公开(公告)号：US20240179837A1

公开(公告)日：2024-05-30

申请号：US18519656

申请日：2023-11-27

Applicant: CORNING INCORPORATED

Inventor： Joseph Edward McCarthy ,  Geraint Owen ,  Soumyadyuti Samai ,  Meiyu Zhai

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0296

Abstract: A printed circuit board (PCB) composite material includes a polymer layer and a fiber layer encapsulated within the polymer layer. The fiber layer includes a first monolayer of continuous silica fibers longitudinally co-aligned in a first direction. Each continuous silica fiber in the first monolayer extends without discontinuity through the polymer layer such that opposed ends of each continuous silica fiber are adjacent to a perimeter of the polymer layer. The PCB composite material has a dielectric loss tangent of less than or equal to about 0.0015 at 15 GHz or higher frequency. A printed circuit board (PCB) includes the PCB composite material and at least one conductive layer disposed on a side of the PCB composite material.