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公开(公告)号：US09988951B2
公开(公告)日：2018-06-05
申请号：US15104512
申请日：2014-12-16
发明人： Ingwar Hunsche , Christian Blecking , Ekkehard Kohler , Dirk Emde
IPC分类号： F01L3/08 , B22F5/10 , F01L3/02 , B22F3/11 , B22F3/26 , B22F7/06 , C22C33/02 , C22C38/00 , B22F3/03 , B23K20/12 , C22C38/04 , C22C38/20 , C22C38/60
CPC分类号： F01L3/08 , B22F3/03 , B22F3/11 , B22F3/26 , B22F5/10 , B22F5/106 , B22F7/062 , B22F2005/103 , B22F2301/35 , B22F2998/10 , B23K20/129 , C22C33/0278 , C22C38/00 , C22C38/008 , C22C38/04 , C22C38/20 , C22C38/60 , F01L3/02 , B22F3/02 , B22F3/10
摘要： The invention relates to a valve guide manufactured by a powder-metallurgical process for combustion engines, said guide comprising a central section, a cam-side end piece, and a duct-side end piece, wherein the central section consists of a first material and the duct-side end piece of a second material, with the second material having a hardness in excess of 70 HRB and the first material having a hardness that is by at least 10 HRB lower than that of the second material.
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公开(公告)号：US09702277B2
公开(公告)日：2017-07-11
申请号：US14410955
申请日：2013-07-03
发明人： Ekkehard Kohler , Dirk Emde , Anna Seyfarth , Thomas Lelgermann
IPC分类号： F01L3/22 , F01L3/08 , B22F3/16 , B22F1/00 , C22C38/16 , C22C38/04 , C22C38/60 , C22C38/52 , C22C38/44 , C22C38/46 , C22C38/42 , B22F7/00 , B22F7/02 , F01L3/02
CPC分类号： F01L3/08 , B22F1/0003 , B22F3/16 , B22F7/008 , B22F7/02 , C22C38/04 , C22C38/16 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/52 , C22C38/60 , F01L3/02 , F05C2201/046 , F05C2251/04
摘要： The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
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公开(公告)号：US10208636B2
公开(公告)日：2019-02-19
申请号：US15629373
申请日：2017-06-21
发明人： Ekkehard Kohler , Dirk Emde , Anna Seyfarth , Thomas Lelgermann
IPC分类号： F01L3/22 , F01L3/08 , B22F3/16 , B22F1/00 , C22C38/16 , C22C38/04 , C22C38/60 , C22C38/52 , C22C38/44 , C22C38/46 , C22C38/42 , B22F7/00 , B22F7/02 , F01L3/02
摘要： The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
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公开(公告)号：US11311936B2
公开(公告)日：2022-04-26
申请号：US16099615
申请日：2017-05-24
发明人： Ekkehard Kohler , Dirk Emde , Ingwar Hunsche , Robert Hammelmann , Christian Blecking , Anna Seyfarth
IPC分类号： B22F5/10 , B22F7/02 , B22F7/06 , C22C1/05 , C22C9/00 , F01L3/04 , F01L3/08 , F16K25/00 , C22C32/00 , F01L3/02
摘要： The invention relates to a highly heat conductive valve seat ring (1) comprising a carrier layer (2) and a functional layer (3), wherein the carrier layer (2) consists of a solidified copper matrix containing 0.10 to 20% w/w of a solidifying component and the functional layer (3) consists of a solidified copper matrix which further contains, based on the copper matrix, 5 to 35% w/w of one or more hard phases.
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公开(公告)号：US20190143415A1
公开(公告)日：2019-05-16
申请号：US16099615
申请日：2017-05-24
发明人： Ekkehard Kohler , Dirk Emde , Ingwar Hunsche , Robert Hammelmann , Christian Blecking , Anna Seyfarth
IPC分类号： B22F5/10 , B22F7/02 , B22F7/06 , C22C1/05 , C22C9/00 , C22C32/00 , F01L3/04 , F01L3/08 , F16K25/00
摘要： The invention relates to a highly heat conductive valve seat ring (1) comprising a carrier layer (2) and a functional layer (3), wherein the carrier layer (2) consists of a solidified copper matrix containing 0.10 to 20% w/w of a solidifying component s and the functional layer (3) consists of a solidified copper matrix which further contains, based on the copper matrix, 5 to 35% w/w of one or more hard phases.
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公开(公告)号：US20170298790A1
公开(公告)日：2017-10-19
申请号：US15629373
申请日：2017-06-21
发明人： Ekkehard Kohler , Dirk Emde , Anna Seyfarth , Thomas Lelgermann
IPC分类号： F01L3/08 , B22F3/16 , F01L3/02 , C22C38/60 , C22C38/52 , B22F7/00 , B22F1/00 , C22C38/42 , C22C38/16 , C22C38/04 , B22F7/02 , C22C38/44 , C22C38/46
CPC分类号： F01L3/08 , B22F1/0003 , B22F3/16 , B22F7/008 , B22F7/02 , C22C38/04 , C22C38/16 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/52 , C22C38/60 , F01L3/02 , F05C2201/046 , F05C2251/04
摘要： The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
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公开(公告)号：US20150322828A1
公开(公告)日：2015-11-12
申请号：US14410955
申请日：2013-07-03
发明人： Ekkehard Kohler , Dirk Emde , Anna Seyfarth , Thomas Lelgemann
IPC分类号： F01L3/08 , B22F1/00 , C22C38/16 , C22C38/04 , B22F7/02 , C22C38/52 , C22C38/44 , C22C38/46 , C22C38/42 , B22F7/00 , B22F3/16 , C22C38/60
CPC分类号： F01L3/08 , B22F1/0003 , B22F3/16 , B22F7/008 , B22F7/02 , C22C38/04 , C22C38/16 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/52 , C22C38/60 , F01L3/02 , F05C2201/046 , F05C2251/04
摘要： The invention relates to a powdermetallurgically produced valve seat ring having a carrier layer and a function layer. It is the objective of the invention to provide a valve seat ring of the kind mentioned above that offers significantly higher thermal conductivity properties. To achieve this objective and based on a valve seat ring of the kind first mentioned above the invention proposes that the carrier material of the carrier layer has a thermal conductivity higher than 55 W/m*K at a total copper content ranging between >25 and 40% w/w.
摘要翻译： 本发明涉及一种具有载体层和功能层的粉末冶金制造的阀座环。 本发明的目的是提供上述类型的提供显着更高导热性能的阀座圈。 为达到上述目的，本发明提出一种基于上述阀座环的本发明，载体层的载体材料的热导率高于55 W / m * K，总铜含量介于> 25〜 40％w / w。
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