公开(公告)号：US11449106B1

公开(公告)日：2022-09-20

申请号：US16521706

申请日：2019-07-25

Applicant: CORNING INCORPORATED

Inventor： Colin Brendan Daly ,  Geraint Owen ,  Dean Michael Thelen

IPC: G06F7/00 ,  G06F1/16 ,  H02J7/02 ,  H02J50/10 ,  H02J7/00 ,  H04B1/3883 ,  H04M1/02 ,  H01F38/14

Abstract: A cellular phone or tablet computer device includes a front face having a display screen, a back cover opposite the front face, and componentry between the front face and back cover. The back cover is metallic and includes pieces of metal separated from one another by electrical insulation.

公开(公告)号：US20210068249A1

公开(公告)日：2021-03-04

申请号：US17004502

申请日：2020-08-27

Applicant: Corning Incorporated

Inventor： William Peter Addiego ,  Heather Debra Boek ,  Jennifer Anella Heine ,  Kenneth Edward Hrdina ,  Dayue Jiang ,  Geraint Owen ,  Paul George Rickerl ,  Tora Ann-Beatrice Eline SIrkka ,  WIlliam Richard Trutna

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/00

Abstract: A PCB laminate material includes at least one polymer layer and at least one inorganic layer, such that the PCB laminate material has a dielectric loss tangent of less than 6×10−3 at 10 GHz (or higher frequency). The inorganic layer or layers of the PCB laminate material may comprise silica-based materials (including silica fabrics), low-loss glass with a dielectric loss tangent of about 0.006 at 10 GHz (or higher frequency), glass-ceramics, or ceramic materials (e.g., alumina). PCB laminate materials may also include at least one fluoropolymer layer. PCB laminate materials described herein combine good dielectric performance (i.e., low dielectric loss), dimensional stability at elevated temperature (e.g., at 260° C. for 30 seconds), and sufficient mechanical strength to permit handling during production. Printed circuit boards comprising the PCB laminate materials and methods for making the same are also disclosed herein.

公开(公告)号：US20240179837A1

公开(公告)日：2024-05-30

申请号：US18519656

申请日：2023-11-27

Applicant: CORNING INCORPORATED

Inventor： Joseph Edward McCarthy ,  Geraint Owen ,  Soumyadyuti Samai ,  Meiyu Zhai

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0296

Abstract: A printed circuit board (PCB) composite material includes a polymer layer and a fiber layer encapsulated within the polymer layer. The fiber layer includes a first monolayer of continuous silica fibers longitudinally co-aligned in a first direction. Each continuous silica fiber in the first monolayer extends without discontinuity through the polymer layer such that opposed ends of each continuous silica fiber are adjacent to a perimeter of the polymer layer. The PCB composite material has a dielectric loss tangent of less than or equal to about 0.0015 at 15 GHz or higher frequency. A printed circuit board (PCB) includes the PCB composite material and at least one conductive layer disposed on a side of the PCB composite material.

公开(公告)号：US20220174814A1

公开(公告)日：2022-06-02

申请号：US17437240

申请日：2020-03-02

Applicant: Corning Incorporated

Inventor： Dayue Jiang ,  Geraint Owen

IPC: H05K1/03 ,  C08K3/36 ,  C08L27/18 ,  B29C43/10 ,  C08L25/06

Abstract: A composite includes at least one thermoplastic polymer; and at least one PTFE-based polymer, such that the composite has a dielectric loss tangent of less than 10−3. Moreover, a method for preparing a composite includes mixing at least one thermoplastic polymer with at least one PTFE-based polymer to form a homogenous mixture; melting the mixture to form a composite material; and hot pressing the composite material to form a composite sheet.