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    REAL-TIME MODIFICATION OF LINE FOCUS INTENSITY DISTRIBUTION
    1.
    发明申请
    REAL-TIME MODIFICATION OF LINE FOCUS INTENSITY DISTRIBUTION 有权

    公开(公告)号：US20220326539A1

    公开(公告)日：2022-10-13

    申请号：US17708027

    申请日：2022-03-30

    Applicant: CORNING INCORPORATED

    Inventor： Reinhard Moritz Malchus ,  Tobias Christian Roeder

    IPC: G02B27/28 ,  G02F1/33 ,  B23K26/064 ,  B23K26/38 ,  C03B33/02 ,  C03C23/00

    Abstract: Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.

    METHODS FOR LASER CUTTING GLASS SUBSTRATES THROUGH NARROW APERTURES
    2.
    发明申请
    METHODS FOR LASER CUTTING GLASS SUBSTRATES THROUGH NARROW APERTURES 有权

    公开(公告)号：US20230132480A1

    公开(公告)日：2023-05-04

    申请号：US17976184

    申请日：2022-10-28

    Applicant: CORNING INCORPORATED

    Inventor： Reinhard Moritz Malchus ,  Lauren Leigh Taylor ,  Craig John Mancusi Ungaro

    IPC: B23K26/53 ,  B23K26/0622 ,  B23K26/073 ,  B23K26/06

    Abstract: The present invention relates to a method of laser processing a glass substrate, the method comprising: focusing a pulsed laser beam into a laser beam focal line into the glass substrate, the glass substrate having a feature formed on a first surface of the glass substrate, wherein a first portion of the laser beam focal line is focused at the first surface of the glass substrate and a second portion of the laser beam focal line is focused at a second surface of the glass substrate that is opposite the first surface, wherein a first set of rays exiting the optical arrangement at a first radius R1, as measured from a center of the optical arrangement forms the first portion of the laser beam focal line with a deflection angle of θ1, wherein a second set of rays exiting the optical arrangement at a second radius R2, as measured from the center of the optical arrangement forms the second portion of the laser beam focal line with a deflection angle of θ2, wherein R1 is less than R2; and wherein θ1 is greater than θ2, and wherein θ1 decreases to θ2 from R1 to R2 in one of a step-wise decrease or a graded decrease; and translating the glass substrate and the laser beam relative to each other along a first contour, thereby laser forming a plurality of defect lines along the first contour within the substrate.

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