公开(公告)号：US20240174544A1

公开(公告)日：2024-05-30

申请号：US18505578

申请日：2023-11-09

Applicant: CORNING INCORPORATED

Inventor： Florian Franz Aigner ,  Justyna Teresa Grabowska-Petzel ,  Reinhard Moritz Malchus ,  Pavel Pashchenko

IPC: C03B33/033 ,  B23K26/382 ,  B23K26/402 ,  C03B33/02

CPC classification number: C03B33/033 ,  B23K26/382 ,  B23K26/402 ,  C03B33/0222 ,  B23K2103/54

Abstract: The disclosure relates to a method of laser processing a glass material, including: forming a plurality of perforations within the glass material along a cutting line, wherein the material comprises a first surface and a second surface opposing the first surface, wherein the perforation extends through a thickness of the material from the first surface to the second surface, and wherein a first crack is formed between adjacent perforations; applying water to the cutting line; and applying one of chemical or mechanical energy to the glass material at the cutting line to separate the material.