摘要:
A sealing method for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device (e.g., a hermetically sealed OLED device) are described herein. The sealing method includes the steps of: (1) cooling an un-encapsulated device; (2) depositing a sealing material over at least a portion of the cooled device to form an encapsulated device; and (3) heat treating the encapsulated device to form a hermetically sealed device. In one embodiment, the sealing material is a low liquidus temperature inorganic (LLT) material such as, for example, tin-fluorophosphate glass, tungsten-doped tin fluorophosphate glass, chalcogenide glass, tellurite glass, borate glass and phosphate glass. In another embodiment, the sealing material is a Sn2+-containing inorganic oxide material such as, for example, SnO, SnO+P2O5 and SnO+BPO4.
摘要翻译:这里描述了用于减少密封装置所需的时间和所得的密封装置(例如,气密密封的OLED装置)的密封方法。 密封方法包括以下步骤:(1)冷却未封装的装置; (2)在冷却装置的至少一部分上沉积密封材料以形成封装装置; 和(3)对封装的装置进行热处理以形成密封装置。 在一个实施方案中,密封材料是低液相线温度无机(LLT)材料,例如锡 - 氟磷酸盐玻璃,掺杂钨的锡氟磷酸盐玻璃,硫族化物玻璃,碲酸盐玻璃,硼酸盐玻璃和磷酸盐玻璃。 在另一个实施方案中,密封材料是含Sn 2+的无机氧化物材料,例如SnO,SnO + P 2 O 5, SUB>和SnO + BPO 4 SUB>。
摘要:
The invention is directed to a method for determining metal fluoride crystals that are suitable for use in below 200 nm optical lithography by correlation of thermally stimulated current (TSC) measurements to fluence dependent transmission (FDT) measurements; and to metal fluoride crystals suitable for below 200 nm optical lithography, such crystals having a fluent dependent transmission slope that is linearly dependent on the thermally stimulated peak maximum. Crystals suitable for below 200 nm lithography can be determined by using the standard linear relationship between the TSC peak strengths and the FDT slopes without further more FDT measurements.