第二粘合剂在柱和基底之间向上流动，固化粘合剂，然后提供包括垫，端子，导电图案的导电迹线， 第一和第二通孔和导电层的选定部分，将半导体器件安装在柱上，其中散热器包括柱和基座，将半导体器件电连接到导电迹线并将半导体器件热连接到热 吊具

公开(公告)号：US08232576B1

公开(公告)日：2012-07-31

申请号：US12848175

申请日：2010-08-01

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC分类号： H01L33/00 ,  H01L23/34

CPC分类号： H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/29144 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H01L2924/0105 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a ceramic block. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ceramic block is embedded in the post. The semiconductor device overlaps the ceramic block, is electrically connected to the conductive trace and is thermally connected to the ceramic block. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括柱，基座和陶瓷块。 柱从基部向上延伸到粘合剂中的开口中，基部从柱侧向延伸，并且陶瓷块嵌入柱中。 半导体器件与陶瓷块重叠，电连接到导电迹线并且热连接到陶瓷块。 粘合剂在柱和导电迹线之间以及基部和导电迹线之间延伸。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US08203167B2

公开(公告)日：2012-06-19

申请号：US12833945

申请日：2010-07-10

申请人： Charles W. C. Lin ,  Chia-Chung Wang

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L33/62 ,  H01L23/36 ,  H01L23/48 ,  H01L33/64

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive. The adhesive extends above the base and between the base and the terminal.

摘要翻译： 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 半导体器件电连接到导电迹线并热连接到散热器。 散热器包括热柱和基座。 热柱从基部向上延伸到粘合剂中的第一开口中，并且基部从热柱横向延伸。 导电迹线包括垫，端子和信号柱。 信号柱从端子向上延伸到粘合剂中的第二开口中。 粘合剂在基底之上以及基部和端子之间延伸。

公开(公告)号：US08178395B2

公开(公告)日：2012-05-15

申请号：US13113051

申请日：2011-05-22

申请人： Charles W. C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

发明人： Charles W. C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

IPC分类号： H01L21/60

CPC分类号： H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the underlayer and a thermal via that extends from the base through the support layer to the underlayer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

摘要翻译： 一种制造半导体芯片组件的方法包括提供柱，基底，支撑层和底层，其中柱延伸到基底之上，并且支撑层夹在基底和底层之间，将粘合剂安装在基底上，包括 将所述柱插入所述粘合剂的开口中，将导电层安装在所述粘合剂上，包括使所述柱与所述导电层中的孔对准，然后使所述粘合剂在所述柱和所述导电层之间向上流动，使所述粘合剂固化， 轨迹，其包括衬垫，端子和导电层的选定部分，提供包括柱，基底，底层的散热器和从基底穿过支撑层延伸到底层的热通孔，然后安装 在该柱上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到第二半导体器件 e散热器。