公开(公告)号：US20240116140A1

公开(公告)日：2024-04-11

申请号：US18374068

申请日：2023-09-28

Applicant: CORNING INCORPORATED

Inventor： Sterling Michael Clarke ,  Reinhard Moritz Malchus ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Sergio Tsuda

IPC: B23K26/53 ,  B23K26/40

CPC classification number: B23K26/53 ,  B23K26/40 ,  B23K2103/54

Abstract: A method of processing a transparent workpiece comprises directing a defect-forming laser beam to an impingement surface of a transparent workpiece, the defect-forming laser beam having a numerical aperture from 0.10 to 0.25, the transparent workpiece having a textured surface, the textured surface having an Ra value of greater than or equal to 0.5 μm.